A. R. Ochana

Finite element analysis of lead-free surface mount devices

V. Silberschmidt, P. Hegde, A. R. Ochana, 2008 .

Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly

D. Hutt, A. Al-Habaibeh, A. R. Ochana, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..