J. Nieto

Enabling technologies for 3D chip stacking

A. Toffoli, A. Roule, S. Maitrejean, 2008, 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

Ns laser annealing for junction activation preserving inter-tier interconnections stability within a 3D sequential integration

J. Hartmann, C. Fenouillet-Béranger, V. Lapras, 2016, 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition

Laurent Vandroux, C. Sabbione, L. Di Cioccio, 2012 .

Modelling of an industrial moving belt chemical vapour deposition reactor forming SiO2 films

J. Nieto, B. Caussat, L. Jeannerot, 2005 .

High density platinum nanocrystals for non-volatile memory applications

G. Molas, L. Vandroux, D. Lafond, 2008 .