M. A. Currie

The behavior of solder pastes in stencil printing with vibrating squeegee

Nduka Nnamdi (Ndy) Ekere, D. He, M. A. Currie, 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C.

Solder paste printing process modelling map

Ndy Ekere, Samjid H. Mannan, M. A. Currie, 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.

Flow processes in solder paste during stencil printing for SMT assembly

Ndy Ekere, Samjid H. Mannan, I. Ismail, 1995 .

Understanding the process window for printing lead-free solder pastes

Ndy Ekere, T. A. Nguty, R. Durairaj, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Computer simulation of solder paste flow Part II: Flow out of a stencil aperture

Ndy Ekere, Samjid H. Mannan, I. Ismail, 1994 .

Computer simulation of solder paste flow Part I: Dense suspension theory

Nduka Nnamdi (Ndy) Ekere, M. A. Currie, S. Mannan, 1994 .