D. Wheeler

发表

Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

T. Moffat, D. Wheeler, D. Josell, 2004 .

Superconformal Electrodeposition of Copper

T. Moffat, D. Wheeler, D. Josell, 2001 .

Computational modeling techniques for reliability of electronic components on printed circuit boards

Hua Lu, C. Bailey, D. Wheeler, 2002 .

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

T. Moffat, D. Wheeler, D. Josell, 2006 .

Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Thomas P. Moffat, Daniel Josell, Soo-Kil Kim, 2007 .

Superfilling and the curvature enhanced accelerator coverage mechanism

Thomas P. Moffat, Daniel Wheeler, D. Josell, 2004 .

Superconformal Film Growth

T. Moffat, D. Wheeler, D. Josell, 2008 .

A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

John E. Bonevich, William H. Huber, Thomas P. Moffat, 2001 .

An Exact Algebraic Solution for the Incubation Period of Superfill

T. Moffat, D. Wheeler, D. Josell, 2004 .

Predicting the movement of voids in solder bumps and subsequent reliability [flip chip assembly]

C. Bailey, D. Wheeler, H. Lu, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Software Carpentry: Programming with Python

Leigh Sheneman, Jessica B. Hamrick, Konrad Hinsen, 2015 .

Superconformal Film Growth

T. Moffat, D. Wheeler, D. Josell, 2002 .

Superfilling When Adsorbed Accelerators Are Mobile

T. Moffat, D. Wheeler, D. Josell, 2007 .

Superconformal Silver Deposition using KSeCn Derivatized Substrates

T. Moffat, D. Wheeler, D. Josell, 2003 .

Superconformal Electrodeposition of Silver from a KAg ( CN ) 2 KCN KSeCN Electrolyte

T. Moffat, D. Wheeler, D. Josell, 2003 .

Via Filling by Electrodeposition Superconformal Silver and Copper and Conformal Nickel

T. Moffat, D. Wheeler, D. Josell, 2002 .

Superconformal Electrodeposition of Silver in Submicrometer Features

J. Bonevich, M. D. Edelstein, T. Moffat, 2002 .

Formation mechanisms of self-organized core/shell and core/shell/corona microstructures in liquid droplets of immiscible alloys

Yunzhi Wang, D. Wheeler, R. Shi, 2013 .

Influence of a Catalytic Surfactant on Roughness Evolution During Film Growth

G. McFadden, S. Coriell, T. Moffat, 2004 .

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper

T. Moffat, D. Wheeler, D. Josell, 2003 .

Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition

T. Moffat, D. Wheeler, D. Josell, 2003 .

Superconformal deposition by surfactant-catalyzed chemical vapor deposition

T. Moffat, D. Wheeler, D. Josell, 2002 .

Liquid droplet dynamics and complex morphologies in vapor–liquid–solid nanowire growth

P. Voorhees, D. Wheeler, J. Warren, 2011 .

Solder paste reflow modeling for flip chip assembly

P. Conway, C. Bailey, D. Hutt, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

NUMERICAL MODELLING OF SOLDER JOINT FORMATION

C. Bailey, M. Cross, D. Wheeler, 1998 .

Abstracts for the MSEL Assessment Panel, March 2001 | NIST

Grady S. White, David T. Read, Eric K. Lin, 2001 .

Accelerator aging effects during copper electrodeposition

T. Moffat, D. Wheeler, D. Josell, 2003 .

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Thomas P. Moffat, Daniel Josell, Daniel Wheeler, 2013 .

Modeling Extreme Bottom-Up Filling of Through Silicon Vias

T. Moffat, D. Wheeler, D. Josell, 2012 .

Superconformal film growth: Mechanism and quantification

Daniel Wheeler, Thomas P. Moffat, Daniel Josell, 2005, IBM J. Res. Dev..

Modeling Superconformal Electrodeposition Using The Level Set Method

Thomas P. Moffat, Daniel Josell, Daniel Wheeler, 2003 .

Superconformal Electrodeposition Using Derivitized Substrates

T. Moffat, D. Wheeler, D. Josell, 2002 .

Gold Superfill in Submicrometer Trenches: Experiment and Prediction

T. Moffat, D. Wheeler, D. Josell, 2006 .

Superconformal electrodeposition in submicron features.

T. Moffat, D. Wheeler, D. Josell, 2001, Physical review letters.

Modeling Superconformal Electrodeposition Using an Open Source PDE Solver

D. Wheeler, J. E. Guyer, D. Wheeler, 2009 .

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

T. Moffat, D. Wheeler, D. Josell, 2003 .

Phase field benchmark problems for nucleation

P. Voorhees, J. Warren, O. Heinonen, 2021 .

FiPy: Partial Differential Equations with Python

James A. Warren, Daniel Wheeler, Jonathan E. Guyer, 2009, Computing in Science & Engineering.

Stability and topological transformations of liquid droplets on vapor-liquid-solid nanowires

James A. Warren, Edwin J. Schwalbach, Stephen H. Davis, 2012 .

Superconformal Electrodeposition in Vias

T. Moffat, D. Wheeler, D. Josell, 2002 .

An integrated modeling approach to solder joint formation

Chris Bailey, Mark Cross, Daniel Wheeler, 1999 .

Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method

Chris Bailey, Mark Cross, Daniel Wheeler, 2000 .

A Mechanism for Brightening Linear Stability Analysis of the Curvature-Enhanced Coverage Model

J. Mallett, G. McFadden, S. Coriell, 2003 .

PFHub: The Phase-Field Community Hub

Daniel Schwen, Olle Heinonen, Larry K. Aagesen, 2019, Journal of Open Research Software.