B. Rodgers

Finite element modelling of a BGA package subjected to thermal and power cycling

B. Rodgers, J. Punch, J. Jarvis, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Optimising lead-free screen-printing and reflow process parameters

B. Rodgers, J. Punch, C. Ryan, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing

B. Rodgers, J. Punch, C. Ryan, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

B. Rodgers, J. Punch, M. Reid, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Experimental determination and finite element model validation of the Anand viscoplasticity model constants for SnAgCu

B. Rodgers, J. Punch, F. Waldron, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Jeff Punch, Ben Flood, Finbarr Waldron, 2005 .

Material properties from small specimens using the punch and bulge test

D. J. Brookfield, T. K. Hellen, D J Brookfield, 1999 .

The dynamics of multiple pair-wise collisions in a chain for designing optimal shock amplifiers

Bryan Rodgers, S. Goyal, B. Rodgers, 2009 .

Board Level Drop Tests Comparing Lead-Free and Eutectic Solder Interconnects on a BGA Package for Mobile ICT Applications

Jeff Punch, Greg Heaslip, Bryan Rodgers, 2004 .