K. Cochran

High-power optical microswitch based on direct fiber actuation

D. DeVoe, K. Cochran, L. Fan, 2005 .

Test and evaluation of chip-to-chip attachment of MEMS devices

M. Deeds, P. Sandborn, K. Cochran, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

Reliability assessment of delamination in chip-to-chip bonded MEMS packaging

Harish Bhaskaran, Peter Sandborn, Michael Deeds, 2003 .