Kai Feng

Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate

Ju Long Yuan, Xu Wang, Tianchen Zhao, 2019, Applied Sciences.

Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

J. Yuan, Q. Deng, Kai Feng, 2020, Micromachines.

Fabrication and Application of Gel Forming Ultrafine Diamond Abrasive Tools

Kai Feng, Zhaozhong Zhou, B. Lyu, 2021, ECS Journal of Solid State Science and Technology.

Effects of Changes in Gas Type and Partial Pressure on Chemical Mechanical Polishing Property of Si Substrate

Kai Feng, Zhaozhong Zhou, S. Kurokawa, 2019, ECS Journal of Solid State Science and Technology.