Zhixiong Xiao

发表

Analytical behavior of rectangular electrostatic torsion actuators with nonlinear spring bending

K. R. Farmer, Zhixiong Xiao, Wuyong Peng, 2003 .

Pull-in study for round double-gimbaled electrostatic torsion actuators

K. R. Farmer, Zhixiong Xiao, W. Peng, 2002 .

An ultra-sensitive optical MEMS sensor for partial discharge detection

K. R. Farmer, Zhixiong Xiao, Sang Hwui Lee, 2005 .

A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching

Zhihong Li, Yangyuan Wang, Zhenchuan Yang, 2000 .

A new release process for polysilicon surface micromachining using sacrificial polysilicon anchor and photolithography after sacrificial etching

Guobing Zhang, Zhixiong Xiao, Y. Hao, 1999 .

Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology

Zhihong Li, Yangyuan Wang, Guobing Zhang, 1999 .

Frequency and buckling responses of a high-speed rotating fiber metal laminated cantilevered microdisk

Zhixiong Xiao, Mostafa Habibi, Zhiyong Wang, 2020, Mechanics of Advanced Materials and Structures.

Micromachined variable capacitors with wide tuning range

K. R. Farmer, R. Wolffenbuttel, Zhixiong Xiao, 2003 .

Silicon micro-accelerometer with mg resolution, high linearity and large frequency bandwidth fabricated with two mask bulk process

Yilong Hao, Changde Zhao, Zhixiong Xiao, 1999 .

Simulation, Optimization and Measurement of MEMS Torsion Micro Mirrors for Optical MEMS Application

Dachao Li, Zhixiong Xiao, Wengang Wu, 2002 .

Integration of an RF MEMS resonator with a bulk CMOS process using a low-temperature and dry-release fabrication method

Zhiyong Xiao, P. Chan, Zhixiong Xiao, 2006 .

Design and fabrication for inertial micro sensors

Yilong Hao, Zhihong Li, Guoying Wu, 1998, 1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105).

Silicon/glass wafer-to-wafer bonding with Ti/Ni intermediate bonding

Zhihong Li, Yangyuan Wang, Guobing Zhang, 1998 .