B. Xie
发表
S. Rokhlin,
B. Xie,
A. Baltazar,
2004
.
B. Xie,
Bin Xie,
Han Ding,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
Xuejun Fan,
Daniel Shi,
B. Xie,
2008,
2008 58th Electronic Components and Technology Conference.
L Wang,
S. Rokhlin,
B. Xie,
2003,
The Journal of the Acoustical Society of America.
S. Rokhlin,
B. Xie,
L. Wang,
2002,
The Journal of the Acoustical Society of America.
S. Rokhlin,
B. Xie,
A. Baltazar,
2001
.
B. Xie,
Bin Xie,
Han Ding,
2007,
IEEE Transactions on Components and Packaging Technologies.
B. Xie,
Han Ding,
Xunqing Shi,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
B. Xie,
X. Shi,
Xuejun Fan,
2010
.
B. Xie,
X. Shi,
Xuejun Fan,
2010
.
B. Xie,
Xuejun Fan,
Xunqing Shi,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Changguo Lu,
B. Xie,
Jiajia Sun,
2015
.
X. Sheng,
Lei Jia,
B. Xie,
2005,
2005 6th International Conference on Electronic Packaging Technology.
Xuejun Fan,
B. Xie,
B. Xie,
2010
.
Xunqing Shi,
Xuejun Fan,
B. Xie,
2009
.
B. Xie,
Xuejun Fan,
Xunqing Shi,
2007,
2007 9th Electronics Packaging Technology Conference.
L Wang,
S. Rokhlin,
B. Xie,
2004,
Ultrasonics.
B. Xie,
X.Q. Shi,
H. Ding,
2008,
IEEE Transactions on Components and Packaging Technologies.
Pei Chen,
Bin Xie,
Fei Qin,
2016,
Microelectron. Reliab..
M. Ferrari,
P. Decuzzi,
S. Rokhlin,
2006
.
Mauro Ferrari,
M. Ferrari,
S. Rokhlin,
2005,
Technology in cancer research & treatment.
J.-Y. Kim,
Stanislav I. Rokhlin,
B. Zoofan,
2007
.