M. Majumder

发表

Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

B. Kaushik, M. Majumder, Narasimha Reddy Kukkam, 2014 .

Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area

N. D. Pandya, B. Kaushik, M. Majumder, 2012, IEEE Electron Device Letters.

Performance Analysis of Graphene Based Optical Interconnect at Nanoscale Technology

Manoj Kumar Majumder, Vijay Rao Kumbhare, Balkrishna Choubey, 2018, VDAT.

Analytical Study of Bundled MWCNT and Edged MLGNR Interconnects: Impact on Propagation Delay and Area

Manoj Kumar Majumder, Vijay Rao Kumbhare, C. Venkataiah, 2019, IEEE Transactions on Nanotechnology.

Crosstalk-centric designing using graphene based multi-line bus architecture

B. Kaushik, M. Majumder, 2017, 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL).

Time and Frequency Domain Analysis of MLGNR Interconnects

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Vobulapuram Ramesh Kumar, 2015, IEEE Transactions on Nanotechnology.

Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path

Brajesh Kumar Kaushik, Manoj Kumar Majumder, B. Kaushik, 2014 .

Comparison of propagation delay in single- and multi-layer graphene nanoribbon interconnects

S. K. Manhas, B. K. Kaushik, M. K. Majumder, 2012, 2012 5th International Conference on Computers and Devices for Communication (CODEC).

Optimized delay and power performances in multilayer graphene nanoribbon interconnects

B. Anand, B. K. Kaushik, M. K. Majumder, 2012, 2012 Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics.

Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Pankaj Kumar Das, 2015, J. Circuits Syst. Comput..

Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects

Brajesh Kumar Kaushik, B. Kaushik, S. Dasgupta, 2012, 2012 Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics.

Dynamic crosstalk effect in mixed cnt bundle interconnects

N. D. Pandya, B. Kaushik, M. Majumder, 2012 .

Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges

Vobulapuram Ramesh Kumar, B. Kaushik, M. Majumder, 2014, IEEE Nanotechnology Magazine.

Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2014, IEEE Transactions on Electromagnetic Compatibility.

Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation

S. K. Manhas, B. K. Kaushik, M. K. Majumder, 2012, 2012 5th International Conference on Computers and Devices for Communication (CODEC).

Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV

B. Kaushik, M. Majumder, Tanu Goyal, 2015 .

Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Vobulapuram Ramesh Kumar, 2015 .

Carbon Nanotube Based VLSI Interconnects

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2015 .

Dynamic crosstalk analysis of mixed multi-walled carbon nanotube bundle interconnects

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Pankaj Kumar Das, 2014 .

Effect of polymer liners in CNT based through silicon vias

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Novel Spatially Arranged Mixed Carbon Nanotube Bundle Interconnects - Impact on Delay and Power

B. Kaushik, M. Majumder, S. Manhas, 2013 .

Optimized delay and power performances for multi-walled CNT in global VLSI interconnects

B. Kaushik, M. Majumder, S. Manhas, 2012, 2012 5th International Conference on Computers and Devices for Communication (CODEC).

Signal Integrity Analysis for Diameter-Dependent Mixed Carbon Nanotube Bundle Interconnects

Vijay Rao Kumbhare, M. Majumder, P. Paltani, 2019, Information and Communication Technology for Sustainable Development.

Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

N. D. Pandya, B. Kaushik, M. Majumder, 2013 .

A Comparative Analysis of Single Walled CNT Bundle and Multi Walled CNT as Future Global VLSI Interconnects

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2011 .

Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon

Vijay Rao Kumbhare, M. Majumder, P. Paltani, 2019, IETE Journal of Research.

Relative stability of shielded top- and side-contact MLGNR interconnects

Vijay Rao Kumbhare, M. Majumder, P. Paltani, 2020, International Journal of Electronics Letters.

Comparison of crosstalk delay between single and bundled SWNT for global VLSI interconnects

Brajesh Kumar Kaushik, S. K. Manhas, Manoj Kumar Majumder, 2012, 2012 1st International Conference on Recent Advances in Information Technology (RAIT).

Analysis of top- and side-contact MLGNR interconnects: impact on crosstalk, stability, and electromigration

Vijay Rao Kumbhare, M. Majumder, P. Paltani, 2020 .

Performance comparison between single wall carbon nanotube bundle and multiwall carbon nanotube for global interconnects

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2011, 2011 International Conference on Emerging Trends in Networks and Computer Communications (ETNCC).

Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2018, IETE Journal of Research.

Through Silicon Vias: Materials, Models, Design, and Performance

Vobulapuram Ramesh Kumar, B. Kaushik, M. Majumder, 2016 .

Copper-Based Through Silicon Vias

Vobulapuram Ramesh Kumar, B. Kaushik, M. Majumder, 2016 .

Ligand-induced symmetry breaking and concomitant blueshift in the emission wavelength of an octahedral chromium complex

M. Majumder, Anirban Misra, Satadal Paul, 2018, Journal of Molecular Modeling.

A Low Voltage Discriminant Circuit for Pattern Recognition Exploiting the Asymmetrical Characteristics of Tunnel FET

Ramesh Vaddi, Subhendu Kumar Sahoo, Manoj Kumar Majumder, 2020, 2020 IEEE International Symposium on Circuits and Systems (ISCAS).

Strategic design of thiophene-fused nickel dithiolene derivatives for efficient NLO response.

M. Majumder, Anirban Misra, 2018, Physical chemistry chemical physics : PCCP.

New Set of Multicomponent Crystals as Efficient Heterogeneous Catalysts for the Synthesis of Cyclic Carbonates

M. Majumder, B. Bhattacharya, Sushobhan Ghosh, 2019, ACS omega.

Multifunctional Magnetic Materials of Organic Origin for Biomedical Applications: A Theoretical Study

M. Majumder, Anirban Misra, T. Goswami, 2018 .

Nanoscale Transistors

Vijay Rao Kumbhare, B. Kaushik, M. Majumder, 2020, Introduction to Microelectronics to Nanoelectronics.

Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power

M. Majumder, Maya Chandrakar, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effect of Polymer Liners in Different Via Shapes: Impact on Crosstalk Induced Delay

M. Majumder, Maya Chandrakar, 2021 .

Carbon Nanotube: Properties and Applications

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2015 .

Hardware Security Exploiting Post-CMOS Devices: Fundamental Device Characteristics, State-of-the-Art Countermeasures, Challenges and Roadmap

S. K. Sahoo, B. Kaushik, R. Vaddi, 2021, IEEE Circuits and Systems Magazine.

An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power

M. Majumder, S. Anand, Chopali Chanchal Sahu, 2021, Journal of Computational Electronics.

VLSI Scaling and Fabrication

Vijay Rao Kumbhare, B. Kaushik, M. Majumder, 2020 .

Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power

M. Majumder, Deepika Gupta, S. Chandrakar, 2022, Journal of Computational Electronics.

Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss

B. Kaushik, M. Majumder, S. Chandrakar, 2022, IEEE Open Journal of Nanotechnology.

Impact of TSV bump and redistribution layer on crosstalk delay and power loss

M. Majumder, Deepika Gupta, S. Chandrakar, 2023, Memories - Materials, Devices, Circuits and Systems.

Signal Transmission and Reflection Losses of Cylindrical and Tapered shaped TSV in 3D Integrated Circuits

M. Majumder, S. Chandrakar, Chopali Chanchal Sahu, 2020, International Symposium on Smart Electronic Systems.

Role of Through Silicon Via in 3D Integration: Impact on Delay and Power

Manoj Kumar Majumder, Deepika Gupta, Shivangi Chandrakar, 2020, J. Circuits Syst. Comput..

Carbon Nanotube Based 3-D Interconnects - A Reality or a Distant Dream

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Vobulapuram Ramesh Kumar, 2014, IEEE Circuits and Systems Magazine.

Performance analysis of graphene nanoribbon based vertical interconnects — Through silicon vias

M. Majumder, D. Goswami, 2016, 2016 International Conference on Computer, Electrical & Communication Engineering (ICCECE).

Compact AC Modeling of Eddy Current for Cylindrical Through Silicon Via

Vijay Rao Kumbhare, M. Majumder, Chopali Chanchal Sahu, 2021, IETE Journal of Research.

Impact of Polymer Liners on Crosstalk Induced Delay of Different TSV Shapes

M. Majumder, Maya Chandrakar, 2022, Journal of the Institution of Electronics and Telecommunication Engineers.

Analysis of crosstalk delay using mixed CNT bundle based through silicon vias

B. Kaushik, M. Majumder, S. Manhas, 2014, 2014 IEEE Radio Frequency Integrated Circuits Symposium.

Analysis of propagation delay for bundled SWCNT and bundled MWCNT in global VLSI interconnects

M. Majumder, 2017, 2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL).

Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Brajesh Kumar Kaushik, Archana Kumari, S. K. Manhas, 2014 .

Analysis of crosstalk delay and power dissipation in mixed CNT bundle interconnects

S. K. Manhas, B. K. Kaushik, M. K. Majumder, 2012, 2012 International Conference on Communications, Devices and Intelligent Systems (CODIS).

Analysis of crosstalk delay and area for MWNT and bundled SWNT in global VLSI interconnects

Brajesh Kumar Kaushik, S. K. Manhas, Manoj Kumar Majumder, 2012, Thirteenth International Symposium on Quality Electronic Design (ISQED).

Comparison of propagation delay characteristics for single-walled CNT bundle and multiwalled CNT in global VLSI interconnects

Brajesh Kumar Kaushik, B. Kaushik, M. Majumder, 2011, 2011 IEEE Recent Advances in Intelligent Computational Systems.

Propagation Delay Analysis for Bundled Multi-Walled CNT in Global VLSI Interconnects

Brajesh Kumar Kaushik, S. K. Manhas, Manoj Kumar Majumder, 2012, SocProS.

Performance Comparision of Mixed CNT Bundle in Global VLSI Interconnect

S. K. Manhas, B. K. Kaushik, M. K. Majumder, 2012, 2012 International Conference on Communication Systems and Network Technologies.

Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path

B. Kaushik, M. Majumder, K. N. Reddy, 2014, Journal of Computational Electronics.

Dynamic crosstalk effect in multi-layer graphene nanoribbon interconnects

B. Anand, S. K. Manhas, B. K. Kaushik, 2012, 2012 International Conference on Communications, Devices and Intelligent Systems (CODIS).

First-principles analysis of intercalated doped zigzag MLGNR: prospects for nano-interconnect application

Vijay Rao Kumbhare, M. Majumder, P. Paltani, 2022, Journal of Computational Electronics.

Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects

Brajesh Kumar Kaushik, Manoj Kumar Majumder, Pankaj Kumar Das, 2014, Microelectron. Reliab..

Performance analysis of mixed CNT bundle interconnects at 10 nm technology

Manoj Kumar Majumder, Vijay Rao Kumbhare, Punya Prasanna Paltani, 2020, IET Circuits Devices Syst..

Tunnel FET‐based ultralow‐power and hardware‐secure circuit design considering p‐i‐n forward leakage

Ramesh Vaddi, Subhendu Kumar Sahoo, Manoj Kumar Majumder, 2020, Int. J. Hum. Cap. Inf. Technol. Prof..

Analysis of Eddy Effect for Cu and CNT Bundle Based Through-Silicon Vias: Impact on Crosstalk and Power

M. Majumder, Chopali Chanchal Sahu, Shubham Anand, 2021 .