G. Schindler

发表

Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller

W. Steinhögl, G. Schindler, G. Steinlesberger, 2005 .

Size-dependent resistivity of metallic wires in the mesoscopic range

W. Steinhögl, G. Schindler, G. Steinlesberger, 2002 .

Impact of line edge roughness on the resistivity of nanometer-scale interconnects

Manfred Engelhardt, Gernot Steinlesberger, Günther Schindler, 2004 .

SrBi2Ta2O9 ferroelectric thin film capacitors: degradation in a hydrogen ambient

R. Waser, H. Schroeder, C. Dehm, 2003 .

Domain structure of (100) strontium bismuth tantalate (SBT) SrBi2Ta2O9 films

C. Dehm, G. Schindler, F. Koch, 2001 .

Reversible and Irreversible Contributions to the Polarization in SrBi 2 Ta 2 O 9 Ferroelectric Capacitors

R. Waser, M. Grossmann, G. Schindler, 1997 .

Influence of the measurement parameters on the reliability of ferroelectric thin films

R. Waser, S. Tiedke, M. Kastner, 2001 .

The role of rapid thermal processing in crsystallization of SBT thin films

C. Dehm, C. Mazure, V. Joshi, 1998 .

Influence of the morphology of ferroelectric SrBi2Ta2O9 thin films deposited by metal organic decomposition on its electrical characteristics

R. Waser, C. Dehm, T. Mikolajick, 2005 .

Kinetic of phase transformation of SrBi2Ta2O9 deposited by metalorganic decomposition on platinum electrodes

R. Waser, C. Dehm, T. Mikolajick, 2002 .

Thickness dependent morphology and electrical characteristics of SrBi2Ta2O9 deposited by metal organic decomposition

R. Waser, C. Dehm, M. Kastner, 2001 .

Review of SrBi2Ta2O9 thin films capacitor processing

R. Bergmann, C. Dehm, M. Kastner, 1999 .

Role of recovery anneals for chemical solution deposition (CSD) based SrBi2Ta2O9 (SBT) thin films

C. Dehm, C. Mazure, N. Nagel, 1998 .

Origin of Imprint in Ferroelectric CSD SrBi 2 Ta 2 O 9 Thin Films

R. Waser, C. Dehm, M. Grossmann, 1998 .

Influence of Ti-content in the bottom electrodes on the ferroelectric properties of SrBi2Ta2O9 (SBT)

C. Mazure, V. Joshi, G. Schindler, 1997 .

Imprint in ferroelectric SrBi2Ta2O9 capacitors for non-volatile memory applications

R. Waser, C. Dehm, M. Grossmann, 1998 .

Influence of dry etching using argon on structural and electrical properties of crystalline and non-crystalline SrBi2Ta2O9 thin films

R. Waser, H. Schroeder, C. Dehm, 1999 .

Lifetime estimation due to imprint failure in ferroelectric SrBi2Ta2O9 thin films

Rainer Waser, Walter Hartner, M. Grossmann, 2000 .

Low temperature process and thin SBT films for ferroelectric memory devices

Rainer Waser, Walter Hartner, Thomas Mikolajick, 2000 .

Damascene and subtractive processing of narrow tungsten lines: Resistivity and size effect

G. Schindler, M. Traving, M. Engelhardt, 2006 .

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Klaus Wetzig, Horst Wendrock, Siegfried Menzel, 2005 .

Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes

Manfred Engelhardt, G. Steinlesberger, Emmerich Bertagnolli, 2002 .

Tungsten interconnects in the nano-scale regime

Manfred Engelhardt, Gernot Steinlesberger, G. Scheinbacher, 2005 .

Scanning probe microscopy — a tool for the investigation of high-k materials

C. Dehm, C. Mazure, G. Schindler, 2000 .

Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects

W. Steinhögl, G. Schindler, M. Traving, 2005 .

Investigation of nano interconnects for an early experimental assessment of future interconnect challenges

G. Schindler, G. Steinlesberger, M. Traving, 2004, 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866).

Electrical characterization of copper interconnects with end-of-roadmap feature sizes

Manfred Engelhardt, Gernot Steinlesberger, Günther Schindler, 2003 .

Challenges of interconnection technology till the end of the roadmap and beyond

Manfred Engelhardt, G. Steinlesberger, Günther Schindler, 2002 .

Electrical Behavior of Nano-Scaled Interconnects

W. Steinhögl, G. Schindler, G. Steinlesberger, 2004 .

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Manfred Engelhardt, G. Steinlesberger, Emmerich Bertagnolli, 2003 .

Scaling laws for the resistivity increase of sub-100 nm interconnects

G. Schindler, G. Steinlesberger, G. Schindler, 2003, International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003..