Chien-Yi Huang

发表

Minimising makespan in distributed permutation flowshops using a modified iterated greedy algorithm

Shih-Wei Lin, K. Ying, Chien-Yi Huang, 2013 .

Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis

K. Ying, Chien-Yi Huang, Hui-Hua Huang, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design criteria for pad and stencil with high pick-and-Place yield

Chien-Yi Huang, Christopher Greene, Chao-Chieh Chan, 2021, Soldering & Surface Mount Technology.

A Lean Manufacturing Progress Model and Implementation for SMEs in the Metal Products Industry

Chien-Yi Huang, Dasheng Lee, Shuanfa Chen, 2022, Processes.

Evaluating the Sustainable Operating Performance of Electronics Industry Groups: Taiwanese Firms in Mainland China

Chien-Yi Huang, Shu-Chuan Chen, Damien Lee, 2021, Sustainability.

5G Digital Twin: A Study of Enabling Technologies

Chien-Yi Huang, Ramiro Ramirez, Shunjian Liang, 2022, Applied Sciences.

Innovative parametric design for environmentally conscious adhesive dispensing process

Chien-Yi Huang, Chien-Yi Huang, 2015, J. Intell. Manuf..

Applying data mining methodology to establish an intelligent decision system for PCBA process

Chien-Yi Huang, Marvin Ruano, Ching-Hsiang Chen, 2019, Soldering & Surface Mount Technology.

Applying strain gauges to measuring thermal warpage of printed circuit boards

K. Ying, Chien-Yi Huang, 2017 .

EXPLORING CONSUMER BEHAVIOR OF THAI MILLENNIALS TOWARDS BUYING CONSUMER ELECTRONICS ONLINE

Chien-Yi Huang, Amondech Inkaew, 2019 .

Process optimization of SnCuNi soldering material using artificial parametric design

Chien-Yi Huang, Hui-Hua Huang, 2012, Journal of Intelligent Manufacturing.

Materials Assessment and Process Characterization for Lead- Free Soldering

Chien-Yi Huang, Cheng-I Chang, H. Hsieh, 2013 .

The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction

Chien-Yi Huang, Kuo-Ching Ying, Yueh‐Hsun Lin, 2011 .

A grey-ANN approach for optimizing the QFN component assembly process for smart phone application

Chien-Yi Huang, Ching-Hsiang Chen, Yueh-Hsun Lin, 2016 .

USING PARAMETRIC DESIGN TO REDUCE THE EMI OF ELECTRONICS PRODUCTS - EXAMPLE OF MEDICAL-GRADE TOUCH PANEL COMPUTER

Chien-Yi Huang, Ching-Hsiang Chen, C. M. Greene, 2019, Progress In Electromagnetics Research C.

The synergy of QFD and TRIZ for solving EMC problems in electrical products – a case study for the Notebook PC

Chien-Yi Huang, Ching-Hsiang Chen, Chien-Yi Huang, 2015 .

Multiprocessor task scheduling in multistage hybrid flowshops: A hybrid artificial bee colony algorithm with bi-directional planning

Shih-Wei Lin, Chien-Yi Huang, Kuo-Ching Ying, 2013, Comput. Oper. Res..

The investigation of the capillary flow of underfill materials

Chien-Yi Huang, C. Y. Huang, 2002 .

Minimizing total flow time in permutation flowshop environment

Chung-Cheng Lu, Shih-Wei Lin, Chien-Yi Huang, 2012 .

A Practice of BLE RSSI Measurement for Indoor Positioning

Ramiro Ramirez, Chien-Yi Huang, Che-An Liao, 2021, Sensors.

Process optimization of SnCuNi soldering material using artificial parametric design

Chien-Yi Huang, Hui-Hua Huang, Chien-Yi Huang, 2014, J. Intell. Manuf..

A Novel Approach to Service Design within the Tourism Industry: Creating a Travel Package with AHP-TRIZ Integration

Chien-Yi Huang, Marvin Ruano, 2023, Syst..

Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process

Chien-Yi Huang, Kuo-Ching Ying, K. Ying, 2019, J. Intell. Manuf..

Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process

K. Ying, Chien-Yi Huang, 2018, Journal of Intelligent Manufacturing.

Enhancing Sustainability in Belize’s Ecotourism Sector: A Fuzzy Delphi and Fuzzy DEMATEL Investigation of Key Indicators

Chien-Yi Huang, P. Nguyen, Marvin Ruano, 2023, Mathematics.

Decreasing the System Testing Makespan in a Computer Manufacturing Company

Shih-Wei Lin, Chien-Yi Huang, Kuo-Ching Ying, 2018, IEEE Access.

Developing a Rework Process for Underfilled Electronics Components via Integration of TRIZ and Cluster Analysis

Chien-Yi Huang, Yueh-Hsun Lin, Pei-Fang Tsai, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module

Chien-Yi Huang, Ting-Hsuan Wu, Christopher M. Greene, 2020 .

The reliability assessment of flip chip components

Chien-Yi Huang, C. Y. Huang, 2004 .

Chemical characterization of failures and process materials for microelectronics assembly

Chen-Liang Ku, Hao-Chun Hsieh, Chien-Yi Huang, 2009 .

Sequencing single-machine tardiness problems with sequence dependent setup times using an iterated greedy heuristic

Shih-Wei Lin, Chien-Yi Huang, Kuo-Ching Ying, 2009, Expert Syst. Appl..

A breakthrough product R&D model by using the integration of four-phases QFDs and TRIZ

Ful-Chiang Wu, Chien-Yi Huang, Chi-Hao Yeh, 2011, Proceedings of 2011 International Conference on Modelling, Identification and Control.

Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network

Chien-Yi Huang, Ching-Hsiang Chen, Yan-Ci Huang, 2021, Microelectronics International.