Tomasz Falat

Packaging of electronics, photonics and microsystems

Tomasz Falat, Jan Felba, Przemyslaw Matkowski, 2011 .

Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives

Philippe Monfraix, Christophe Laurent, Tomasz Falat, 2011, Microelectron. Reliab..

Numerical Approach to Characterization of Thermally Conductive Adhesives

Artur Wymyslowski, Tomasz Falat, Jana Kolbe, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach

Artur Wymyslowski, Kaspar M. B. Jansen, Tomasz Falat, 2007, Microelectron. Reliab..

Coarse grained molecular dynamics study of heat transfer in thermal interface materials

Tomasz Falat, Jan Felba, Michal Zawierta, 2013, Proceedings of the 36th International Spring Seminar on Electronics Technology.

Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles

Tomasz Falat, Jan Felba, Tomasz Piasecki, 2011, 18th European Microelectronics & Packaging Conference.

Numerical Approach to Characterization of Thermally Conductive Adhesives

Artur Wymyslowski, Tomasz Falat, Jana Kolbe, 2005 .