J. Pang
发表
F. Che,
J. Pang,
2012
.
J. Pang,
Y. Chew,
2016
.
F. Che,
J. Pang,
D.Y.R. Chong,
2005,
ECTC 2005.
J. Pang,
Yang Liu,
K. S. Tsang,
2021
.
F. Che,
J. Pang,
Luhua Xu,
2008
.
J. Pang,
Yaofeng Sun,
2010
.
Si Yun Chua,
A. S. Nellian,
J. Pang,
2018,
2018 International Conference on Intelligent Rail Transportation (ICIRT).
J. Pang,
B. Xiong,
C. C. Neo,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
J. Pang,
B. Xiong,
T. H. Low,
2004
.
S. L. Ngoh,
J. Pang,
Wei Zhou,
2004
.
J. Pang,
B. Xiong,
T. H. Low,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
F. Che,
J. Pang,
B. Xiong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
F. Che,
J. Pang,
Luhua Xu,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
John Hock Lye Pang,
J. Pang,
2011
.
F. X. Che,
J. H. L. Pang,
F. Che,
2013,
IEEE Transactions on Device and Materials Reliability.
Rao Tummala,
Jianmin Miao,
Ritwik Chatterjee,
2008
.
J. Pang,
Yaofeng Sun,
2006,
Nanotechnology.
J. Pang,
Yaofeng Sun,
W. Fan,
2007,
Nanotechnology.
J. Pang,
Yaofeng Sun,
Fan Wei,
2006,
2006 8th Electronics Packaging Technology Conference.
F. Che,
J. Pang,
Luhua Xu,
2005,
2005 7th Electronic Packaging Technology Conference.
John H. L. Pang,
J. Pang,
Yaofeng Sun,
2008
.
Guijun Bi,
John H. L. Pang,
Youxiang Chew,
2015
.
J. Pang,
2007
.
W.H. Zhu,
C.K. Wang,
A.Y.S. Sun,
2008,
2008 58th Electronic Components and Technology Conference.
F. Che,
J. Pang,
D.Y.R. Chong,
2006,
56th Electronic Components and Technology Conference 2006.
F. Che,
J. Pang,
D.Y.R. Chong,
2008,
IEEE Transactions on Advanced Packaging.
J. Pang,
2012
.
F. Che,
J. Pang,
J.H.L. Pang,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
J. Pang,
Yang Liu,
K. S. Tsang,
2020
.
J. Pang,
Praveen Kumar,
I. Dutta,
2014
.
J. Pang,
Yang Liu,
K. S. Tsang,
2020
.
J. Pang,
Yaofeng Sun,
Su Fei,
2006,
2006 8th Electronics Packaging Technology Conference.
Kun Zhou,
Venu Gopal Madhav Annamdas,
John H. L. Pang,
2014
.
J. Pang,
F. L. Ng,
C.K. Wong,
2005,
2005 7th Electronic Packaging Technology Conference.
J. Pang,
Kaihwa Chew,
2005,
2005 7th Electronic Packaging Technology Conference.
J. Pang,
Luhua Xu,
2006
.
Lin Li,
Jinyuan Zhou,
K. Leong,
2013,
Nanoscale.
Load-transfer efficiency and mechanical reliability of carbon nanotube fibers under low strain rates
Jinyuan Zhou,
Yani Zhang,
J. Pang,
2013
.
J. Pang,
K. S. Tsang,
H. Hoh,
2016
.
John H. L. Pang,
D.Y.R. Chong,
J. Pang,
2001
.
J. Pang,
2012
.
J. Pang,
C. Lee,
A. Yeo,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
J. Pang,
2012
.
J. Miao,
J. Pang,
Luhua Xu,
2007
.
J. Pang,
K. Hariram.,
K.P. Hariram,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
K. Tu,
J. Pang,
Luhua Xu,
2006
.
Luhua Xu,
J. Pang,
Luhua Xu,
2006,
56th Electronic Components and Technology Conference 2006.
J. Pang,
Luhua Xu,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
J. Pang,
E. Specht,
L. Walker,
2005
.
John H. L. Pang,
J. Pang,
B. Xiong,
2004
.
Narasimalu Srikanth,
Kun Zhou,
John Hock Lye Pang,
2016
.
J. Pang,
Yang Liu,
K. S. Tsang,
2021
.
Jianmin Miao,
John H. L. Pang,
Robert Preisser,
2007
.
J. Miao,
K. Tu,
J. Pang,
2008
.
J. K. Spelt,
D. Dillard,
R. Adams,
2012
.
John H. L. Pang,
X. R. Zhang,
J. Pang,
2006
.
John H. L. Pang,
X. Q. Shi,
X. R. Zhang,
2004,
Microelectron. Reliab..
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates:
I. Effects of Loading and Processing Conditions
R. Mahajan,
J. Pang,
I. Dutta,
2012,
Journal of Electronic Materials.
K. Tu,
J. Pang,
Luhua Xu,
2006,
2006 8th Electronics Packaging Technology Conference.
K. Tu,
J. Pang,
Luhua Xu,
2006
.
S. L. Ngoh,
J. Pang,
Wei Zhou,
2008
.
Chak-Kuen Wong,
John H. L. Pang,
J. W. Tew,
2008,
Microelectron. Reliab..
Luhua Xu,
J. Pang,
Luhua Xu,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
J. Pang,
Luhua Xu,
2006
.
J. Pang,
Luhua Xu,
2005,
2005 7th Electronic Packaging Technology Conference.
Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
T.H. Low,
J. Pang,
T. H. Low,
2005,
IEEE Transactions on Components and Packaging Technologies.
K. Tu,
J. Pang,
B. Xiong,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
T.H. Low,
J. Pang,
T. H. Low,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
John H. L. Pang,
Jae-Woong Nah,
King-Ning Tu,
2006
.
A. Yeo,
John H. L. Pang,
C. Lee,
2002,
4th Electronics Packaging Technology Conference, 2002..
Yaofeng Sun,
John H. L. Pang,
J. Pang,
2008,
Microelectron. Reliab..
A. Yeo,
J.H.L. Pang,
C. Lee,
2006,
IEEE Transactions on Components and Packaging Technologies.
A. Yeo,
C. Lee,
J. Pang,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Fook Fah Yap,
Z. P. Wang,
G. H. Lim,
2002
.
John H. L. Pang,
Kar Hwee Ang,
X. Q. Shi,
2001
.
John H. L. Pang,
D.Y.R. Chong,
J. Pang,
2001
.
Xunqing Shi,
John H. L. Pang,
Z. P. Wang,
2001
.
John H. L. Pang,
Z. P. Wang,
J. Pang,
2000
.
J. Pang,
J. Kaminski,
Zhi’En Eddie Tan,
2019,
Additive Manufacturing.
J. Pang,
2012
.
John H. L. Pang,
J. Pang,
B. Xiong,
2004
.
K. Tu,
J. Pang,
Luhua Xu,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
John H. L. Pang,
J. Pang,
T. I. Tan,
1998
.
F. Che,
J. Pang,
J.H.L. Pang,
2006,
56th Electronic Components and Technology Conference 2006.
J. Pang,
2012
.
Suresh K. Sitaraman,
S. Sitaraman,
J. Pang,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
J. Miao,
J. Pang,
Luhua Xu,
2007
.
J. Pang,
J. Kaminski,
Eddie Tan Zhi’En,
2021
.
J. Pang,
Y. Chew,
G. Bi,
2017
.
Yaofeng Sun,
Chee Khuen Wong,
John H L Pang,
2005,
Applied optics.
Yani Zhang,
J. Pang,
Gengzhi Sun,
2011,
Nanoscale.
A. S. Nellian,
J. Pang,
2022,
Virtual and Physical Prototyping.
John H. L. Pang,
F. X. Che,
Desmond Y. R. Chong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
J. Pang,
X.Q. Shi,
X.R. Zhang,
2002,
4th Electronics Packaging Technology Conference, 2002..
Jinyuan Zhou,
Yani Zhang,
J. Pang,
2012
.
J. Pang,
Gengzhi Sun,
Wei Huang,
2011
.
J. Lau,
J. Pang,
K. E. Tan,
2008,
2008 10th Electronics Packaging Technology Conference.
N. Lee,
J. Lau,
J. Pang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
J.H.L. Pang,
B.S. Xiong,
J. Pang,
2005,
IEEE Transactions on Components and Packaging Technologies.
Feng Yu,
Lianxi Zheng,
John H. L. Pang,
2012,
Journal of Solid State Electrochemistry.
Yang Liu,
J. Pang,
K. S. Tsang,
2020,
Fatigue & Fracture of Engineering Materials & Structures.
F.X. Che,
J.H.L. Pang,
T.H. Low,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Xunqing Shi,
J. Pang,
Yaofeng Sun,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Kun Zhou,
Venu Gopal Madhav Annamdas,
Hsin Jen Hoh,
2014
.
John H. L. Pang,
F. X. Che,
F. Che,
2015,
Microelectron. Reliab..
F. Che,
J. Pang,
L.H. Xu,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
J. Pang,
Gengzhi Sun,
Lianxi Zheng,
2013
.
J. Pang,
Gengzhi Sun,
Lianxi Zheng,
2014
.
John Hock Lye Pang,
Hsin Jen Hoh,
Kin Shun Tsang,
2016
.
F. Che,
J. Pang,
J.H.L. Pang,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
J. Pang,
Luhua Xu,
2005,
Electronic Packaging Technology Conference.
F. Che,
J. Pang,
B. Xiong,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Luhua Xu,
J. Pang,
Luhua Xu,
2006,
56th Electronic Components and Technology Conference 2006.
J. Pang,
Luhua Xu,
K. E. Tan,
2008,
2008 2nd Electronics System-Integration Technology Conference.
J. Pang,
K. Xu,
E. Tan,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
K. Tu,
J. Pang,
Luhua Xu,
2006,
56th Electronic Components and Technology Conference 2006.
D.Y.R. Chong,
B.K. Lim,
T.H. Low,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
Jinlong Wang,
Hsin Jen Hoh,
John Hock Lye Pang,
2018,
2018 International Conference on Intelligent Rail Transportation (ICIRT).
J. Pang,
Y. Chew,
H. Hoh,
2014,
Journal of Nondestructive Evaluation.
John H. L. Pang,
Fa Xing Che,
F. Che,
2007
.
J. Pang,
Patrick T. H. Low,
B. Xiong,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
K. H. Low,
Yuqi Wang,
Kay Hiang Hoon,
2006,
Microelectron. Reliab..