D. Josell

发表

Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

T. Moffat, D. Wheeler, D. Josell, 2004 .

Superconformal Electrodeposition of Copper

T. Moffat, D. Wheeler, D. Josell, 2001 .

Superconformal Electrodeposition of Copper in 500–90 nm Features

J. Bonevich, T. Moffat, D. Josell, 2000 .

Moving the pulsed heating technique beyond monolithic specimens : experiments with coated wires

D. Basak, W. Boettinger, M. Rappaz, 2001 .

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

T. Moffat, D. Josell, 2012 .

Size-Dependent Resistivity in Nanoscale Interconnects

Daniel Josell, Zsolt Tőkei, S. Brongersma, 2009 .

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

T. Moffat, D. Wheeler, D. Josell, 2006 .

Superconformal Electrodeposition for 3-Dimensional Interconnects

T. Moffat, D. Josell, 2010 .

Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Thomas P. Moffat, Daniel Josell, Soo-Kil Kim, 2007 .

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

Thomas P. Moffat, Daniel Josell, T. Moffat, 2006 .

Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System Reduction of Overfill Bump Formation During Superfilling

Thomas P. Moffat, Daniel Josell, T. Moffat, 2006 .

Electrical properties of superfilled sub-micrometer silver metallizations

J. Bonevich, T. Moffat, D. Josell, 2004 .

Thermal transport through thin films: Mirage technique measurements on aluminum/titanium multilayers

J. Bonevich, D. Josell, G. Stafford, 2000 .

Superfilling and the curvature enhanced accelerator coverage mechanism

Thomas P. Moffat, Daniel Wheeler, D. Josell, 2004 .

Superconformal Film Growth

T. Moffat, D. Wheeler, D. Josell, 2008 .

Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace

Timothy P. Weihs, Daniel Josell, A. C. Lewis, 2002 .

Interfacial free energies from substrate curvature measurements of the creep of multilayer thin films

D. Josell, 1994 .

Evaluating the zero creep conditions for thin film and multilayer thin film specimens

G. McFadden, S. Coriell, D. Josell, 1995 .

Biaxial zero creep measurements of interface energies in Ni/Ag multilayers

T. P. Weihs, D. Josell, J. Tapson, 1999 .

Tensile Tests of Low Density Multilayer Thin Films

D. Josell, D. Shechtman, D. Heerden, 1995 .

A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

John E. Bonevich, William H. Huber, Thomas P. Moffat, 2001 .

Gold Superfill in Sub-Micrometer Trenches

T. Moffat, D. Josell, C. Witt, 2005 .

An Exact Algebraic Solution for the Incubation Period of Superfill

T. Moffat, D. Wheeler, D. Josell, 2004 .

Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries

T. P. Weihs, D. Josell, A. Lewis, 2003 .

The Effect of Interfacial Free Energies on the Stability of Microlaminates

T. P. Weihs, D. Josell, A. Lewis, 2000 .

Measuring the interface stress: Silver/nickel interfaces

J. Bonevich, D. Josell, I. Shao, 1999 .

Surfaces, Interfaces, and Changing Shapes in Multilayered Films

D. Josell, F. Spaepen, 1999 .

Dynamic Aspects of Wetting Balance Tests

C. Handwerker, W. Carter, W. Boettinger, 1996 .

Pushing the Limits of Bottom-Up Gold Filling for X-ray Grating Interferometry

K. Jefimovs, T. Moffat, D. Josell, 2020 .

Bottom-up Cu filling of annular through silicon vias: Microstructure and texture

T. Moffat, D. Josell, Hyo-Jong Lee, 2020 .

Electrochemical Processing of Interconnects

T. Moffat, D. Josell, 2013 .

Superconformal Film Growth

T. Moffat, D. Wheeler, D. Josell, 2002 .

Stress Transfer and Seismic Phenomena in Coupled Subduction Zones During the Earthquake Cycle

J. Rice, R. Dmowska, D. Josell, 1988 .

Electrodeposition of Ni in Submicrometer Trenches

J. Bonevich, T. Moffat, D. Josell, 2007 .

Energy-Filtered High-Resolution Electron Microscopy for Quantitative Solid State Structure Determination

D. Josell, Z. L. Wang, D. V. van Heerden, 1997, Journal of research of the National Institute of Standards and Technology.

The Effect of CoPt Crystallinity and Grain Texturing on Properties of Exchange-Coupled Fe/CoPt Systems

Zhong Lin Wang, J. Liu, S. Lofland, 2009 .

Interfacial reactions of Ti/n-GaN contacts at elevated temperature

A. Davydov, L. Bendersky, D. Josell, 2003 .

Determination of the interfacial tension by zero creep experiments on multilayers—II. Experiment

D. Josell, F. Spaepen, 1993 .

The formation of f.c.c. titanium in titanium-aluminum multilayers

D. Josell, D. Shechtman, D. Heerden, 1996 .

Creep deformation in multilayered and microlaminate materials

T. P. Weihs, D. Josell, A. Lewis, 2003 .

Synthesis and structure of polymeric networks of silver hexafluoroacetylacetonate complexes of THF, toluene, and vinyltrimethylsilane.

J. Ziller, D. Josell, W. Evans, 2003, Inorganic Chemistry.

Determination of the CoTi congruent melting point and thermodynamic reassessment of the Co-Ti system

W. Boettinger, A. Davydov, D. Josell, 2001 .

Additives for Superconformal Gold Feature Filling.

D. Josell, T. P. Moffat, T. Moffat, 2021, Journal of the Electrochemical Society.

Three Dimensionally Structured CdTe Thin-Film Photovoltaic Devices with Self-Aligned Back-Contacts: Electrodeposition on Interdigitated Electrodes

J. Bonevich, A. Motayed, B. Hamadani, 2009 .

Superconformal Deposition

T. Moffat, D. Josell, 2020, Surface and Interface Science.

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

T. Moffat, D. Josell, 2018, Journal of the Electrochemical Society.

Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings.

T. Moffat, D. Josell, S. Ambrozik, 2019, Journal of the Electrochemical Society.

Accelerated Bottom-Up Gold Filling of Metallized Trenches.

T. Moffat, D. Josell, S. Ambrozik, 2019, Journal of the Electrochemical Society.

Bottom-Up Gold Filling of High Aspect Ratio Trenches

T. Moffat, D. Josell, S. Ambrozik, 2019, Journal of The Electrochemical Society.

Bottom-Up Electrodeposition of Zinc in Through Silicon Vias

T. Moffat, D. Josell, 2015 .

Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires

T. Moffat, D. Josell, I. Levin, 2015 .

Superconformal Cu Electrodeposition from Cu(II)-EDTA Complexed Alkaline Electrolyte

T. Moffat, D. Josell, 2014 .

Superfilling Damascene Trenches with Gold in a Sulfite Electrolyte

T. Moffat, D. Josell, 2013 .

Superfilling When Adsorbed Accelerators Are Mobile

T. Moffat, D. Wheeler, D. Josell, 2007 .

Superconformal Silver Deposition using KSeCn Derivatized Substrates

T. Moffat, D. Wheeler, D. Josell, 2003 .

Superconformal Electrodeposition of Silver from a KAg ( CN ) 2 KCN KSeCN Electrolyte

T. Moffat, D. Wheeler, D. Josell, 2003 .

Via Filling by Electrodeposition Superconformal Silver and Copper and Conformal Nickel

T. Moffat, D. Wheeler, D. Josell, 2002 .

Superconformal Electrodeposition of Silver in Submicrometer Features

J. Bonevich, M. D. Edelstein, T. Moffat, 2002 .

Fracture behavior of nano-layered coatings under tension

D. Josell, H. Chai, 2010 .

Influence of a Catalytic Surfactant on Roughness Evolution During Film Growth

G. McFadden, S. Coriell, T. Moffat, 2004 .

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor Deposition of Copper

T. Moffat, D. Wheeler, D. Josell, 2003 .

Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition

T. Moffat, D. Wheeler, D. Josell, 2003 .

Superconformal deposition by surfactant-catalyzed chemical vapor deposition

T. Moffat, D. Wheeler, D. Josell, 2002 .

Allotropic phase formation in Ti/Zr multilayers

T. Tepper, D. Josell, D. Shechtman, 1998 .

fcc titanium in titanium/silver multilayers

T. Tepper, D. Josell, D. Shechtman, 1997 .

fcc titanium in Ti-Al multilayers

D. Josell, D. Shechtman, D. Heerden, 1994 .

Effect of heating rate and grain size on the melting behavior of the alloy Nb-47 mass% Ti in pulse-heating experiments

D. Basak, W. Boettinger, S. Coriell, 1999 .

Application of Laser Polarimetry to the Measurement of Specific Heat Capacity and Enthalpy of the Alloy 53Nb–47Ti (mass%) in the Temperature Range 1600 to 2000 K by a Millisecond-Resolution Pulse Heating Technique

D. Basak, D. Josell, U. Kattner, 2000 .

Comment on ‘‘Analysis for determining thermal diffusivity from thermal pulse experiments’’

J. Warren, D. Josell, A. Cezairliyan, 1995 .

A new method for tensile testing of thin films

Daniel Josell, Frans Spaepen, A. L. Greer, 1993 .

Exact solution for the zero creep load of a wire

D. Josell, 1993 .

Backcontact CdSe/CdTe windowless solar cells

D. Josell, J. Guyer, Matthew D. Widstrom, 2013 .

Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

W. Boettinger, D. Josell, K. Moon, 2007 .

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

M. Ritala, M. Leskelä, T. Aaltonen, 2006 .

Correcting errors in the theory for mirage-effect measurements

D. Josell, G. White, E. J. Gonzalez, 1998 .

Thermal Diffusion Through Multilayer Coatings: Theory and Experiment

J. Bonevich, D. Josell, A. Cezairliyan, 1998 .

Diffusional Creep: Stresses and Strain Rates in Thin Films and Multilayers

Huajian Gao, D. Josell, T. Weihs, 2002 .

Determining Interfacial Free Energies from Creep Experiments on Silver-Iron Multilayers

Z. Wang, D. Josell, 1994 .

Zero Creep Measurements of the Interfacial Free Energy of Ag/Ni Multilayers

D. Josell, F. Spaepen, 1991 .

Morphological stability of Ni(Al)/Ni3Al nanolaminate composites

H. Fraser, R. Banerjee, P. Anderson, 1999 .

Buffer layer engineering of L10 FePd thin films with large perpendicular magnetic anisotropy

Jianping Wang, D. Josell, S. Krylyuk, 2021 .

Effect of Oblique Versus Normal Deposition on the Properties of Perpendicularly Magnetized L10 FePd Thin Films

Jianping Wang, D. Josell, S. Krylyuk, 2020, IEEE Magnetics Letters.

Abstracts for the MSEL Assessment Panel, March 2001 | NIST

Grady S. White, David T. Read, Eric K. Lin, 2001 .

Combinatorial Investigation of Structural Quality of Au/Ni Contacts on GaN

W. Boettinger, I. Takeuchi, A. Davydov, 2004 .

Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems

T. Moffat, D. Josell, T. Braun, 2021 .

Microelectrode Studies of S-NDR Copper Electrodeposition: Potentiodynamic and Galvanodynamic Measurements and Simulations

T. Moffat, D. Josell, T. Braun, 2020 .

Accelerator aging effects during copper electrodeposition

T. Moffat, D. Wheeler, D. Josell, 2003 .

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

T. Moffat, D. Josell, T. Braun, 2020, Journal of the Electrochemical Society.

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Thomas P. Moffat, Daniel Josell, Daniel Wheeler, 2013 .

Modeling Extreme Bottom-Up Filling of Through Silicon Vias

T. Moffat, D. Wheeler, D. Josell, 2012 .

Superconformal film growth: Mechanism and quantification

Daniel Wheeler, Thomas P. Moffat, Daniel Josell, 2005, IBM J. Res. Dev..

Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology.

T. Moffat, D. Josell, David Raciti, 2023, Accounts of chemical research.

Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias

T. Moffat, D. Josell, T. Braun, 2020, Journal of The Electrochemical Society.

Simulation of Copper Electrodeposition in Through-Hole Vias

T. Moffat, D. Josell, J. John, 2020, Journal of the Electrochemical Society.

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

T. Moffat, D. Josell, T. Braun, 2020, Journal of the Electrochemical Society.

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

T. Moffat, D. Josell, P. Yeh, 2018, Journal of the Electrochemical Society.

SEIRAS Study of Chloride-Mediated Polyether Adsorption on Cu.

T. Moffat, D. Josell, S. Zou, 2018, The journal of physical chemistry. C, Nanomaterials and interfaces.

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown.

T. Moffat, D. Josell, 2018, Journal of the Electrochemical Society.

Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias.

T. Moffat, D. Josell, 2016, Journal of the Electrochemical Society.

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias.

T. Moffat, D. Josell, 2016, ECS transactions.

Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias.

T. Moffat, D. Josell, M. Silva, 2016, ECS transactions.

Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte

T. Moffat, D. Josell, 2013 .

A New Paradigm for Interconnect Geometry to Reduce Grain Boundary Resistance

D. Josell, 2006 .

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias.

T. Moffat, D. Josell, Hyo-Jong Lee, 2021, Journal of the Electrochemical Society.

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

T. Moffat, D. Josell, M. Blain, 2020, Journal of the Electrochemical Society.

Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias

T. Moffat, D. Josell, J. John, 2022, Journal of The Electrochemical Society.

Modeling Superconformal Electrodeposition Using The Level Set Method

Thomas P. Moffat, Daniel Josell, Daniel Wheeler, 2003 .

Superconformal Electrodeposition Using Derivitized Substrates

T. Moffat, D. Wheeler, D. Josell, 2002 .

Gold Superfill in Submicrometer Trenches: Experiment and Prediction

T. Moffat, D. Wheeler, D. Josell, 2006 .

Extreme Bottom-up Gold Filling of High Aspect Ratio Features.

T. Moffat, D. Josell, 2023, Accounts of chemical research.

Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry.

K. Jefimovs, M. Polikarpov, T. Moffat, 2021, Journal of the Electrochemical Society.

Photocurrent mapping of 3D CdSe/CdTe windowless solar cells.

D. Josell, J. Ha, C. Hangarter, 2013, ACS applied materials & interfaces.

Superconformal electrodeposition in submicron features.

T. Moffat, D. Wheeler, D. Josell, 2001, Physical review letters.

Dependence of exchange coupling interaction on micromagnetic constants in hard/soft magnetic bilayer systems

J. Liu, S. Lofland, I. Takeuchi, 2007 .

Tensile testing low density multilayers: Aluminum/titanium

David T. Read, John E. Bonevich, Daniel Josell, 1998 .

Infrared emission imaging as a tool for characterization of hydrogen storage materials

E. Heilweil, H. Oguchi, L. Bendersky, 2009 .

Heat transfer through nanoscale multilayered thermal barrier coatings at elevated temperatures

J. Bonevich, D. Josell, R. Johnson, 2015 .

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

T. Moffat, D. Wheeler, D. Josell, 2003 .

Rapid deformation of thin gold layers in polymer matrices studied by x-ray reflectivity

Howard Wang, S. Satija, J. Bonevich, 2003 .

X-ray Reflectivity Study of Gold Nanoparticles in a Polymer Matrix

Howard Wang, S. Satija, D. Josell, 2001 .

Three Dimensionally Structured Interdigitated Back Contact Thin Film Heterojunction Solar Cells.

B. Hamadani, Hua Xu, D. Josell, 2011 .

3D Geometries: Enabling Optimization Toward the Inherent Limits of Thin-Film Photovoltaics

D. Josell, C. Hangarter, Ratan Debnath, 2016 .

An In Situ Ellipsometric Study of Cl − -Induced Adsorption of PEG on Ru and on Underpotential Deposited Cu on Ru

T. Moffat, D. Josell, L. Richter, 2006 .

Orientation and magnetic properties of FePt and CoPt films grown on MgO(1 1 0) single-crystal substrate by electron-beam coevaporation

J. Liu, I. Takeuchi, L. Bendersky, 2007 .

Superconformal Electrodeposition in Vias

T. Moffat, D. Wheeler, D. Josell, 2002 .

Windowless CdSe/CdTe solar cells with differentiated back contacts: J-V, EQE, and photocurrent mapping.

D. Josell, J. Guyer, J. Ha, 2014, ACS applied materials & interfaces.

Osmium Barriers for Direct Copper Electrodeposition in Damascene Processing

T. Moffat, D. Josell, C. Witt, 2006 .

Effect of Oblique Versus Normal Deposition on the Properties of Perpendicularly Magnetized L10 FePd Thin Films

Jianping Wang, D. Josell, S. Krylyuk, 2020, IEEE Magnetics Letters.

An integral solution for thermal diffusion in periodic multilayer materials: Application to iron/copper multilayers

B. Murray, D. Josell, A. Cezairliyan, 1997 .

Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing

M. Ritala, T. Aaltonen, J. Bonevich, 2006 .

A Mechanism for Brightening Linear Stability Analysis of the Curvature-Enhanced Coverage Model

J. Mallett, G. McFadden, S. Coriell, 2003 .