T. Chiu
发表
D. Bhate,
D. Chan,
G. Subbarayan,
2007
.
T. Chiu,
D. Edwards,
K. Zeng,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
D. Bhate,
D. Chan,
G. Subbarayan,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Y. Lai,
T. Chiu,
Che-Li Gung,
2011,
IEEE Transactions on Device and Materials Reliability.
T. Chiu,
Tei-Chen Chen,
S. Jian,
2018
.
Y. Lai,
T. Chiu,
Tei-Chen Chen,
2014
.
T. Chiu,
Tei-Chen Chen,
C. Hung,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
T. Chiu,
Huang-Chun Lin,
2009
.
Tao-Chih Chang,
T. Chiu,
C. Ku,
2015,
Journal of Electronic Materials.
F. Erdogan,
T. Chiu,
1999
.
T. Chiu,
C. Chuang,
K. J. Chen,
2020
.
T. Chiu,
Chi-An Hua,
W. Lu,
2018,
International Journal of Fatigue.
F. Erdogan,
T. Chiu,
2003
.
S. W. Tsai,
T. Chiu,
C. Chue,
2014
.
T. Chiu,
C.-H. Chen,
Y. Lai,
2014
.
T. Chiu,
Huang-Chun Lin,
2008,
IEEE Transactions on Components and Packaging Technologies.
T. Chiu,
M. Shih,
Dao-Long Chen,
2017,
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
T. Chiu,
C. Kao,
Ping-Feng Yang,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
T. Chiu,
C. Chue,
S. Tsai,
2013
.
T. Chiu,
C. Chue,
S. Tsai,
2013,
Journal of Engineering Mathematics.
T. Chiu,
Chang Liu,
2023,
European Journal of Mechanics - A/Solids.
T. Chiu,
C. Chen,
Y. Lai,
2014,
Acta Mechanica.
T. Chiu,
Huang-Chun Lin,
Hung-Chun Yang,
2008,
2008 International Conference on Electronic Materials and Packaging.
T. Chiu,
2000
.
F. Erdogan,
T. Chiu,
2003
.
T. Chiu,
M. Shih,
Dao-Long Chen,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
T. Chiu,
H. Yang,
2010,
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
T. Chiu,
Hung-Chun Yang,
2021
.
Kazuaki Ano,
Darvin R. Edwards,
King-Ning Tu,
2005
.
V. Gupta,
G. Subbarayan,
D. Bhate,
2008,
IEEE Transactions on Components and Packaging Technologies.
T. Chiu,
H. Yang,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
T. Chiu,
C. Hung,
C. Kao,
2014,
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Tao-Chih Chang,
T. Chiu,
C. Ku,
2013,
Journal of Electronic Materials.
Vikas Gupta,
Hung-Chun Yang,
Jyun-Ji Lin,
2010,
Microelectronics Reliability.
T. Chiu,
Vikas Gupta,
D. Edwards,
2010,
2010 12th Electronics Packaging Technology Conference.
T. Chiu,
D. Edwards,
Mudasir Ahmad,
2010,
IEEE Transactions on Device and Materials Reliability.
T. Chiu,
Chien-Yu Wang,
2022,
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Y. Lai,
T. Chiu,
Yao-Yu Chan,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Cemal Basaran,
Flavio Canavero,
Ephraim Suhir,
2010
.
Tz-Cheng Chiu,
En-Yu Yeh,
T. Chiu,
2018,
Microelectron. Reliab..
T. Chiu,
Yu-Jen Chen,
Yuqing Deng,
2018,
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Wei Lu,
T. Chiu,
Chi-An Hua,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
T. Chiu,
Shoudong Zhu,
G. Shen,
2010,
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
T. Chiu,
Li-Ying Hsieh,
H. Yang,
2011,
Impact.
Yu-Ting Yang,
Tz-Cheng Chiu,
Bo-Sheng Lee,
2015,
Microelectron. Reliab..
T. Chiu,
Kuo-Shen Chen,
Tian-Shiang Yang,
2017,
Microsystem Technologies.
T. Chiu,
Kuo-Shen Chen,
Tian-Shiang Yang,
2016,
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
Chang-Da Wen,
T. Chiu,
Kuo-Shen Chen,
2016
.
Chang-Da Wen,
T. Chiu,
Kuo-Shen Chen,
2015
.
Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package
T. Chiu,
M. Shih,
Dao-Long Chen,
2019,
Impact.
T. Chiu,
Wei-Jie Yin,
C. Kao,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
T. Chiu,
Yu-Chen Chang,
Y. Tseng,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Chiu,
Chunyu Wu,
2021,
Impact.
A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
T. Chiu,
C. Yang,
Dao-Long Chen,
2021,
Electronic Components and Technology Conference.
T. Chiu,
Hung-Chun Yang,
2021,
Computer Modeling in Engineering & Sciences.
T. Chiu,
Wei-Jie Yin,
Dao-Long Chen,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
T. Chiu,
Kuo-Shen Chen,
Ching-Jenq Ho,
2019,
2019 International Conference on Electronics Packaging (ICEP).
Yi-Shao Lai,
Hong-Wei Huang,
Tz-Cheng Chiu,
2011,
Microelectron. Reliab..