D. Iyengar

Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration

P. Lall, J. Suhling, D. Panchagade, 2008, 2008 58th Electronic Components and Technology Conference.

Damage Progression Using Speckle‐Correlation and High‐Speed Imaging for Survivability of Leadfree Packaging Under Shock

P. Lall, D. Panchagade, S. Shantaram, 2009 .

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

P. Lall, D. Iyengar, S. Shantaram, 2007, IEEE Transactions on Components and Packaging Technologies.

Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

HighSpeedDigital ImageCorrelation forTransient-Shock Reliability ofElectronics

Pradeep Lall, Dhananjay Panchagade, Jeff Suhling, 2007 .

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

P. Lall, D. Iyengar, S. Shantaram, 2008, IEEE Transactions on Electronics Packaging Manufacturing.