Y. Lin
发表
M. Tsai,
Y. Lin,
J.D. Wu,
2004,
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..
Y. Lin,
L. Horng,
S. Chen,
2006,
2006 IEEE Conference on Emerging Technologies - Nanoelectronics.
Y. Lin,
Xu Chen,
Z.P. Wang,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Y. Lin,
K. Liao,
S. Leu,
2014
.
Y. Lin,
H.-W. Chen,
Y-L. Chen,
2016
.
Y. Lin,
N. Kotkunde,
D. He,
2019,
Advanced Engineering Materials.
Multi-scale characterization of deformation features and precipitation behavior in a near β-Ti alloy
Y. Lin,
Chao Chen,
K. Zhou,
2020
.
Y. Lin,
Shiyong Chen,
Cheng-bo Li,
2022,
Materials Today Communications.
Y. Lin,
Ming-Song Chen,
Yu-Qiang Jiang,
2021,
Journal of Alloys and Compounds.
Y. Lin,
Y. Lin,
K. Zhou,
2020
.
Y. Lin,
Y. Lin,
K. Zhou,
2020
.
Y. Lin,
K. Zhou,
Xiaoyong Zhang,
2022,
Materials Science and Engineering: A.
Y. Lin,
Yan-Xing Liu,
2018,
High Temperature Materials and Processes.
Y. Lin,
Ming-Song Chen,
D. He,
2021,
Materials Science and Engineering: A.
Y. Lin,
Ming-Song Chen,
Yanyong Ma,
2021
.
Y. Lin,
Y. Lin,
D. He,
2019,
Vacuum.
Y. Lin,
Yu-min Lou,
Ming-Song Chen,
2022,
Journal of Alloys and Compounds.
Y. Lin,
D. He,
Xintao Yan,
2022,
Journal of Alloys and Compounds.
Y. Lin,
W. Lee,
2006
.
Y. Lin,
S. Lai,
2006
.
Y. Lin,
Y. Lin,
Jian Chen,
2019
.
Y. Lin,
Hua-Min Zhou,
C. Phaniraj,
2013
.
Y. Lin,
Yu-min Lou,
Ming-Song Chen,
2022,
Materials Science and Engineering: A.
Y. Lin,
Swadesh Kumar Singh,
Y. Lin,
2020
.
Y. Lin,
S. Chern,
C. Lee,
2015
.
Y. Lin,
Shipu Chen,
D. He,
2023,
Journal of Materials Research and Technology.
Xu Chen,
Y. Lin,
Xu Chen,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Y. Lin,
Qiumei Yang,
Zi-Jian Chen,
2023,
Journal of Alloys and Compounds.
Y. Lin,
Chao Chen,
K. Zhou,
2020
.
Jun Zhang,
Y. Lin,
Liugang Huang,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Y. Lin,
Xin Yan,
D. He,
2023,
Journal of Materials Research and Technology.
Y. Lin,
M. Chen,
D. Wen,
2013
.