Sheng-Jye Hwang

发表

Enhanced hydrogen storage properties of MgH2 co-catalyzed with zirconium oxide and single-walled carbon nanotubes

Sheng-Jye Hwang, Y. Chuang, Chuang Yu, 2016 .

Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques

Sheng-Jye Hwang, A. Liu, David W. Wang, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA

Sheng-Jye Hwang, A. Liu, David W. Wang, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Design and fabrication of an adhesion force tester for the injection moulding process

Jian Yu Chen, Sheng-Jye Hwang, 2013 .

Development of an external-type microinjection molding module for thermoplastic polymer

Sheng-Jye Hwang, Huei-Huang Lee, Pei Chi Chang, 2007 .

Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

Sheng-Jye Hwang, Huei-Huang Lee, Shang-Shiuan Deng, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Huei-Huang Lee, Sheng-Jye Hwang, Shang-Shiuan Deng, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Simulation and experiments of fan-out wafer level package during encapsulation

Huei-Huang Lee, Sheng-Jye Hwang, Shang-Shiuan Deng, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Simulations of Process-Induced Warpage During IC Encapsulation Process

Sheng-Jye Hwang, S. Teng, 2007 .

Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method

Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, 2006, 2006 International Conference on Electronic Materials and Packaging.

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Huei-Huang Lee, Sheng-Jye Hwang, D. Huang, 2004, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..

Modeling a working coil coupled with magnetic flux concentrators for barrel induction heating in an injection molding machine

Sheng-Jye Hwang, Huy Tien Bui, Sheng-Jye Hwang, 2015 .

Design of an induction heating coil coupled with magnetic flux concentrators for barrel heating of an injection molding machine

Sheng-Jye Hwang, H. Bui, 2015 .

Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application

Chih Chung Hsu, R. Chang, Sheng-Jye Hwang, 2019 .

Volume Shrinkage Characterization of Underfill Materials

Huei-Huang Lee, Sheng-Jye Hwang, Shang-Shiuan Deng, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state

Sheng-Jye Hwang, Yi-San Chang, 2005 .

Structure deformation of leadframe in plastic encapsulation

Sheng-Jye Hwang, Jian-Yu Chen, Y.J. Lee, 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.

On a porous medium combustor for hydrogen flame stabilization and operation

Sheng-Jye Hwang, W. Lai, S. Su, 2014 .

Injection Molding of Microprobe Array Parts

Sheng-Jye Hwang, P. Chang, 2006 .

Experimental study of the heat recovery rate in a porous medium combustor under different hydrogen combustion modes

Sheng-Jye Hwang, W. Lai, S. Su, 2016 .

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Huei-Huang Lee, Sheng-Jye Hwang, B. Lin, 2018 .

Effects of compression distribution on PEMFC stacks using reformate as fuel

Sheng-Jye Hwang, W. Lai, Chen Yu Chen, 2012 .

Nonlinear Time-Dependent Thermoelastic Response in a Multilayered Anisotropic Medium

Sheng-Jye Hwang, Tei-Chen Chen, C. Chen, 2002 .

The Low Breaking Fiber Mechanism and Its Effect on the Behavior of the Melt Flow of Injection Molded Ultra-Long Glass Fiber Reinforced Polypropylene Composites

Sheng-Jye Hwang, Chao-Tsai Huang, Po-Wei Huang, 2021, Polymers.

Influence of low-fracture-fiber mechanism on fiber/melt-flow behavior and tensile properties of ultra-long-glass-fiber-reinforced polypropylene composites injection molding

Sheng-Jye Hwang, Chao-Tsai Huang, Po-Wei Huang, 2020 .

Development of an Online Quality Control System for Injection Molding Process

Sheng-Jye Hwang, H. Peng, Ming-Hong Tsai, 2022, Polymers.

Flow-induced Orientations of Fibers and Their Influences on Warpage and Mechanical Property in Injection Fiber Reinforced Plastic (FRP) Parts

Sheng-Jye Hwang, Chao-Tsai Huang, J. Chu, 2020, International Journal of Precision Engineering and Manufacturing-Green Technology.

Microstructure development analysis of long-glass-fiber-reinforced polypropylene in injection molded spiral-flow

Sheng-Jye Hwang, Feng-Jung Cheng, Ahmad Hafizh Ridho, 2022, Composites Part A: Applied Science and Manufacturing.

Correlation Between Fiber Orientation and Geometrical Shrinkage of Injected Parts Under the Influence of Flow-Fiber Coupling Effect

Sheng-Jye Hwang, Chao-Tsai Huang, Po-Wei Huang, 2022, International Journal of Precision Engineering and Manufacturing-Green Technology.

Influence of back pressure and geometry on microstructure of injection-molded long-glass-fiber-reinforced polypropylene ribbed plates

Sheng-Jye Hwang, Kuan-Hsun Wang, Chao-Tsai Huang, 2022, Polymer Testing.

Fabrication and Property Characterization of Long-Glass-Fiber-Reinforced Polypropylene Composites Processed Using a Three-Barrel Injection Molding Machine

Sheng-Jye Hwang, Chao-Tsai Huang, Po-Wei Huang, 2022, Polymers.

Configuration Synthesis of Novel Hybrid Transmission Systems Using a Combination of a Ravigneaux Gear Train and a Simple Planetary Gear Train

Sheng-Jye Hwang, Thanh-Tho Ho, Sheng-Jye Hwang, 2020, Energies.

Temperature prediction for system in package assembly during the reflow soldering process

Huei-Huang Lee, Sheng-Jye Hwang, Shang-Shiuan Deng, 2016 .

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

Huei-Huang Lee, Sheng-Jye Hwang, Yeong-Jyh Lin, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Application of surface treatments on releasing adhesion force during thermoplastic polyurethane injection molding process

Jian Yu Chen, Sheng-Jye Hwang, 2017 .

Synthesis and hydrogen absorption/desorption properties of Mg–Nb2O5-SWCNT/MWCNT nanocomposite prepared by reactive milling

Sheng-Jye Hwang, Y. Chuang, 2016 .

The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold

Sheng-Jye Hwang, D. Gan, S. Chiu, 2006 .

Warpage and residual stress analyses of post-mold cure process of IC packages

Hui Liu, Sheng-Jye Hwang, Yong Zeng, 2022, The International Journal of Advanced Manufacturing Technology.

Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi method

Sheng-Jye Hwang, Shiang-Yu Teng, Sheng-Jye Hwang, 2007, Microelectron. Reliab..

P-V-T-C equation for epoxy molding compound

Sheng-Jye Hwang, Sheng-Jye Hwang, Yi-San Chang, 2006, IEEE Transactions on Components and Packaging Technologies.

Study of warpage due to P-V-T-C relation of EMC in IC packaging

Sheng-Jye Hwang, Sheng-Jye Hwang, Li-Ching Hong, 2004 .

Study of P-V-T-C Relation of EMC

Huei-Huang Lee, Sheng-Jye Hwang, D. Huang, 2002 .

The influence of humidification and temperature differences between inlet gases on water transport through the membrane of a proton exchange membrane fuel cell

Wei-Hsiang Lai, Sheng-Jye Hwang, Sheng-Jye Hwang, 2015 .

Simulations and experiments of three-dimensional paddle shift for IC packaging

Sheng-Jye Hwang, Shiang-Yu Teng, Sheng-Jye Hwang, 2008 .

Three-Dimensional Paddle Shift Modeling for IC Packaging

Sheng-Jye Hwang, Sheng-Jye Hwang, Chien-Chang Pei, 2005 .

Design and fabrication of an IC encapsulation mold adhesion force tester

Sheng-Jye Hwang, Shyang-Jye Chang, 2003 .

True 3D numerical simulation for micro injection molding

Sheng-Jye Hwang, P. Chang, D. Chang, 2006 .

Molded underfill for flip chip package

Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Hwang, 2013, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser

Sheng-Jye Hwang, Minh-Sang Tran, Sheng-Jye Hwang, 2019, Applied Sciences.

Process optimization for directed energy deposition of SS316L components

Huei-Huang Lee, Sheng-Jye Hwang, Kuo-Tsai Wu, 2020, The International Journal of Advanced Manufacturing Technology.

Experimental investigation of infrared rapid surface heating for injection molding

Sheng-Jye Hwang, Sheng-Jye Hwang, P. Chang, 2006 .

Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating

Sheng-Jye Hwang, Huei-Huang Lee, Durn Yuan Huang, 2014 .

Design of induction heating module for uniform cavity surface heating

Huei-Huang Lee, Sheng-Jye Hwang, D. Huang, 2011 .

Development of barrel heating system in injection molding machine via induction heating

Sheng-Jye Hwang, Huy Tien Bui, Sheng-Jye Hwang, 2015 .