I. Kume

A novel cylinder-type MIM capacitor in porous low-k film (CAPL) for embedded DRAM with advanced CMOS logics

Y. Hayashi, H. Shirai, T. Hase, 2010, 2010 International Electron Devices Meeting.

Highly Reliable Thin MIM Capacitor on Metal (CoM) Structure with Vertical Scalability for Analog/RF Applications

Y. Hayashi, M. Furumiya, N. Inoue, 2007, 2007 IEEE International Electron Devices Meeting.

High Performance High-k MIM Capacitor with Plug-in Plate (PiP) for Power Delivery Line Hige-Speed MPUs

Y. Hayashi, T. Onodera, A. Tanabe, 2006, 2006 International Interconnect Technology Conference.

Surface Control of Bottom Electrode in Ultra-Thin SiN Metal–Insulator–Metal Decoupling Capacitors for High Speed Processors

Y. Hayashi, M. Furumiya, N. Inoue, 2007 .

Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-k Films

Y. Hayashi, N. Inoue, I. Kume, 2011 .

Precise Taper-Angle-Control of Via Holes for Reliable Scaled-Down Low-k/Cu Interconnects

Y. Hayashi, N. Inoue, I. Kume, 2010 .

Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-k Films

Y. Hayashi, N. Inoue, I. Kume, 2011 .