C. Christiansen

发表

Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals

A. Simon, D. Edelstein, A. Uedono, 2012, 2012 International Electron Devices Meeting.

A Predictive Model for IC Self-Heating Based on Effective Medium and Image Charge Theories and Its Implications for Interconnect and Transistor Reliability

M. Alam, C. Christiansen, P. Justison, 2017, IEEE Transactions on Electron Devices.

Minimum Void Size and 3-Parameter Lognormal Distribution for EM Failures in Cu Interconnects

E. Yashchin, T. Sullivan, J. Gill, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Thermal characterization and challenges of advanced interconnects (Invited)

Baozhen Li, C. Christiansen, A. Kim, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

A study of via depletion electromigration with very long failure times

Cathryn Christiansen, Baozhen Li, Kaushik Chanda, 2011, 2011 International Reliability Physics Symposium.

65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH

S. Grunow, D. Restaino, A. Grill, 2006, 2006 International Interconnect Technology Conference.

Time-dependent series resistance and implications for voltage acceleration models in BEOL TDDB

B. Li, E. Wu, P. McLaughlin, 2016, 2016 IEEE International Reliability Physics Symposium (IRPS).

High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility

A. Simon, D. Edelstein, C. Cabral, 2010, 2010 International Electron Devices Meeting.

Technology Reliability Qualification of a 65nm CMOS Cu/Low-k BEOL Interconnect

T. Sullivan, F. Chen, B. Li, 2006, 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Comprehensive investigations of CoWP metal-cap impacts on low-k TDDB for 32nm technology application

L. Nicholson, F. Chen, M. Shinosky, 2010, 2010 IEEE International Reliability Physics Symposium.

Stress migration in a copper - Aluminum hybrid technology

G. U'ren, J. Gambino, C. Christiansen, 2014, 2014 IEEE International Reliability Physics Symposium.

Threshold electromigration failure time and its statistics for Cu interconnects

Emmanuel Yashchin, Baozhen Li, Ronald G. Filippi, 2006 .

Geometry, kinetics, and short length effects of electromigration in Mn doped Cu interconnects at the 32nm technology node

M. Angyal, Baozhen Li, V. McGahay, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects

Cathryn Christiansen, Baozhen Li, Terence Kane, 2011, 2011 International Reliability Physics Symposium.

A 7nm CMOS technology platform for mobile and high performance compute application

J. Zeng, S. Samavedam, B. Senapati, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Electromigration challenges for advanced on-chip Cu interconnects

Chih-Chao Yang, Baozhen Li, C. Christiansen, 2014, Microelectron. Reliab..

Blech Effect and Lifetime Projection for Cu/Low-K Interconnects

J. Gill, Baozhen Li, C. Christiansen, 2008, 2008 International Interconnect Technology Conference.

New breakdown data generation and analytics methodology to address BEOL and mol dielectric TDDB process development and technology qualification challenges

Fen Chen, Kai Zhao, Cathryn Christiansen, 2014, 2014 IEEE International Reliability Physics Symposium.

Reliability Challenges in Copper Metallizations arising with the PVD Resputter Liner Engineering for 65nm and Beyond

J. Gill, E. Kaltalioglu, O. Aubel, 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.

High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization

G. Northrop, V. Sardesai, S. Narasimha, 2014, 2014 IEEE International Electron Devices Meeting.

Thickness-Magnetic Field Phase Diagram at the Superconductor-Insulator Transition in 2D

C. Christiansen, A. Goldman, N. Marković, 1998, cond-mat/9808176.

Anomalous Field Effect in Ultrathin Films of Metals near the Superconductor-Insulator Transition

Allen M Goldman, C. Christiansen, D. Grupp, 1997 .

Electromigration characteristics of power grid like structures

Barry P. Linder, Cathryn Christiansen, Baozhen Li, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

COULOMB-GLASS-LIKE BEHAVIOR OF ULTRATHIN FILMS OF METALS

Allen M Goldman, C. Christiansen, D. Grupp, 1998 .