H. Kim

发表

Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals

A. Simon, D. Edelstein, A. Uedono, 2012, 2012 International Electron Devices Meeting.

Electro-thermal reliability study of GaN high electron mobility transistors

H. Kim, J. S. Lundh, B. Chatterjee, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Integrated temperature mapping of lateral gallium nitride electronics

H. Kim, J. S. Lundh, B. Chatterjee, 2017, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Measurement of the CP-violation parameter of B0 mixing and decay with ppÌ– âƒTM Î1⁄4Î1⁄4X data

R. E. Hall, T. J. Kim, Philip Lewis, 2019 .

SUSTAINABLE BIO-COMPOSITES FOR AUTOMOTIVE INTERIOR PARTS

H. Kim, S. Choi, B. Lee, 2011 .

A study of the decay Λ b

R. E. Hall, T. J. Kim, Philip Lewis, 2007 .

17th computed maxillofacial imaging congress

H. Kim, D. Kim, S. Choi, 2011, International Journal of Computer Assisted Radiology and Surgery.

Reduction of emissions with propane addition to a diesel engine

H. Kim, H. Choi, D. Kim, 2013, International Journal of Automotive Technology.

The effect of cricoid and paralaryngeal force on upper oesophageal occlusion during induction of anaesthesia: a randomised, crossover study

H. Kim, S. Min, Jee-Eun Chang, 2020, Anaesthesia.