V. Sukharev

发表

Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

V. Sukharev, 2014 .

Microstructure Effect on EM-Induced Degradations in Dual Inlaid Copper Interconnects

W. Nix, V. Sukharev, A. Kteyan, 2009, IEEE Transactions on Device and Materials Reliability.

Electromigration induced stress evolution under alternate current and pulse current loads

S. Tan, V. Sukharev, Xin Huang, 2015 .

Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation

A. V. Vairagar, P. Ho, G. Schneider, 2009, IEEE Transactions on Device and Materials Reliability.

Multiscale modeling of plasma etch processing

V. Sukharev, 2002 .

Physics-Based Models for EM and SM Simulation in Three-Dimensional IC Structures

V. Sukharev, A. Kteyan, E. Zschech, 2012, IEEE Transactions on Device and Materials Reliability.

Electromigration simulation and design considerations for integrated circuit power grids

F. Najm, V. Sukharev, 2020, Journal of Vacuum Science & Technology B.

Full-chip electromigration assessment: Effect of cross-layout temperature and thermal stress distributions

Hai-Bao Chen, S. Tan, V. Sukharev, 2015, 2015 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD).

Properties of Topological Measures on Classes of Subspaces of an Inner Product Space

V. Sukharev, E. Turilova, 2021, Proceedings of the Steklov Institute of Mathematics.

Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing

Sheldon X.-D. Tan, Taeyoung Kim, Valeriy Sukharev, 2017, Integr..

Simulation of ultra-low energy ion implantation from a remote plasma source using Monte Carlo techniques

H. Puchner, V. Sukharev, S. Aronowitz, 2000, 2000 International Conference on Ion Implantation Technology Proceedings. Ion Implantation Technology - 2000 (Cat. No.00EX432).

A Critical Review on Multiscale Material Database Requirement for Accurate Three-Dimensional IC Simulation Input

M. Gall, V. Sukharev, E. Zschech, 2012, IEEE Transactions on Device and Materials Reliability.

Hybrid Grain-Continuum Model for Thermo-Mechanical Stresses in Polycrystalline Cu 3D IC Vias

T. Cale, V. Sukharev, M. Bloomfield, 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.

3-D Physically-Based Electromigration Simulation in Copper - Low-K Interconnect

C. W. Park, V. Sukharev, R. K. Choudhury, 2004 .

A Dynamic Reliability Management Framework for Dark Silicon

Taeyoung Kim, S. Tan, V. Sukharev, 2016 .

Low‐k Material Characterization with High Spatial Resolution: k Value and E Modulus

H. Engelmann, V. Sukharev, E. Zschech, 2007 .

Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps

Krishna C. Saraswat, Ratan K. Choudhury, Valeriy Sukharev, 2001, Microelectron. Reliab..

Analytical modeling of silicon etch process in high density plasma

Krishna C. Saraswat, Valeriy Sukharev, Shahram Abdollahi-Alibeik, 1999 .

Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)

C. Kim, V. Sukharev, A. Kteyan, 2022, 2022 IEEE International Reliability Physics Symposium (IRPS).

Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids

C. Kim, F. Najm, V. Sukharev, 2022, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure

Valeriy Sukharev, Ehrenfried Zschech, William D. Nix, 2007 .

Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies - Effect of stress on 3D IC interconnect reliability

V. Sukharev, E. Zschech, 2014 .

Microtrenching resulting from specular reflection during chlorine etching of silicon

R. Hoekstra, M. Kushner, V. Sukharev, 1998 .

Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages

A. Kteyan, H. Hovsepyan, J.-H. Choy, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Theoretical predictions of EM-induced degradation in test-structures and on-chip power grids with analytical and numerical analysis

Farid N. Najm, Sandeep Chatterjee, Valeriy Sukharev, 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks

Sheldon X.-D. Tan, Valeriy Sukharev, Armen Kteyan, 2016, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Electromigration assessment for power grid networks considering temperature and thermal stress effects

Taeyoung Kim, Valeriy Sukharev, Xin Huang, 2016, Integr..

Electromigration analysis of full-chip integrated circuits with hydrostatic stress

Matthew Hogan, Valeriy Sukharev, Patrick Gibson, 2014, 2014 IEEE International Reliability Physics Symposium.

Physics-based electromigration assessment for power grid networks

Sheldon X.-D. Tan, Tan Yu, Valeriy Sukharev, 2014, 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC).

EM-Reliability System Modeling and Performance Optimization for High-Performance Microprocessors

S. Tan, V. Sukharev, Xin Huang, 2014 .

Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects

Valeriy Sukharev, V. Sukharev, 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength

Valeriy Sukharev, Ehrenfried Zschech, V. Sukharev, 2004 .

Effect of interface modification on EM-induced degradation mechanisms in copper interconnects

A. V. Vairagar, H. Engelmann, V. Sukharev, 2006 .

MULTISCALE TRANSIENT THERMAL ANALYSIS OF MICROELECTRONICS FEATURE

Y. Joshi, V. Sukharev, Satish Kumar, 2015 .

Fluctuation Model of Chemical Mechanical Planarization

V. Sukharev, 2001 .

Power Grid Electromigration Checking Using Physics-Based Models

Farid N. Najm, Sandeep Chatterjee, Valeriy Sukharev, 2018, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Fast physics-based electromigration checking for on-die power grids

Farid N. Najm, Sandeep Chatterjee, Valeriy Sukharev, 2016, 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees

Sheldon X.-D. Tan, Taeyoung Kim, Valeriy Sukharev, 2016, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Electromigration Check: Where the Design and Reliability Methodologies Meet

Farid N. Najm, Valeriy Sukharev, F. Najm, 2018, IEEE Transactions on Device and Materials Reliability.

Postvoiding Stress Evolution in Confined Metal Lines

Xin Huang, Valeriy Sukharev, Armen Kteyan, 2016, IEEE Transactions on Device and Materials Reliability.

An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Physics-based simulation of stress-induced and electromigration-induced voiding and their interactions in on-chip interconnects

V. Sukharev, A. Kteyan, 2021, Microelectronic Engineering.

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Yogendra Joshi, Valeriy Sukharev, 2015 .

Analysis of the Effect of TSV-Induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations

R. Radojcic, M. Gall, V. Sukharev, 2017, IEEE Transactions on Device and Materials Reliability.

Electromigration recovery modeling and analysis under time-dependent current and temperature stressing

Sheldon X.-D. Tan, Taeyoung Kim, Valeriy Sukharev, 2016, 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC).

Learning-based dynamic reliability management for dark silicon processor considering EM effects

Sheldon X.-D. Tan, Taeyoung Kim, Valeriy Sukharev, 2016, 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper)

Farid N. Najm, Valeriy Sukharev, F. Najm, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters

C. Kim, V. Sukharev, A. Kteyan, 2023, 2023 IEEE International Reliability Physics Symposium (IRPS).

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Valeriy Sukharev, Ehrenfried Zschech, Ahila Krishnamoorthy, 2005, International Journal of Materials Research.

Electromigration Checking Using a Stochastic Effective Current Model

Farid N. Najm, Valeriy Sukharev, Adam Issa, 2020, 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD).

Finite-difference methodology for full-chip electromigration analysis applied to 3D IC test structure: Simulation vs. experiment

Farid N. Najm, Valeriy Sukharev, Jun-Ho Choy, 2017, 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

Interconnect reliability modeling and analysis for multi-branch interconnect trees

Sheldon X.-D. Tan, Taeyoung Kim, Valeriy Sukharev, 2015, 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC).

New electromigration modeling and analysis considering time-varying temperature and current densities

Sheldon X.-D. Tan, Valeriy Sukharev, Hai-Bao Chen, 2015, The 20th Asia and South Pacific Design Automation Conference.

IR-drop based electromigration assessment: Parametric failure chip-scale analysis

Sheldon X.-D. Tan, Valeriy Sukharev, Hai-Bao Chen, 2014, 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

Lifetime optimization for real-time embedded systems considering electromigration effects

Sheldon X.-D. Tan, Bowen Zheng, Taeyoung Kim, 2014, 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance

V. Sukharev, A. Kteyan, E. Zschech, 2012, J. Electron. Test..