S. Otsuka

Investigation of stress-induced voiding inside and under VIAS in copper interconnects with “wing” pattern

H. Ehara, H. Matsuyama, T. Suzuki, 2008, 2008 IEEE International Reliability Physics Symposium.

Stress migration phenomenon in narrow copper interconnects

H. Matsuyama, T. Kouno, S. Otsuka, 2007 .

Stress migration phenomena in narrow copper lines

H. Ehara, H. Matsuyama, T. Suzuki, 2006, 2006 IEEE International Integrated Reliability Workshop Final Report.

45 nm-node BEOL integration featuring porous-ultra-low-k/Cu multilevel interconnects

S. Nakai, H. Kitada, T. Nakamura, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..