S. Shantaram

发表

High strain-rate mechanical properties of SnAgCu leadfree alloys

P. Lall, J. Suhling, M. Kulkarni, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration

P. Lall, J. Suhling, D. Panchagade, 2008, 2008 58th Electronic Components and Technology Conference.

Damage Progression Using Speckle‐Correlation and High‐Speed Imaging for Survivability of Leadfree Packaging Under Shock

P. Lall, D. Panchagade, S. Shantaram, 2009 .

Mechanical deformation behavior of SAC305 at high strain rates

P. Lall, J. Suhling, S. Shantaram, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Material Characterization of Leadfree SAC Solder Alloys at High Strain Rates with Finite Element Analysis

S. Shantaram, 2013 .

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

P. Lall, J. Suhling, M. Kulkarni, 2009 .

Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses

S. Shantaram, N. Lakhera, A. Sakib, 2017 .

Explicit Finite Element Modeling in Conjunction with Digital Image Correlation Based Life Prediction of Lead-Free Electronics under Shock-Impact

Sandeep Shantaram, S. Shantaram, 2009 .

Material behavior of SAC305 under high strain rate at high temperature

P. Lall, J. Suhling, S. Shantaram, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures

P. Lall, J. Suhling, S. Shantaram, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

P. Lall, D. Iyengar, S. Shantaram, 2007, IEEE Transactions on Components and Packaging Technologies.

Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, David Locker, 2015 .

Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys

P. Lall, S. Shantaram, P. Lall, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Reliability modeling of electronic systems subjected to high strain rates

P. Lall, S. Shantaram, P. Lall, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys

Pradeep Lall, Sandeep Shantaram, P. Lall, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics

Pradeep Lall, Dhananjay Panchagade, Sandeep Shantaram, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

HighSpeedDigital ImageCorrelation forTransient-Shock Reliability ofElectronics

Pradeep Lall, Dhananjay Panchagade, Jeff Suhling, 2007 .

Delamination-induced stitch crack of copper wires

S. Shantaram, M. van Soestbergen, A. Mavinkurve, 2017, International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Coupled Thermal and Thermo-Mechanical Simulation for Flip-chip Component Level Copper Pillar Bump Fatigue

S. Shantaram, N. Lakhera, A. Sakib, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design

S. Shantaram, T. Hauck, 2014 .

Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors

S. Shantaram, Gaurav Sharma, N. Lakhera, 2023, IMAPSource Proceedings.

Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, 2009, 2009 59th Electronic Components and Technology Conference.