Tae-Gon Kim

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

O. O. Okudur, Andy Miller, G. Beyer, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Pt-doped Ni-silicide films formed by pulsed-laser annealing: Microstructural evolution and thermally robust Ni1-xPtxSi2 formation

Hyoungsub Kim, Ilgyou Shin, Tae-Gon Kim, 2019, Journal of Alloys and Compounds.

Strength analysis of EUV-exposed photo resists by AFM at 40nm half pitch and below

Roel Gronheid, Gustaf Winroth, Tae-Gon Kim, 2012 .