Tae won Kim

发表

Effects of Chamber Wall Conditions on Cl Concentration and Si Etch Rate Uniformity in Plasma Etching Reactors

E. Aydil, Tae won Kim, 2003 .

Two-dimensional ion flux distributions in inductively coupled plasmas: Effect of adding electronegative gases to Ar

E. Aydil, Tae won Kim, 2002 .

An on-wafer probe array for measuring two-dimensional ion flux distributions in plasma reactors

E. Aydil, Tae won Kim, V. Vahedi, 2002 .

Relation between the ion flux, gas phase composition, and wall conditions in chlorine plasma etching of silicon

E. Aydil, Tae won Kim, V. Vahedi, 2003 .

Experimental and theoretical study of two-dimensional ion flux uniformity at the wafer plane in inductively coupled plasmas

E. Aydil, Tae won Kim, 2003 .

Spatial and temporal variation of ion flux in the presence of an instability in inductively coupled SF6 plasmas

E. Aydil, Tae won Kim, 2003 .

Flow Characteristics According to Velocity Conditions of Cylinder Boundary Under Low Reynolds Number

Tae won Kim, C. Song, I. Seo, 2013 .

Spatial and temporal variation of the ion flux impinging on the wafer surface in presence of a plasma instability

Eray S. Aydil, E. Aydil, Tae won Kim, 2002 .

Analysis of Shallow Water Flow in Curved Channel Using Dispersion Stresses Method

Tae won Kim, C. Song, Jung-kyu Ahn, 2013 .