R. Venkatesan

A 22nm high performance embedded DRAM SoC technology featuring tri-gate transistors and MIMCAP COB

R. Brain, N. Lindert, J. Steigerwald, 2013, 2013 Symposium on VLSI Technology.

ANALYSIS OF STANDBY LEAKAGE POWER REDUCTION BY V BODY CONTROL SYSTEM FOR CORE DEVICES

R. Venkatesan, A. Prasad, 2020 .

Impact of Width Variation of Global Inductive VLSI Interconnect Line

Noha H. Mahmoud, R. Chandel, J. Meindl, 2020 .

A physical model for the transient response of capacitively loaded distributed RLC interconnects

Jeffrey A. Davis, J. Meindl, R. Venkatesan, 2002, Proceedings 2002 Design Automation Conference (IEEE Cat. No.02CH37324).

Optimal global interconnects for GSI

Azad Naeemi, James D. Meindl, R. Venkatesan, 2003 .

Optimal n-tier multilevel interconnect architectures for gigascale integration (GSI)

Keith A. Bowman, James D. Meindl, Jeffrey A. Davis, 2001, IEEE Trans. Very Large Scale Integr. Syst..

Minimum power and area n-tier multilevel interconnect architectures using optimal repeater insertion

Keith A. Bowman, James D. Meindl, Jeffrey A. Davis, 2000, ISLPED'00: Proceedings of the 2000 International Symposium on Low Power Electronics and Design (Cat. No.00TH8514).

Interconnecting device opportunities for gigascale integration (GSI)

J.A. Davis, R. Venkatesan, J.D. Meindl, 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

Time delay, crosstalk and repeater insertion models for high performance SoC's

James D. Meindl, Jeffrey A. Davis, R. Venkatesan, 2002, 15th Annual IEEE International ASIC/SOC Conference.

Impact of three-dimensional architectures on interconnects in gigascale integration

Payman Zarkesh-Ha, James D. Meindl, Jeffrey A. Davis, 2001, IEEE Trans. Very Large Scale Integr. Syst..

Interconnect limits on gigascale integration (GSI) in the 21st century

Kaustav Banerjee, Krishna C. Saraswat, James D. Meindl, 2001, Proc. IEEE.

Direct print EUV patterning of tight pitch metal layers for Intel 18A process technology node

K. Fischer, R. Bigwood, N. Moumen, 2022, Photomask Technology.

Compact distributed RLC interconnect models - part IV: unified models for time delay, crosstalk, and repeater insertion

James D. Meindl, Jeffrey A. Davis, Jeffrey A. Davis, 2003 .