H. Kuruveettil
发表
Jing Li,
D. Pinjala,
Teck Guan Lim,
2009,
IEEE Transactions on Advanced Packaging.
Jing Li,
Teck Guan Lim,
K. Suzuki,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Yang Rui,
A.P. Popov,
Lim Ying Ying,
2008,
IEEE Transactions on Advanced Packaging.
J. Lau,
P. Ramana,
T. Shioda,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.