H. Struyf

发表

Atomic layer deposition of Al2O3 on S-passivated Ge

M. Caymax, B. Beckhoff, S. Sioncke, 2011 .

Study on metrology of ERU tuning in TCP reactor, using PVx2 sensor wafer

H. Struyf, A. Milenin, W. Boullart, 2010, 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Demonstration of a cost effective Cu electroless TSV metallization scheme

M. H. van der Veen, F. Inoue, S. Van Huylenbroeck, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

R. A. Miller, K. Rebibis, G. Beyer, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum

K. Devriendt, H. Struyf, L. Teugels, 2021, ECS Journal of Solid State Science and Technology.

Si cap passivation for Ge nMOS applications

Aaron Thean, Nadine Collaert, Laura Nyns, 2013 .

S-passivation of the Ge gate stack: Tuning the gate stack properties by changing the atomic layer deposition oxidant precursor

Laura Nyns, Herbert Struyf, Guy Brammertz, 2011 .

Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)

G. Beyer, E. Sleeckx, H. Dekkers, 2010, 2010 IEEE International Interconnect Technology Conference.

Etch process development for FLARE/sup TM/ for dual damascene architecture using a N/sub 2//O/sub 2/ plasma

G. Beyer, K. Maex, A. Van Ammel, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Metrology for Monitoring and Detecting Process Issues in a TSV Module

H. Bender, K. Vandersmissen, H. Philipsen, 2014 .

Optimizing high frequency ultrasound cleaning in the semiconductor industry

Stefan De Gendt, Marc Hauptmann, Herbert Struyf, 2012, CAV 2012.

Wet Clean Applications in Porous Low‐k Patterning Processes

H. Struyf, G. Vereecke, Q. Le, 2012 .

Effect of energetic ions on plasma damage of porous SiCOH low-k materials

A. Franquet, D. Shamiryan, H. Struyf, 2010 .

Evaluation of plasma damage in blanket and patterned low-k structures by near-field scanning probe microwave microscope: effect of plasma ash chemistry

V. Talanov, H. Struyf, S. De Gendt, 2009, 2009 IEEE International Interconnect Technology Conference.

Removal of Plasma-Modified Low- k Layer Using Dilute HF: Influence of Concentration

H. Struyf, W. Boullart, Q. Le, 2005 .

Towards Fully Aqueous Ozone Wet Strip of 193 nm Photoresist Stack Using UV Pre-Treatments in Low-k Patterning Applications

H. Struyf, S. Gendt, G. Vereecke, 2012 .

Plasma Modification of Porous Low-k Dielectrics

H. Bender, K. Maex, S. Brongersma, 2004 .

Cleaning Requirement in the Thinning Module for 3D-Stacked IC (3D-SIC) Integration

A. Jourdain, K. Wostyn, Y. Travaly, 2012 .

Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

R. A. Miller, K. Rebibis, G. Beyer, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Pore sealing of k 2.0 dielectrics assisted by self-assembled monolayers deposited from vapor phase

J. Swerts, T. Conard, H. Struyf, 2014 .

Process Optimization and Integration of Trimethylsilane-Deposited α-SiC:H and α-SiCO:H Dielectric Thin Films for Damascene Processing

E. Sleeckx, M. V. Hove, K. Maex, 2003 .

Impact of plasma pretreatment and pore size on the sealing of ultra-low-k dielectrics by self-assembled monolayers.

H. Struyf, S. De Feyter, S. Armini, 2014, Langmuir : the ACS journal of surfaces and colloids.

Dielectric reliability of 70nm pitch air-gap interconnect structures

G. Beyer, H. Bender, F. Sebaai, 2011 .

Physical forces exerted by microbubbles on a surface in a traveling wave field.

M. Heyns, H. Struyf, S. De Gendt, 2014, Ultrasonics.

Importance of Bubble Size Control in Ultrasonic Surface Cleaning by Pulsed High-Frequency Sound Fields

C. Glorieux, H. Struyf, S. Gendt, 2014 .

Enhancement of cavitation activity and particle removal with pulsed high frequency ultrasound and supersaturation.

C. Glorieux, M. Heyns, H. Struyf, 2013, Ultrasonics sonochemistry.

Organic and inorganic analysis with laser microprobe mass spectrometry. Part I: Instrumentation and methodology

H. Struyf, L. Vaeck, W. Roy, 1994 .

Influence of gas type on ultrasound cleaning efficiency

M. Heyns, Xiumei Xu, H. Struyf, 2010 .

An overview of wet deposition of micropollutants to the North Sea

H. Struyf, R. Grieken, 1993 .

Impact of LKD5109 TM low- k to cap/liner interfaces in single damascene process and performance

E. Sleeckx, F. Iacopi, K. Maex, 2003 .

Laser microprobe Fourier transform mass spectrometer with external ion source for organic and inorganic microanalysis

H. Struyf, L. Vaeck, W. Roy, 1993 .

Development of a laser microprobe fourier transform mass spectrometer with external ion source

H. Struyf, L. Vaeck, W. Roy, 1993 .

Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing

T. Conard, Z. Tokei, H. Struyf, 2017 .

Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

J. Geypen, H. Bender, C. Detavernier, 2015 .

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

G. Beyer, K. Maex, Z. Tokei, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Effect of top power on a low-k film during oxygen strip in a TCP etch chamber

D. Shamiryan, H. Struyf, E. Kunnen, 2010 .

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora® LK HM

G. Beyer, S. Demuynck, K. Croes, 2010 .

Chemical Mechanical Polishing of Chemical Vapor Deposited Co Films with Minimal Corrosion in the Cu/Co/Mn/SiCOH Patterned Structures

H. Struyf, S. Babu, L. Teugels, 2017 .

Chemical Mechanical Polishing and Planarization of Mn-Based Barrier/Ru Liner Films in Cu Interconnects for Advanced Metallization Nodes

H. Struyf, S. Babu, L. Teugels, 2017 .

Wet-chemical etching of metals for advanced semiconductor technology nodes: Ru etching in acidic Ce4+ solutions

H. Philipsen, H. Struyf, Q. Le, 2019, Electrochimica Acta.

Fourier transform laser microprobe mass spectrometry for the molecular identification of inorganic compounds

H. Struyf, L. Vaeck, R. Grieken, 1998 .

Partial Wetting of Aqueous Solutions on High Aspect Ratio Nanopillars with Hydrophilic Surface Finish

Xiumei Xu, K. Nafus, H. Struyf, 2014 .

Wetting Challenges in Cleaning of High Aspect Ratio Nano-Structures

H. Struyf, G. Vereecke, S. Armini, 2012 .

Organic and inorganic analysis with laser microprobe mass spectrometry. Part II: Applications

H. Struyf, L. Vaeck, W. Roy, 1994 .

Assessment of local analysis by fourier transform laser microprobe mass spectrometry with external ion source

H. Struyf, L. Vaeck, W. Roy, 1995 .

The Fourier‐transform laser microprobe mass spectrometer with external ion source as a tool for inorganic micro‐analysis

H. Struyf, L. Vaeck, W. Roy, 1994 .

Processing damage and electrical performance of porous dielectrics in narrow spaced interconnects

Karen Maex, Herbert Struyf, Michele Stucchi, 2004 .

Characterization of Modification of 193-nm Photoresist by HBr Plasma

P. Adriaensens, H. Struyf, R. Carleer, 2011 .

Polymer dielectric treatment using ultraviolet-ozone: A photoelectron spectroscopy and ellipsometric porosimetry study

K. Maex, H. Struyf, P. Louette, 2004 .

An environment friendly wet strip process for 193nm lithography patterning in BEOL applications

P. Adriaensens, H. Struyf, R. Carleer, 2013 .

Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films

F. Iacopi, K. Maex, M. Meuris, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Characterisation of JSR's spin-on hardmask FF-02

G. Beyer, H. Bender, F. Iacopi, 2003 .

Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109

E. Sleeckx, F. Iacopi, M. Maenhoudt, 2002 .

Optimization of etching and stripping chemistries for Z3MS/sup TM/ Low-k

G. Mannaert, D. Shamiryan, H. Struyf, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Effect of UV Irradiation on Modification and Subsequent Wet Removal of Model and Post-Etch Fluorocarbon Residues

T. Conard, H. Struyf, I. Vaesen, 2012 .

Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN

C. Detavernier, H. Struyf, J. Meersschaut, 2013 .

Integrated diffusion-recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials

G. Barkema, C. Maes, D. Shamiryan, 2011 .

Effect of Chemical Solutions and Surface Wettability on the Stability of Advanced Porous Low- k Materials

H. Struyf, G. Vereecke, Q. Le, 2011 .

Post patterning meso porosity creation: a potential solution for pore sealing

G. Beyer, S. Demuynck, F. Iacopi, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

Influence of surface tension on cavitation noise spectra and particle removal efficiency in high frequency ultrasound fields

H. Struyf, S. Gendt, P. Mertens, 2012 .

Etch process development for FLARETM for dual damascene architecture using a N2/O2 plasma

G. Beyer, K. Maex, H. Struyf, 1999 .

Critical issues in the integration of copper and low-k dielectrics

G. Beyer, K. Maex, M. Stucchi, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Low-k materials etch and strip optimization for sub 0.25 /spl mu/m technology

E. Rosseel, K. Maex, H. Struyf, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Integration of Cu and low- k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

G. Beyer, K. Maex, M. Stucchi, 2001 .

Investigation of the Evaporation and Wetting Mechanism of IPA-DIW Mixtures

H. Struyf, G. Vereecke, X. Xu, 2012 .

Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck

K. Devriendt, K. Sankaran, G. Pourtois, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).

Development of a Wet Silicon Removal Process for Replacement Metal Gate and Sacrificial Fin

A. Veloso, F. Sebaai, H. Struyf, 2011 .

Mechanism of Modification of Fluorocarbon Polymer by Ultraviolet Irradiation in Oxygen Atmosphere

C. Adelmann, A. Franquet, B. Beckhoff, 2013 .

Development of multi-stack dielectric wafer bonding

A. Jourdain, F. Inoue, Andy Miller, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Effect of the Surface/Water Chemistry on the Creation of Watermarks

H. Struyf, P. Mertens, N. Belmiloud, 2012 .

Dynamics of the Drying Defects Left by Residual Ultra-Pure Water Droplets on Silicon Substrate

Xiumei Xu, H. Struyf, P. Mertens, 2012 .

Chemical Characterization of Neo‐ceramic Powders by Time‐of‐flight and Fourier Transform Laser Microprobe Mass Spectrometry

H. Struyf, L. Vaeck, R. Gijbels, 1996 .

Capturing wetting states in nanopatterned silicon.

G. Pourtois, Xiumei Xu, Chang Chen, 2014, ACS nano.

Wet Chemical Cleaning of InP and InGaAs

T. Conard, R. Vos, H. Struyf, 2012 .

Desorption/Ionization of Inorganic Compounds in Fourier Transform Laser Microprobe Mass Spectrometry with External Ion Source

H. Struyf, L. Vaeck, R. Grieken, 1996 .

Evaluation and interpretation of bubble size distributions in pulsed megasonic fields

Christ Glorieux, Herbert Struyf, S. De Gendt, 2013 .

C2H4-Based Plasma-Assisted CD Shrink and Contact Patterning for RRAM Application

N. Jossart, M. Jurczak, J. Lisoni, 2010 .

Scaling the Ge Gate Stack: Toward Sub 1 nm EOT

M. Caymax, S. Sioncke, T. Conard, 2012 .

High aspect ratio via etch development for Cu nails in 3-D-stacked ICs

H. Struyf, W. Boullart, S. Vanhaelemeersch, 2008 .

Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces

F. Inoue, K. Vandersmissen, H. Philipsen, 2017 .

W2W permanent stacking for 3D system integration

Eric Beyne, Andy Miller, Herbert Struyf, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Role of Bath Composition in Electroless Cu Seeding on Co Liner for through-Si Vias

Herbert Struyf, Fumihiro Inoue, Stefaan Van Huylenbroeck, 2015 .

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent

Herbert Struyf, Fumihiro Inoue, Stefaan Van Huylenbroeck, 2014 .

Post-CMP Cleaners for Tungsten at Advanced Nodes

H. Struyf, L. Teugels, R. Lieten, 2016 .

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Tetsu Tanaka, Fumihiro Inoue, Herbert Struyf, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Atomic Layer Deposition of High-κ Dielectrics on Sulphur-Passivated Germanium

A. Franquet, M. Caymax, M. Heyns, 2011 .

The metal hard-mask approach for contact patterning

W. Boullart, D. Shamiryan, D. Goossens, 2009, International Conference on Micro- and Nano-Electronics.

Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

G. Beyer, S. Demuynck, K. Croes, 2009 .

Desorption—ionization of organic compounds studied by Fourier‐transform laser microprobe mass spectometry

H. Struyf, L. Vaeck, W. Roy, 1994 .

Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices

H. Struyf, Jin-Goo Park, Tae-Gon Kim, 2023, Materials Science in Semiconductor Processing.

Influence of environments on the footprint of particle contamination on EUV mask

Herbert Struyf, Marc Heyns, Stefan De Gendt, 2011, Advanced Lithography.

The Influence of Dissolved Carbon Dioxide on Cavitation Intensity in Ultrasound Cleaning Systems

H. Struyf, S. Gendt, P. Mertens, 2013 .

Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window

Tae Gon Kim, K. Wostyn, M. Heyns, 2012 .

Time-resolved monitoring of cavitation activity in megasonic cleaning systems.

C. Glorieux, M. Heyns, H. Struyf, 2012, The Review of scientific instruments.

Towards an understanding and control of cavitation activity in 1 MHz ultrasound fields.

C. Glorieux, M. Heyns, H. Struyf, 2013, Ultrasonics sonochemistry.

Integration of Single Damascene 85/85 nm L/S copper trenches in Black Diamond using 193 nm optical lithography with dipole illumination

M. Van Hove, S. Demuynck, K. Maex, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions

S. Decoster, K. Croes, I. Ciofi, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

Low Resistance Cu Vias for 24nm Pitch and Beyond

M. H. van der Veen, N. Jourdan, O. Pedreira, 2022, International Interconnect Technology Conference.

Barrier/liner stacks for scaling the Cu interconnect metallization

M. H. van der Veen, V. V. Gonzalez, K. Croes, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

F. Inoue, E. Beyne, Soon-Wook Kim, 2021, IEEE Electron Device Letters.

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

A. Attard, H. Struyf, R. Daily, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Si1-XGeX Selective Etchant for Gate-All-Around Transistors

H. Struyf, Y. Oniki, F. Holsteyns, 2021 .

Gate-last vs. gate-first technology for aggressively scaled EOT logic/RF CMOS

H. Bender, G. Eneman, N. Horiguchi, 2011, 2011 Symposium on VLSI Technology - Digest of Technical Papers.

Demonstration of scaled 0.099µm2 FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology

R. Rajagopalan, K. Ronse, S. Locorotondo, 2009, 2009 IEEE International Electron Devices Meeting (IEDM).