J. Chu

发表

J. Chu, Xiang Lei, Huai Zheng, 2016, IEEE Transactions on Electron Devices.

J. Chu, Xiang Lei, Jiading Wu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

J. Chu, Jiading Wu, Huai Zheng, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

J. Chu, Xiang Lei, Huai Zheng, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

J. Chu, Huai Zheng, Xiaoliang Zeng, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).