D. Agonafer

发表

Design of polymer tube embedded in-plane micropump

H. Stephanou, D. Popa, W. Lee, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Electro-Thermal Analysis of In-Plane Micropump

Smitha M. N. Rao, H. Stephanou, D. Popa, 2010, IEEE Transactions on Components and Packaging Technologies.

Flip chip back end design parameters to reduce bump electromigration

D. Agonafer, S. Karajgikar, V. Nagaraj, 2008, 2008 58th Electronic Components and Technology Conference.

A Brief Overview of Recent Developments in Thermal Management in Data Centers

K. Ghose, B. Sammakia, Y. Joshi, 2015 .

CFD Investigation of Dispersion of Airborne Particulate Contaminants in a Raised Floor Data Center

D. Agonafer, S. Saini, Pardeep Shahi, 2020, 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Low Reynolds number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors

Dereje Agonafer, Junghoon Yeom, Mark A. Shannon, 2009 .

Fluxless optical fiber attachment for hermetic MOEMS applications

Jeongsik Sin, D. Agonafer, H. Beardsley, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

D. Agonafer, M. Sahini, Chinmay Kshirsagar, 2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Thermal Model of a PC

Dereje Agonafer, Ronald L. Linton, D. Agonafer, 1994 .

Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study

A. R. Nazmus Sakib, D. Agonafer, Zaeem Baig, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process

Hardik M. Parekh, D. Agonafer, F. Mirza, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

MULTI-OBJECTIVE DESIGN OPTIMIZATION OF BEoL / fBEoL REGION DURING CHIP ATTACHMENT TO SUBSTRATE by HARDIK PAREKH

Hardik M. Parekh, D. Agonafer, F. Mirza, 2013 .

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

D. Agonafer, A. Jain, F. Mirza, 2014 .

Numerical methodology for analysis of card on board packages

Dereje Agonafer, R. C. Chu, D. Agonafer, 1990 .

Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions

D. Agonafer, J. Fernandes, Ashwin Siddarth, 2017 .

Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

D. Agonafer, L. Nguyen, Abel Misrak, 2018 .

Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

D. Agonafer, L. Nguyen, S. Krishnamurthy, 2017, 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling by HASSAAN

Hassaan Ahmad Khan, D. Agonafer, A. Khan, 2015 .

Application of the integrated volume visualization system (IVS) to electronic cooling

Koji Koyamada, Dereje Agonafer, K. Koyamada, 1993 .

Solution of a system-level benchmark problem in electronics cooling

Dereje Agonafer, Ronald L. Linton, D. Agonafer, 1994 .

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

Furat Afram, Bahgat Sammakia, Kanad Ghose, 2013 .

Expanding the envelope for indirect/direct evaporative data center cooling using thermal energy storage

D. Agonafer, Abhishek Guhe, J. Luttrell, 2016, 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication

Harry E. Stephanou, Dereje Agonafer, Jeongsik Sin, 2005 .

Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation

Dereje Agonafer, John Fernandes, Richard Eiland, 2017 .

Effectiveness of Rack-Level Fans: Part II - Control Strategies and System Redundancy

Dereje Agonafer, John Fernandes, Richard Eiland, 2017 .

Improving cooling efficiency of servers by replacing smaller chassis enclosed fans with larger rack-mount fans

Dereje Agonafer, Richard Eiland, Veerendra Mulay, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Design for Reliability Applied to Packaging of a MOEMS Switch

Harry E. Stephanou, Dan O. Popa, Manoj Mittal, 2008 .

Effect of flip chip package architecture on stresses in the bump passivation opening

D. Agonafer, S. Karajgikar, V. Nagaraj, 2009, 2009 59th Electronic Components and Technology Conference.

Thermo-Mechanical Challenges in Stacked Packaging

Dereje Agonafer, Abhijit Kaisare, Terry Dishongh, 2008 .

Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices

T. Dishongh, M.M. Hossain, Yongje Lee, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Reliability of stack packaging varying the die stacking architectures for flash memory applications

T. Dishongh, D. Agonafer, S. Pekin, 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling

T. Reinikainen, D. Agonafer, P. Viswanadham, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Design optimization and reliability of PWB level electronic package

D. Agonafer, S.G. Jagarkal, M.M. Hossain, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Steady-state heat conduction in multi-layer bodies

James V. Beck, Dereje Agonafer, A. Haji-Sheikh, 2003 .

Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test

D. Agonafer, Tushar Chauhan, A. Lakshminarayana, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces

D. Agonafer, A. Haji-Sheikh, A.G. Agwu Nnanna, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Determination of steady state temperature in a two-layer body with different form factors

Dereje Agonafer, A. Haji-Sheikh, S. Ghalambor, 2012 .

Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications

D. Agonafer, M. Vujosevic, F. Mirza, 2021 .

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Dereje Agonafer, Wonkee Ahn, Shlomo Novotny, 2004 .

A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials

Partha Pratim Das, D. Agonafer, Monjur Morshed Rabby, 2021, Materials.

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

A. Nnanna, A. Haji-sheikh, D. Agonafer, 2003 .

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

D. Agonafer, Rajesh Kasukurthy, Amruthavalli Rachakonda, 2020 .

A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level

D. Agonafer, S. Saini, Pardeep Shahi, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

D. Agonafer, Tushar Chauhan, Abel Misrak, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, D. Agonafer, Ashwin Siddarth, 2019, Journal of Electronic Packaging.

Flow Analysis and Linearization of Rectangular Butterfly Valve Flow Control Device for Liquid Cooling

D. Agonafer, B. Manimaran, Rajesh Kasukurthy, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

D. Agonafer, Ashwin Siddarth, M. Sahini, 2017 .

Rack-level study of hybrid cooled servers using warm water cooling for distributed vs. centralized pumping systems

Manasa Sahini, Dereje Agonafer, Jacob Na, 2017, 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil

Dereje Agonafer, Richard Eiland, John Fernandes, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications

V. Kamath, D. Agonafer, R. Schmidt, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Global-local finite element optimization study to minimize BGA damage under thermal cycling

Fahad Mirza, Dereje Agonafer, Abhishek Deshpande, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Solar shroud design using Computational Fluid Dynamics

Dereje Agonafer, Keduse P. Agonafer, Nikhil Lakhkar, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Jimil M. Shah, D. Agonafer, Pratik V. Bansode, 2019, Journal of Electronic Packaging.

Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment

Manasa Sahini, Dereje Agonafer, Ashwin Siddarth, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Method for Determining a Dynamical State–Space Model for Control of Thermal MEMS Devices

F.L. Lewis, D. Agonafer, B. Borovic, 2005, Journal of Microelectromechanical Systems.

Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling

Luu T. Nguyen, Dereje Agonafer, Pavan Rajmane, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

CFD Optimization of the Cooling of Yosemite Open Compute Server

Aditya Gupta, Dereje Agonafer, Ananthavijayan Sridhar, 2017 .

Conjugate Model of a Pin-Fin Heat Sink Using a Hybrid Conductance and CFD Model Within an Integrated Mcae Tool

Dereje Agonafer, Arnold Free, D. Agonafer, 1997 .

CFD Simulation and Optimization of the Cooling of Open Compute Machine Learning “Big Sur” Server

Dereje Agonafer, Jimil M. Shah, Mangesh Dhadve, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

D. Agonafer, Tushar Chauhan, Abel Misrak, 2020, Journal of Electronic Packaging.

Artificial Neural Network Based Prediction of Control Strategies for Multiple Air-Cooling Units in a Raised-floor Data Center

Dereje Agonafer, Ashwin Siddarth, Vibin Shalom Simon, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling

Dereje Agonafer, Pavan Rajmane, Unique Rahangdale, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

D. Agonafer, Abel Misrak, Unique Rahangdale, 2017, 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO).

Power consumption minimization in hybrid cooled server by fan reduction

Dereje Agonafer, Uschas Chowdhury, Md Malekkul Islam, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations

Dereje Agonafer, Jimil M. Shah, Ashwin Siddarth, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Dereje Agonafer, Rajesh Kasukurthy, Satyam Saini, 2021, Journal of Electronic Packaging.

Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid

D. Agonafer, Amirreza Niazmand, S. Saini, 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

D. Agonafer, Amirreza Niazmand, S. Saini, 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware

D. Agonafer, Amirreza Niazmand, S. Saini, 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

D. Agonafer, Amirreza Niazmand, S. Saini, 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

Jimil M. Shah, D. Agonafer, S. Saini, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Jimil M. Shah, D. Agonafer, S. Saini, 2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

Jimil M. Shah, D. Agonafer, S. Saini, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, D. Agonafer, Pratik V. Bansode, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, D. Agonafer, S. Saini, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Jimil M. Shah, D. Agonafer, S. Saini, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Jimil M. Shah, D. Agonafer, Pratik V. Bansode, 2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Design considerations relating to non-thermal aspects of oil immersion cooling

Dereje Agonafer, Jimil M. Shah, Syed Haider I. Rizvi, 2016 .

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Dereje Agonafer, Jimil M. Shah, Satyam Saini, 2021, Journal of Electronic Packaging.

Design and CFD analysis of a tank solution for natural convection based single-phase immersion cooling of servers

D. Agonafer, Michael Bozlar, Pardeep Shahi, 2021 .

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, D. Agonafer, S. Saini, 2020 .

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Jimil M. Shah, D. Agonafer, Prabjit Singh, 2020, Journal of Electronic Packaging.

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, D. Agonafer, Abel Misrak, 2019, Journal of Electronic Packaging.

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Jimil M. Shah, D. Agonafer, B. Gebrehiwot, 2017 .

Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer

Dereje Agonafer, Jimil M. Shah, Prabjit Singh, 2016 .

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Levente J. Klein, Dereje Agonafer, Jimil M. Shah, 2015 .

Factors that affect the performance characteristics of wet cooling pads for data center applications

Suhas Sathyanarayan, Dereje Agonafer, Betsegaw Gebrehiwot, 2015, 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric

Dereje Agonafer, Huy N Phan, D. Agonafer, 2010, 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Hot spot mitigation using single-phase microchannel cooling for microprocessors

Gamal Refai-Ahmed, B. Sammakia, Dereje Agonafer, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance

Dereje Agonafer, A. Haji-Sheikh, S. Ghalambor, 2013 .

Analysing real time power of the microprocessor to estimate thermal time constant of the hotspot

B. Sammakia, D. Agonafer, A. Chauhan, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Multi-scale thermal analysis of electronics packaging

Dereje Agonafer, A. J. Przekwas, Y. G. Lai, 1994 .