B. Beihoff

Magnetoelastic effects in amorphous wires and amorphous ribbons with nonmagnetic thin‐film coatings

M. Wun-Fogle, H. Savage, L. Kabacoff, 1988 .

Packaging of integrated solid-state power assembly cells: a thermomechanics-based approach

M. C. Shaw, B. C. Beihoff, B. Beihoff, 2001, Proc. IEEE.

Electronics Package Reliability and Failure Analysis: A Micromechanics Based Approach

B. Beihoff, Peter Stipan, Michael Shaw, 1999 .

1.3.3 Systems of Innovation I: Summary Models of SOI Health and Pathologies

Bruce C. Beihoff, William D. Schindel, B. Beihoff, 2012 .

Laminated steel eddy-current loss versus frequency computed using finite elements

Z. J. Cendes, J. R. Brauer, B. C. Beihoff, 2000 .

Investigation of parallel operation of IGBTs

G. Venkataramanan, J.J. Nelson, B.C. Beihoff, 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).