M. Shiozu

Investigation of stress-induced voiding inside and under VIAS in copper interconnects with “wing” pattern

H. Ehara, H. Matsuyama, T. Suzuki, 2008, 2008 IEEE International Reliability Physics Symposium.

Stress migration phenomenon in narrow copper interconnects

H. Matsuyama, T. Kouno, S. Otsuka, 2007 .

Re-think stress migration phenomenon with stress measurement in 12 years

H. Ehara, H. Matsuyama, M. Shiozu, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Stress migration phenomena in narrow copper lines

H. Ehara, H. Matsuyama, T. Suzuki, 2006, 2006 IEEE International Integrated Reliability Workshop Final Report.

Voiding generation in copper interconnect under room temperature storage in 12 years

H. Ehara, K. Yamabe, H. Matsuyama, 2017 .