J. Segelken

Internal thermal resistance of a multi-chip packaging design for VLSI-based systems

Y. C. Lee, H. Ghaffari, J. Segelken, 1988 .

Understanding the use of silicone gels for non-hermetic plastic packaging

J. W. Balde, J. M. Segelken, J. Segelken, 1989, Proceedings., 39th Electronic Components Conference.

Multichip Packaging Design for VLSI-Based Systems

N. Teneketges, C. Bartlett, J. Segelken, 1987 .