J. Pang

发表

Si Yun Chua, A. S. Nellian, J. Pang, 2018, 2018 International Conference on Intelligent Rail Transportation (ICIRT).

J. Pang, B. Xiong, C. C. Neo, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

J. Pang, B. Xiong, T. H. Low, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

F. Che, J. Pang, B. Xiong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

F. Che, J. Pang, Luhua Xu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

John Hock Lye Pang, J. Pang, 2011 .

F. X. Che, J. H. L. Pang, F. Che, 2013, IEEE Transactions on Device and Materials Reliability.

J. Pang, Yaofeng Sun, Fan Wei, 2006, 2006 8th Electronics Packaging Technology Conference.

F. Che, J. Pang, Luhua Xu, 2005, 2005 7th Electronic Packaging Technology Conference.

W.H. Zhu, C.K. Wang, A.Y.S. Sun, 2008, 2008 58th Electronic Components and Technology Conference.

F. Che, J. Pang, D.Y.R. Chong, 2006, 56th Electronic Components and Technology Conference 2006.

F. Che, J. Pang, J.H.L. Pang, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

J. Pang, Yaofeng Sun, Su Fei, 2006, 2006 8th Electronics Packaging Technology Conference.

J. Pang, F. L. Ng, C.K. Wong, 2005, 2005 7th Electronic Packaging Technology Conference.

J. Pang, Kaihwa Chew, 2005, 2005 7th Electronic Packaging Technology Conference.

John H. L. Pang, D.Y.R. Chong, J. Pang, 2001 .

J. Pang, C. Lee, A. Yeo, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

J. Pang, K. Hariram., K.P. Hariram, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

J. Pang, Luhua Xu, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

J. K. Spelt, D. Dillard, R. Adams, 2012 .

R. Mahajan, J. Pang, I. Dutta, 2012, Journal of Electronic Materials.

K. Tu, J. Pang, Luhua Xu, 2006, 2006 8th Electronics Packaging Technology Conference.

Luhua Xu, J. Pang, Luhua Xu, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

J. Pang, Luhua Xu, 2005, 2005 7th Electronic Packaging Technology Conference.

T.H. Low, J. Pang, T. H. Low, 2005, IEEE Transactions on Components and Packaging Technologies.

K. Tu, J. Pang, B. Xiong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

T.H. Low, J. Pang, T. H. Low, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

A. Yeo, John H. L. Pang, C. Lee, 2002, 4th Electronics Packaging Technology Conference, 2002..

Yaofeng Sun, John H. L. Pang, J. Pang, 2008, Microelectron. Reliab..

A. Yeo, J.H.L. Pang, C. Lee, 2006, IEEE Transactions on Components and Packaging Technologies.

A. Yeo, C. Lee, J. Pang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

John H. L. Pang, J. Pang, B. Xiong, 2004 .

K. Tu, J. Pang, Luhua Xu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

F. Che, J. Pang, J.H.L. Pang, 2006, 56th Electronic Components and Technology Conference 2006.

Suresh K. Sitaraman, S. Sitaraman, J. Pang, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Yaofeng Sun, Chee Khuen Wong, John H L Pang, 2005, Applied optics.

John H. L. Pang, F. X. Che, Desmond Y. R. Chong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

J. Pang, X.Q. Shi, X.R. Zhang, 2002, 4th Electronics Packaging Technology Conference, 2002..

J. Lau, J. Pang, K. E. Tan, 2008, 2008 10th Electronics Packaging Technology Conference.

N. Lee, J. Lau, J. Pang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

J.H.L. Pang, B.S. Xiong, J. Pang, 2005, IEEE Transactions on Components and Packaging Technologies.

Feng Yu, Lianxi Zheng, John H. L. Pang, 2012, Journal of Solid State Electrochemistry.

Yang Liu, J. Pang, K. S. Tsang, 2020, Fatigue & Fracture of Engineering Materials & Structures.

F.X. Che, J.H.L. Pang, T.H. Low, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Xunqing Shi, J. Pang, Yaofeng Sun, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

John H. L. Pang, F. X. Che, F. Che, 2015, Microelectron. Reliab..

F. Che, J. Pang, L.H. Xu, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

F. Che, J. Pang, J.H.L. Pang, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

J. Pang, Luhua Xu, 2005, Electronic Packaging Technology Conference.

F. Che, J. Pang, B. Xiong, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

J. Pang, Luhua Xu, K. E. Tan, 2008, 2008 2nd Electronics System-Integration Technology Conference.

J. Pang, K. Xu, E. Tan, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

K. Tu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

D.Y.R. Chong, B.K. Lim, T.H. Low, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Jinlong Wang, Hsin Jen Hoh, John Hock Lye Pang, 2018, 2018 International Conference on Intelligent Rail Transportation (ICIRT).

J. Pang, Patrick T. H. Low, B. Xiong, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

K. H. Low, Yuqi Wang, Kay Hiang Hoon, 2006, Microelectron. Reliab..