K. Tu

发表

Y. Liu, K. Tu, Xiuchen Zhao, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

K. Tu, M. Hamdi, Syahira Annuar, 2017, Science and technology of advanced materials.

K. Tu, D. Parkinson, Yingxia Liu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

King-Ning Tu, Andriy Gusak, M. Li, 2003 .

K. Tu, Chih Chen, J. Juang, 2019, 2019 International Conference on Electronics Packaging (ICEP).

K. Tu, Y. Chou, K. Lu, 2010, 2010 3rd International Nanoelectronics Conference (INEC).

K. Tu, Y. Chou, K. Lu, 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.

C. T. Chong, S. Yoon, V. Kripesh, 2006, 56th Electronic Components and Technology Conference 2006.

K. Tu, A. Gusak, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A. V. Vairagar, K. Tu, S. Mhaisalkar, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

K. Tu, Y. Lo, K. Shie, 2022, Scientific Reports.

D. Raabe, K. Tu, G. Rohrer, 2017, Journal of Materials Science.

K. Tu, Yingxia Liu, Menglu Li, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Kuan-Neng Chen, K. Tu, C. Chen, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Lih-Juann Chen, K. Tu, Chun-Wei Huang, 2016, Nanoscale.

M. Kunz, N. Tamura, Tao-Chih Chang, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

K. Tu, A. Gusak, 2014 .

Yi-Ting Chen, Chun-Chieh Wang, Chih Chen, 2017, Microelectronics and reliability.

K. Tu, Chih Chen, W. Chiu, 2020 .

Albert T. Wu, King-Ning Tu, K. Tu, 2006 .

Carl V. Thompson, King-Ning Tu, Evan Ma, 1990 .

K. Tu, J. Mayer, E. I. Alessandrini, 1974 .

T. T. Sheng, K. Tu, J. Mayer, 1982 .

N. Tamura, R. Celestre, A. MacDowell, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

K. Tu, A. Gusak, 2014 .

A. O. Kovalchuk, K. Tu, A. Gusak, 2010, Nano letters.

Tung-Sheng Kuan, King-Ning Tu, F. d'Heurle, 1978 .

K. Tu, M. Eizenberg, J. Mayer, 1984 .

A. Segmüller, K. Tu, M. Murakami, 1988 .

K. Tu, Yaodong Wang, D. Chu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

K. N. Tu, K. Tu, 2011, Microelectron. Reliab..

J. Tersoff, Chun‐Sing Lee, Qiaobao Zhang, 2016, Science Advances.

Jun Yuan, J. Rodenburg, A. Bleloch, 1993, Microscopy research and technique.

K. Tu, Shengquan Ou, K.N. Tu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

K. Tu, J. Pang, Luhua Xu, 2006, 2006 8th Electronics Packaging Technology Conference.

K. Tu, K. Paik, J. Suh, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

King-Ning Tu, K. Tu, C. Y. Liu, 2001 .

M. Di Michiel, K. Tu, Chih Chen, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Kuan-Neng Chen, K. Tu, C. Chen, 2016, 2016 Pan Pacific Microelectronics Symposium (Pan Pacific).

K. Tu, Yaodong Wang, I. D. De Rosa, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

K. Tu, Luhua Xu, S. Liang, 2009, 2009 59th Electronic Components and Technology Conference.

Yuhuan Xu, Y. Chan, K. Tu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

K. Tu, J. Pang, B. Xiong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Hyungsuk K. D. Kim, K. Tu, P. Totta, 1996 .

N. Tamura, K. Tu, J. Lloyd, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Menglu Li, K. Tu, Menglu Li, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu, 2009, Microelectron. Reliab..

H. Nishikawa, K. Tu, Shiqi Zhou, 2019, Materials & Design.

King-Ning Tu, Andriy Gusak, K. Tu, 2002 .

King-Ning Tu, Hyungsuk K. D. Kim, K. Tu, 1995 .

N. Tamura, K. Tu, J. Suh, 2006, 56th Electronic Components and Technology Conference 2006.

K. Tu, A. Gusak, G. V. Lutsenko, 2006 .

K. Tu, A. Gusak, J. Suh, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

K. Tu, M. Fujiyoshi, K.N. Tu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

K. Tu, Chih Chen, J. Juang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

K. Tu, J. Pang, Luhua Xu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

K. Tu, F. Ouyang, A. Huang, 2006, 56th Electronic Components and Technology Conference 2006.

K. Tu, Delphic Chen, J. Kuo, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Chih Chen, K. N. Tu, Hsiang-Yao Hsiao, 2013, Microelectron. Reliab..

Nikhil Vishwanath Kelkar, King-Ning Tu, K. Tu, 2005 .

H. Nishikawa, K. Tu, Shiqi Zhou, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Yingxia Liu, K. N. Tu, K. Tu, 2018, 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).

K. Tu, R. Agarwal, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

King-Ning Tu, I. Ohdomari, K. Tu, 1980 .

Yahong Xie, K. Tu, K. Chong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

L. J. Chen, K. Tu, J. Huang, 1997 .

Wei Tang, Shadi A. Dayeh, S. Tom Picraux, 2012, Nano letters.

N. Tamura, K. Tu, Yingxia Liu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

K. Tu, K. Tu, F. Kun, 2001, Physical review. E, Statistical, nonlinear, and soft matter physics.

K. Tu, E. Huang, C. Ku, 2019, Journal of Electronic Materials.

N. Ghoniem, K. Tu, Jenn‐Ming Yang, 2010, Physical review letters.

Lih-Juann Chen, K. Tu, Wen‐Wei Wu, 2010, 2010 3rd International Nanoelectronics Conference (INEC).

K. Tu, Jenn‐Ming Yang, Luhua Xu, 2009, 2009 59th Electronic Components and Technology Conference.

K. Tu, Chih Chen, J. Juang, 2018, 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

K. Tu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

K. Tu, Chia-ling Lu, J. Kuo, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

K. Tu, Chih Chen, J. Ong, 2020, 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

K. Tu, M. Hamdi, Syahira Annuar, 2017, Science and technology of advanced materials.