P. Andricacos

Copper On-Chip Interconnections: A Breakthrough in Electrodeposition to Make Better Chips

P. Andricacos, 1999, The Electrochemical Society Interface.

Effect of Additives on Shape Evolution during Electrodeposition II. Parameter Estimation from Roughness Evolution Experiments

Richard D. Braatz, Philippe M. Vereecken, Effendi Rusli, 2007 .

Future directions in electroplated materials for thin-film recording heads

Neil Robertson, Panos C. Andricacos, N. Robertson, 1998, IBM J. Res. Dev..

Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium

P. Andricacos, 1999 .