B. Han

发表

Phase-shifting in achromatic moiré interferometry system.

Changwoon Han, B. Han, 2007, Optics express.

High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials

P. Ifju, B. Han, D. Post, 1995 .

Recent Applications of Moiré Interferometry

Bongtae Han, Peter Ifju, P. Ifju, 2010 .

Study of Thermal Aging Behavior of Epoxy Molding Compound for Applications in Harsh Environments

B. Han, A. Inamdar, A. Prisacaru, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

B. Han, A. Prisacaru, P. Gromala, 2019, IEEE Sensors Journal.

Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation

B. Han, Yu-Hsiang Yang, Bulong Wu, 2018, Acta Materialia.

Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions

Bongtae Han, Przemyslaw Jakub Gromala, Alicja Palczynska, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

Bongtae Han, Changsoo Jang, A. Goswami, 2009, Journal of Microelectromechanical Systems.

Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods

Bongtae Han, B. Han, 2007 .

High Sensitivity Shadow Moiré Using Nonzero-Order Talbot Distance

Bongtae Han, B. Han, C. Han, 2006 .

Strain Measurements At The Limit - The Moir´e Microscope

B. Han, T. Shield, 2003 .

Measurement of the hygroscopic swelling coefficient in mold compounds using moiré interferometry

Bongtae Han, Michael Pecht, E. Stellrecht, 2003 .

THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS

Bongtae Han, B. Han, 2003 .

Effect Of Underfill On Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moiré Interferometry

B. Han, S. Cho, S. Cho, 2002 .

Effect Of Underfill On Flip-Chip Solder Bumps : An Experimental Study By Microscopic Moiré Interferometry

B. Han, S. Cho, S. Cho, 2002 .

Measurement of thermal expansion coefficient of flexible substrate by moiré interferometry

B. Han, Seungmin Cho, Z. Wu, 2001 .

Effect of underfill on flip-chip solder bumps: An experimental study by microscopic moiré interferometry

B. Han, S. Cho, S. Cho, 2001 .

On the design parameters of flip-chip PBGA package assembly for optimum solder ball reliability

Bongtae Han, Seungbae Park, Kaushal Verma, 2001 .

Moiré Methods for Engineering and Science — Moiré Interferometry and Shadow Moiré

Bongtae Han, Peter Ifju, Daniel Post, 2000 .

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

Bongtae Han, K. Verma, B. Han, 2000 .

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Bongtae Han, B. Han, P. Kunthong, 2000 .

Effect of underfill on C4 bumps and surface laminar circuit : An experimental study by microscopic Moiré interferometry

B. Han, K. Verma, P. Kunthong, 1999 .

Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package

Bongtae Han, D. Columbus, K. Verma, 1999 .

Study of Residual Stress Distribution by a Combined Method of Moiré Interferometry and Incremental Hole Drilling, Part I: Theory

Jian Lu, Bongtae Han, Jian Lu, 1998 .

Study of Residual Stress Distribution by a Combined Method of Moiré Interferometry and Incremental Hole Drilling, Part II: Implementation

Jian Lu, Bongtae Han, Jian Lu, 1998 .

Recent advancements of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices

Bongtae Han, B. Han, 1998 .

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

Bongtae Han, Yifan Guo, D. V. Caletka, 1996 .

Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability

Myung K. Kim, B. Han, Young-Gon Kim, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Micromechanical thermal deformation analysis of unidirectional boron/aluminum metal-matrix composite

Bongtae Han, B. Han, 1996 .

Determination of an effective coefficient of thermal expansion of electronic packaging components: a whole-field approach

Bongtae Han, Yifan Guo, B. Han, 1996 .

Micromechanical deformation analysis of beta alloy titanium in elastic and elastic/plastic tension

Bongtae Han, B. Han, 1996 .

Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry

Bongtae Han, Yifan Guo, B. Han, 1995 .

A compact, robust and versatile moiré interferometer

Bongtae Han, Peter Ifju, P. Ifju, 1995 .

Thermal Characterization of Die-Attach Material Interface of High-Power Light-Emitting Diodes

B. Han, Dae-Suk Kim, 2018 .

Inverse approach to characterize die-attach thermal interface of light emitting diodes

A. Bar-Cohen, B. Han, Dae-Suk Kim, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse Approach

A. Bar-Cohen, B. Han, Dae-Suk Kim, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermal Deformations in Electronic Packaging

P. Ifju, B. Han, D. Post, 1994 .

Thermo-mechanical and flexural behavior of WB-PBGA package using moire interferometry

B. Han, J. Joo, Seungmin Cho, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

B. Han, J. Joo, Seungmin Cho, 2004 .

High sensitivity moiré

Bongtae Han, Peter Ifju, Daniel Post, 1994 .

Analytical/Experimental Hybrid Approach Based on Spectral Power Distribution for Quantitative Degradation Analysis of Phosphor Converted LED

Bongtae Han, Bong-Min Song, B. Han, 2014, IEEE Transactions on Device and Materials Reliability.

Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

B. Han, S. Phansalkar, Chang-Bum Kim, 2022, Microelectronics Reliability.

Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolutions at Arbitrary Temperatures

B. Han, C. Jang, Y. Sun, 2013 .

Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions During Polymerization

Bongtae Han, B. Han, Y. Wang, 2011 .

Simultaneous measurements of effective chemical shrinkage and modulus evolution during polymerization

A. Bar-Cohen, B. Han, Yong Wang, 2008, 2008 58th Electronic Components and Technology Conference.

Moiré Interfe 22 . Moiré Interferometry

B. Han, D. Post, 2022 .

Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages

B. Han, C. Jang, 2010 .

Thermo-Optic Effects in Polymer Bragg Gratings

Bongtae Han, Avram Bar-Cohen, A. Bar-Cohen, 2007 .

High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

B. Han, A. Inamdar, A. Prisacaru, 2021 .

Out-Of-Plane Deformation, Flatness And Shape Measurement

A. Asundi, P. Ifju, B. Han, 2003 .

Thermofluid characteristics of two-phase flow in micro-gap channels

A. Bar-Cohen, B. Han, E. Rahim, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

B. Han, Dae-Suk Kim, 2017 .

Analytical solutions of gas transport problems in inorganic/organic hybrid structures for gas barrier applications

B. Han, C. Jang, 2009 .

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Samson Yoon, B. Han, C. Jang, 2007 .

Dual-Configuration Fiber Bragg Grating Sensor Technique to Measure Coefficients of Thermal Expansion and Hygroscopic Swelling

Y. Kim, B. Han, Y. Sun, 2014 .

Nano-Pattern Recognition and Correlation Technique for Sub-Nanometer In-Plane Displacement Measurement

B. Han, C. Jang, H. Bi, 2010 .

Contrast of shadow moiré at high-order Talbot distances

Changwoon Han, B. Han, 2005 .

Real-time Observation of Thermally Induced Warpage of Flip-chip Package Using Far-infrared Fizeau Interferometry by K. Verma and B. Han

B. Han, 2004 .

Effect of junction temperature on heat dissipation of high power light emitting diodes

B. Han, Dae-Suk Kim, 2016 .

Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor

B. Han, Yong Sun, Hyun-Seop Lee, 2017 .

Characterization of effective chemical shrinkage and modulus evolution during polymerization

B. Han, Yong Wang, 2007 .

Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

B. Han, H. Lee, Yong Sun, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Advanced Statistical Model Calibration to Determine Manufacturing-Induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies

B. Han, Yu-Hsiang Yang, Hsiu-Ping Wei, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Test Scheme and Degradation Model of Accumulated Electrostatic Discharge (ESD) Damage for Insulated Gate Bipolar Transistor (IGBT) Prognostics

Chan Hee Park, B. Youn, B. Han, 2019, IEEE Transactions on Device and Materials Reliability.

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

M. Osterman, B. Han, Yong Sun, 2014 .

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

B. Han, D. Rosen, Kenny Mahan, 2016 .

AFRL-RY-WP-TR-2017-0151 THERMAL AND THERMO-MECHANICAL CHARACTERISTICS OF CRYOGENIC MICROCOOLER FOR OPTIMUM PERFORMANCE AND RELIABILITY

B. Han, 2017 .

Measurement of effective chemical shrinkage and equilibrium modulus of silicone elastomer used in potted electronic system

B. Han, A. Dasgupta, E. Parsa, 2014, Journal of Materials Science.

Method for predicting junction temperature distribution in a high-power laser diode bar.

A. Bar-Cohen, B. Han, Dae-Suk Kim, 2016, Applied optics.

Analytical Model for Thermal Warpage History of Laminated PBGAs

B. Han, A. Dasgupta, N. Keller, 2008 .

Generalized hybrid modeling to estimate chemical shrinkage and modulus evolution at arbitrary temperatures

B. Han, Yong Wang, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Elements of Optics

P. Ifju, B. Han, D. Post, 1994 .

Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

B. Han, J. Schumacher, B. Wu, 2019, Experimental Mechanics.

Nonlinear Compressible Finite Viscoleasticity of Epoxy-Based Polymers

B. Han, F. Welschinger, P. Gromala, 2019, Constitutive Models for Rubber XI.

Non-linear Viscoelastic Modeling of Epoxy Based Molding Compound for Large Deformations Encountered in Power Modules

B. Han, A. Prisacaru, P. Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Bongtae Han, Samson Yoon, Zhaoyang Wang, 2007 .

Determination of Adhesion Strength of EMC/PSR Interface in Thin Packages Using Modified Offset Single Cantilever Adhesion Test

B. Han, Kenny Mahan, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Bongtae Han, Ilho Kim, Byung Kim, 2016, Microelectron. Reliab..

Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review

B. Han, Kenny Mahan, 2014 .

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Bongtae Han, Changsoo Jang, Samson Yoon, 2008 .

Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses

Bongtae Han, Seungmin Cho, Samson Yoon, 2005, 2005 7th Electronic Packaging Technology Conference.

Thermofluid Characteristics of Two-Phase Microgap Coolers

A. Bar-Cohen, B. Han, E. Rahim, 2007 .

Advanced iterative algorithm for phase extraction of randomly phase-shifted interferograms.

Bongtae Han, Zhaoyang Wang, Zhaoyang Wang, 2004, Optics letters.

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method

Hsiu-Ping Wei, Bongtae Han, Ilho Kim, 2017, Microelectron. Reliab..

Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study

Bongtae Han, B. Han, 1997 .

Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry

Bongtae Han, Seungmin Cho, Jinwon Joo, 2005, Microelectron. Reliab..

Observing real-time thermal deformations in electronic packaging

Bongtae Han, Seungmin Cho, B. Han, 2002 .

Moiré interferometry for engineering mechanics: Current practices and future developments

Peter Ifju, D. Post, Bongtae Han, 2001 .

Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages

B. Han, 1998 .

Advanced iterative algorithm for randomly phase-shifted interferograms with intra- and inter-frame intensity variations

Bongtae Han, Zhaoyang Wang, Zhaoyang Wang, 2007 .

Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Changwoon Han, B. Han, 2014 .

Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

B. Han, Bulong Wu, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermo-mechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry

B. Han, J. Joo, 2002 .

Thermal Stresses in a Bimaterial Joint: An Experimental Analysis

Bongtae Han, D. Post, V. J. Parks, 1994 .

Measurement of the Comprehensive Viscoelastic Properties of Advanced EMC Using FBG Sensor

Bongtae Han, B. Han, Yong Sun, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

B. Han, C. Jang, 2014 .

Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature

Bongtae Han, Changsoo Jang, Samson Yoon, 2010, IEEE Transactions on Components and Packaging Technologies.

Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode

Bongtae Han, Changsoo Jang, A. Bar-Cohen, 2010, IEEE Transactions on Components and Packaging Technologies.

Characterization of Hygroscopic Deformations by Moiré Interferometry

M. Pecht, B. Han, E. Stellrecht, 2010 .

In situ measurement of gas diffusion properties of polymeric seals used in MEMS packages by optical gas leak testing

Bongtae Han, Changsoo Jang, Suk-Jin Ham, 2009 .

Advanced Co-Planarity Measurement Tools for the Warpage Investigation of Non-Conventional Packages Caused by Reflow and Assembly Process

B. Han, C. Jang, A. Goswami, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern

Zhaoyang Wang, B. Han, M. Mello, 2004 .

Higher sensitivity moire interferometry for micromechanics studies

Bongtae Han, B. Han, 1992 .

Sensitivity enhancement of far-infrared Fizeau interferometry by digital image processing

Bongtae Han, Kaushal Verma, B. Han, 2001 .

Microscopic Moiré Interferometry: Very High Sensitivity

P. Ifju, B. Han, D. Post, 1994 .

Interferometric methods with enhanced sensitivity by optical/digital fringe multiplication.

B. Han, B Han, 1993, Applied optics.

Immersion interferometer for microscopic moiré interferometry

Bongtae Han, D. Post, B. Han, 1992 .

Extension of Moire interferometry into the ultra-high sensitivity domain

B. Han, 1991 .

Error analysis of the phase-shifting technique when applied to shadow moiré.

Bongtae Han, Changwoon Han, Changwoon Han, 2006, Applied optics.

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-Time Moiré Interferometry

B. Han, Bulong Wu, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Simulation Driven Design of Novel Integrated Circuits - Part 4: Method of Validation of Coupled Thermal and Thermo-mechanical Simulation

Bongtae Han, Przemyslaw Gromala, Alicja Palczynska, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit

Bongtae Han, Dae-Suk Kim, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Constant Poisson’s Ratio of Thermosetting Polymers: Is It Reasonable for Accurate Thermal Stress Analysis?

B. Han, S. Phansalkar, H. Lee, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

Bongtae Han, Guo Qi Zhang, Przemyslaw Gromala, 2022, IEEE Transactions on Industrial Electronics.

Electronic control package model calibration using moiré interferometry

Bongtae Han, Dae-Suk Kim, Arjun Yadur, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Advanced Composites Studies

P. Ifju, B. Han, D. Post, 1994 .

Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

Bongtae Han, Guo Qi Zhang, Przemyslaw Jakub Gromala, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Bongtae Han, Tobias Melz, Dirk Mayer, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium-Ion Cells

Bongtae Han, Michael Pecht, Saurabh Saxena, 2019, Energies.

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

Bongtae Han, Byeng D. Youn, Changwoon Han, 2015, IEEE Transactions on Power Electronics.

Direct Submount Cooling of High-Power LEDs

Bongtae Han, Dae-Whan Kim, Avram Bar-Cohen, 2010, IEEE Transactions on Components and Packaging Technologies.

In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor

Bongtae Han, Tobias Melz, Dirk Mayer, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Moisture Transport Through Housing Materials Enclosing Critical Automotive Electronics

B. Han, Bulong Wu, S. G. Yousef, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effect of Horizontal Connection Pipe Length on Gas Holdup and Volumetric Oxygen Transfer Coefficient in External-Loop Airlift Reactor

B. Han, Geun-Ho Choe, Won-Guk Lee, 1990 .

Numerical study on the mixing performance of a ring-type electroosmotic micromixer with different obstacle configurations.

B. Han, Youn-J. Kim, H. Seo, 2012, Journal of nanoscience and nanotechnology.

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Bongtae Han, Seungbae Park, Samson Yoon, 2008 .

Numerical/Experimental Hybrid Approach to Predict Warpage of Thin Advanced Substrates

B. Han, Byung Kim, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Simulation Driven Design of Novel Integrated Circuits -- Physics of Failure Simulation of the Electronic Control Modules for Harsh Environment Application

Bongtae Han, Tobias Melz, Matthias Werner, 2016, Electronic Components and Technology Conference.

Prognostic approaches for the wirebond failure prediction in power semiconductors: A case study using DPAK package

Bongtae Han, Przemyslaw Gromala, Alicja Palczynska, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Forced convection and flow boiling of a dielectric liquid in a foam-filled channel

A. Bar-Cohen, B. Han, D. Kim, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

$In\ Situ$ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Bongtae Han, Guo Qi Zhang, Andreas Theissler, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han, 2020, Journal of Electronic Packaging.

Analytical and molecular simulation study of water condensation behavior in mesopores with closed ends.

B. Han, C. Jang, 2010, The Journal of chemical physics.

In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

Yu-Hsiang Yang, Przemyslaw Jakub Gromala, Bongtae Han, 2020 .

Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes in wind turbines

Bongtae Han, Byeng D. Youn, Yoong-Ho Jung, 2016 .

Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

Samson Yoon, B. Han, C. Jang, 2010, IEEE Transactions on Components and Packaging Technologies.

Prediction of Statistical Distribution of Solder Joint Fatigue Lifetime Using Hybrid Probabilistic Approach

Hsiu-Ping Wei, Bongtae Han, Byeng D. Youn, 2015 .

Spectral power distribution deconvolution scheme for phosphor-converted white light-emitting diode using multiple Gaussian functions.

Bongtae Han, Bong-Min Song, B. Han, 2013, Applied optics.

Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction

R. Tao, B. Han, A. Forster, 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).

Time-dependent Bulk Behavior of Cured Epoxy Molding Compound

B. Han, S. Phansalkar, Roshith Mittakolu, 2023, Electronic Components and Technology Conference.

Measurement of effective cure shrinkage of epoxy‐based molding compound by fiber Bragg grating sensor using two‐stage curing process

B. Han, S. Phansalkar, Hyun-Seop Lee, 2021, Journal of Applied Polymer Science.

Thermal-structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode.

A. Bar-Cohen, B. Han, Kyoung Joon Kim, 2012, Applied optics.

Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows

A. Bar-Cohen, B. Han, Kyoung-Joon Kim, 2021, Applied Sciences.

Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration

Hsiu-Ping Wei, Bongtae Han, Byeng D. Youn, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Reliability Evaluation of Conformal Coatings for Tin Whisker Failure Mitigation in Accelerated Testing Conditions

M. Osterman, B. Han, Kenny Mahan, 2011 .

Geometric moiré methods with enhanced sensitivity by optical/digital fringe multiplication

P. Ifju, B. Han, D. Post, 1993 .