Alan Overson

Thermal characterization of an epoxy-based underfill material for flip chip packaging

Yi He, Brian E Moreira, Alan Overson, 2000 .

Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under Electromigration

Alan Overson, D. Goyal, Pilin Liu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint

Alan Overson, D. Goyal, Pilin Liu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

A Comparison Study of Cu Dissolution Mechanism and Kinetics in Solder Joints under Electromigration and Extended Reflow

Alan Overson, D. Goyal, Pilin Liu, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Electromigration induced interfacial microstructure evolution of solder joints in electronic packaging

Alan Overson, D. Goyal, Pilin Liu, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).