B. Xiong
发表
F. Che,
J. Pang,
D.Y.R. Chong,
2005,
ECTC 2005.
J. Pang,
B. Xiong,
C. C. Neo,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
J. Pang,
B. Xiong,
T. H. Low,
2004
.
J. Pang,
B. Xiong,
T. H. Low,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
F. Che,
J. Pang,
B. Xiong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
B. Xiong,
2005
.
F. Che,
J. Pang,
D.Y.R. Chong,
2008,
IEEE Transactions on Advanced Packaging.
John H. L. Pang,
J. Pang,
B. Xiong,
2004
.
K. Tu,
J. Pang,
B. Xiong,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
John H. L. Pang,
Jae-Woong Nah,
King-Ning Tu,
2006
.
John H. L. Pang,
J. Pang,
B. Xiong,
2004
.
W.H. Zhu,
F. Che,
B. Xiong,
2007,
2007 9th Electronics Packaging Technology Conference.
J.H.L. Pang,
B.S. Xiong,
J. Pang,
2005,
IEEE Transactions on Components and Packaging Technologies.
F. Che,
J. Pang,
B. Xiong,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
John H. L. Pang,
Fa Xing Che,
B. Xiong,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
J. Pang,
Patrick T. H. Low,
B. Xiong,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).