H. Miura

发表

Multi-stage dwell fatigue crack growth behaviors in a nickel-based superalloy at elevated temperature

Xian‐Cheng Zhang, S. Tu, Ji Wang, 2021, Engineering Fracture Mechanics.

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

H. Miura, K. Nakahira, Hironori Tago, 2012 .

Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures

H. Miura, Hironori Tago, Ken Suzuki, 2014 .

Cycle-dependent creep-fatigue deformation and life predictions in a nickel-based superalloy at elevated temperature

Shun‐Peng Zhu, Xian‐Cheng Zhang, S. Tu, 2021 .

Effect of external stress on polarization in ferroelectric thin films

Hideo Miura, Makoto Kitano, Tetsuo Kumazawa, 1998 .

Optically Flat Micromirror Using Stretched Membrane with Crystallization-Induced Stress

K. Hane, H. Miura, M. Sasaki, 2007, 2007 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics.

Simultaneous Realization of Stabilized Temperature Characteristics and Low-Voltage Driving of a Micromirror Using the Thin-Film Torsion Bar of Tensile Poly-Si

K. Hane, H. Miura, M. Sasaki, 2009, IEEE Journal of Selected Topics in Quantum Electronics.

Development of a Stress Sensor for Monitoring the Residual Stress in 3-D Stacked Chips

H. Miura, Ken Suzuki, K. Isobe, 2016 .

Local electronic function shift in LSI chips stacked three-dimensionally by area-arrayed bump structures caused by local deformation of the laminated chips

H. Miura, T. Sasaki, Y. Sato, 2008, 2008 58th Electronic Components and Technology Conference.

A crystal plasticity-based approach for creep-fatigue life prediction and damage evaluation in a nickel-based superalloy

Shun‐Peng Zhu, Xian‐Cheng Zhang, S. Tu, 2021 .

Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

H. Miura, A. Nishimura, H. Miura, 1987 .

A dual-scale modelling approach for creep-fatigue crack initiation life prediction of holed structure in a nickel-based superalloy

Xian‐Cheng Zhang, S. Tu, Run-Zi Wang, 2022, International Journal of Fatigue.

Semi-quantitative creep-fatigue damage analysis based on diffraction-based misorientation mapping and the correlation to macroscopic damage evolutions

Shun‐Peng Zhu, Xian‐Cheng Zhang, S. Tu, 2021 .

The effect of urea on microstructures of tin dioxide grown on Ti plate and its supercapacitor performance

H. Miura, Lv Jinlong, Y. Meng, 2017 .

First-principles study on the dilute Si in bcc Fe: Electronic and elastic properties up to 12.5 at.%Si

H. Miura, Ying Chen, Ken Suzuki, 2013 .

Quantitative evaluation of orbital hybridization in carbon nanotubes under radial deformation using π-orbital axis vector

H. Miura, Ken Suzuki, M. Ohnishi, 2015 .

Anisotropic strain-field-induced change of the electronic conductivity of graphene sheets and carbon nanotubes

H. Miura, Ken Suzuki, M. Ohnishi, 2012, EuroSimE 2012.

Mechanical Stress Design System For Semiconductor Devices

N. Okamoto, H. Miura, H. Ohta, 1993, [Proceedings] 1993 International Workshop on VLSI Process and Device Modeling (1993 VPAD).

Improvement of the Long-Term Reliability of TSV Interconnections Used in Three-Dimensional Stacked Modules

Hideo Miura, H. Miura, Ken Suzuki, 2014 .

Fabrication of 3D graphene foam for a highly conducting electrode

H. Miura, Ken Suzuki, Lv Jinlong, 2017 .

Effect of Phosphorus Doping on Crystallization-Induced Stress of Silicon Thin Films

H. Miura, A. Nishimura, 1996 .

Proposal of area-arrayed bump joint structures for minimizing residual stress in stacked silicon chips mounted by flip chip technology

H. Miura, T. Sasaki, N. Ueta, 2008, 2008 International Conference on Electronic Materials and Packaging.

Structural design of three-dimensionally stacked silicon chips for minimizing their residual stress

H. Miura, N. Ueta, 2007, 2007 International Conference on Electronic Materials and Packaging.

On multiaxial creep–fatigue considering the non-proportional loading effect: Constitutive modeling, deformation mechanism, and life prediction

Xian‐Cheng Zhang, Lei He, Ji Wang, 2022, International Journal of Plasticity.

Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/Amorphous-Silicon Multilayer Thin Films

C. Thompson, H. Miura, E. Ma, 1989 .

Change of the electronic conductivity of graphene nanoribbons and carbon nanotubes caused by a local deformation

H. Miura, Ken Suzuki, M. Ohnishi, 2013, 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

Flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes

H. Miura, Ken Suzuki, R. Osada, 2017, 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Change in electronic properties of carbon nanotubes caused by local distortion under axial compressive strain

H. Miura, Ken Suzuki, M. Ohnishi, 2015, 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

The effects of ball milling on microstructures of graphene/Ni composites and their catalytic activity for hydrogen evolution reaction

H. Miura, Zhuqing Wang, Lv Jinlong, 2017 .

Residual Stress Measurement in Silicon Substrates after Thermal Oxidation.

N. Okamoto, H. Miura, H. Sakata, 1992 .

Long-range topological correlations of real polycrystalline grains in two dimensions

H. Miura, Ying Chen, Guo-Quan Liu, 2014 .

Spatial distribution of state densities dominating strain sensitivity of carbon nanotubes

H. Miura, Ken Suzuki, M. Ohnishi, 2014, 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

Development of high-quality graphene nano-ribbon fabrication process for high sensitivity strain sensor

H. Miura, Ken Suzuki, R. Nakagawa, 2017, 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules

H. Miura, Kazuhiko Sakutani, K. Tamakawa, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Improvement of the interface integrity between a high-k dielectric film and a metal gate electrode by controlling point defects and residual stress

H. Miura, Ken Suzuki, Tatsuya Inoue, 2010, 2010 International Conference on Simulation of Semiconductor Processes and Devices.

Synthesis of CoMoO4@RGO nanocomposites as high-performance supercapacitor electrodes

H. Miura, Ken Suzuki, Lv Jinlong, 2017 .

Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging

H. Miura, Ken Suzuki, Yutaro Nakoshi, 2019, Japanese Journal of Applied Physics.

Disappearance of Martensitic Strengthened-Micro-Texture in Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures

H. Miura, Ken Suzuki, T. Shinozaki, 2018, Key Engineering Materials.

Influence of high-temperature creep stress on growth of thermally grown oxide in thermal barrier coatings

K. Ogawa, H. Miura, T. Shoji, 2009 .

Mechanical stress control in a VLSI-fabrication process: a method for obtaining the relation between stress levels and stress-induced failures

H. Miura, S. Ikeda, H. Ohta, 2003 .

A two-dimensional thermal oxidation simulator using visco-elastic stress analysis

H. Masuda, H. Miura, Tasuku Shimizu, 1989, International Technical Digest on Electron Devices Meeting.

Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures

H. Miura, Ken Suzuki, R. Furuya, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Synthesis of Ni 3 S 2 nanotube arrays on nickel foam by catalysis of thermal reduced graphene for hydrogen evolution reaction

H. Miura, Liang Tongxiang, Lv Jinlong, 2017 .

Stress-induced anisotropic diffusion of component elements in stacked thin-film multi-layer structures

K. Suzuki, H. Miura, M. Ochi, 2015 .

Effect of Alloying Elements on Creep and Fatigue Damage of Ni-Base Superalloy Caused by Strain-Induced Anisotropic Diffusion

H. Miura, Ken Suzuki, T. Sano, 2013 .

High Temperature Damage of Ni-Base Superalloy Caused by the Change of Microtexture due to the Strain-Induced Anisotropic Diffusion of Component Elements

H. Miura, Ken Suzuki, Y. Sasaki, 2011 .

Creep and Fatigue Damages of Ni-Base-Superalloy Caused by Strain-Induced Anisotropic Diffusion of Component Elements

H. Miura, Ken Suzuki, Tatsuya Inoue, 2009 .

Creep Damage Process of Ni-Base Superalloy Caused by Stress-Induced Anisotropic Atomic Diffusion

H. Miura, Ken Suzuki, Tatsuya Inoue, 2009 .

The effect of graphene coated nickel foam on the microstructures of NiO and their supercapacitor performance

H. Miura, Zhuqing Wang, Ken Suzuki, 2017 .

Facile synthesis of mesoporous NiO nanoflakes on graphene foam and its electrochemical properties for supercapacitor application

H. Miura, Zhuqing Wang, J. Lv, 2018 .

Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures

H. Miura, Ken Suzuki, Zhi Wang, 2018, 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Development of Evaluation Method for Estimating Stress-Induced Change in Drain Current in Deep-submicron MOSFETs *

S. Kamohara, H. Miura, A. Shimizu, 2007 .

Development of Evaluation Method for Estimating Stress-Induced Change in Drain Current in Deep-sub-micron MOSFETs

S. Kamohara, H. Miura, A. Shimizu, 2006 .

Facile synthesis of Co3O4@MnO2 core–shell nanocomposites for high-performance supercapacitor

H. Miura, Liang Tongxiang, Lv Jinlong, 2017 .

The impact of mechanical stress control on VLSI fabrication process

H. Miura, S. Ikeda, H. Ohta, 1996, International Electron Devices Meeting. Technical Digest.

Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

H. Miura, Ken Suzuki, Takeru Kato, 2016, 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries

H. Miura, Ken Suzuki, T. Shinozaki, 2016 .

Penta-graphene and phagraphene: thermal expansion, linear compressibility, and Poisson’s ratio

Lei Wang, H. Miura, Ying Chen, 2022, Journal of physics. Condensed matter : an Institute of Physics journal.

Comparing different microstructures of CoS formed on bare Ni foam and Ni foam coated graphene and their supercapacitors performance

H. Miura, Ken Suzuki, Liang Tongxiang, 2017 .

Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors

H. Miura, Y. Takeda, Ken Suzuki, 2010 .

Comparison of corrosion resistance of electrodeposited pure Ni and nanocrystalline Ni–Fe alloy in borate buffer solution

H. Miura, Ken Suzuki, Lv Jinlong, 2017 .

First-principles analysis of the inhibitive effect of interstitial carbon on an active dissolution of martensitic steel

H. Miura, A. Saengdeejing, T. Doi, 2020 .

Effect of Temperature on the Microscopic Appearance of the Fracture Surface of Alloy 690TT under SSRT Testing

H. Miura, T. Shoji, Zhanpeng Lu, 2006 .

Tunable uniaxial, area, and volume negative thermal expansion in quartz-like and diamond-like metal–organic frameworks

H. Miura, Ying Chen, Lei Wang, 2022, RSC advances.

Initial sequence and kinetics of silicide formation in cobalt/amorphous‐silicon multilayer thin films

C. Thompson, H. Miura, E. Ma, 1991 .

Coarsening of nanoscale (Ti,Mo)C precipitates in different ferritic matrixes

H. Miura, Wei Yu, J. Lv, 2018, Materials Characterization.

Initial Evolution of Cobalt Silicides in The Cobalt/Amorphous-Silicon Thin Film System

C. Thompson, H. Miura, E. Ma, 1991 .

Improvements in Thermal Stability of Cobalt-Silicide Films by Adding Nickel

H. Miura, T. Iwasaki, H. Ohta, 2008 .

Evaluation of fatigue and creep-fatigue damage levels on the basis of engineering damage mechanics approach

Xian‐Cheng Zhang, Run-Zi Wang, H. Miura, 2022, International Journal of Fatigue.

Superdense microbands strengthening of textured low alloy ferritic steel

H. Miura, Wei Yu, J. Lv, 2018 .

Effect of order-disorder transition on mechanical and magnetic properties of high silicon-iron alloys

H. Miura, K. Ohmori, K. Arai, 1984 .

CRYSTALLIZATION-INDUCED STRESS IN PHOSPHORUS-DOPED AMORPHOUS SILICON THIN FILMS

N. Okamoto, H. Miura, 1994 .

Crystallization-induced stress in silicon thin films

N. Okamoto, T. Kaga, H. Miura, 1992 .

113 Micro texture dependence of characteristics of electroplated Cu-thin-films for interconnections

H. Miura, Ken Suzuki, K. Tamakawa, 2008 .

Effect of package structure on the residual stress of silicon chips encapsulated in IC plastic packages.

H. Miura, A. Nishimura, S. Kawai, 1990 .

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

H. Miura, Ken Suzuki, Takeru Kato, 2017 .

Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope

H. Miura, Ken Suzuki, Kuniaki Akahoshi, 2009 .

Oxidation-involved life prediction and damage assessment under generalized creep-fatigue loading conditions based on engineering damage mechanics

Xian‐Cheng Zhang, Run-Zi Wang, H. Miura, 2022, Journal of Materials Research and Technology.

Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon

H. Miura, Ken Suzuki, Qinqiang Zhang, 2018, 2018 20th International Conference on Electronic Materials and Packaging (EMAP).

Temperature distribution in IC plastic packages in the reflow soldering process

H. Miura, W. Nakayama, A. Nishimura, 1988, InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88.

Effects of bottom topography and density stratification on variations of western boundary currents caused by periodic change in wind stress

N. Suginohara, H. Miura, 1984 .

Effects of bottom topography and density stratification on the formation of western boundary currents

N. Suginohara, H. Miura, 1980 .

A novel mesoporous NiMoO4@rGO nanostructure for supercapacitor applications

H. Miura, Lv Jinlong, Y. Meng, 2017 .

The plume-like Ni3S2 supercapacitor electrodes formed on nickel foam by catalysis of thermal reduced graphene oxide

H. Miura, Ken Suzuki, Liang Tongxiang, 2017 .

Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects

Hideo Miura, Tsutomu Murakawa, H. Miura, 2010 .

The effect of surface enriched chromium and grain refinement by ball milling on corrosion resistance of 316L stainless steel

H. Miura, Liang Tongxiang, Lv Jinlong, 2017 .

Thermal Stability of Pt Bottom Electrodes for Ferroelectric Capacitors

Yoshihisa Fujisaki, Hideo Miura, Yuichi Matsui, 1998 .

Graphene nano-ribbon-base highly sensitive pressure sensor using area-arrayed pillar structure

H. Miura, Ken Suzuki, Zhi Wang, 2017, 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Development of Highly Sensitive Strain Sensor Using Area-Arrayed Graphene Nanoribbons

H. Miura, Ken Suzuki, R. Nakagawa, 2021, Nanomaterials.

Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons

H. Miura, Ken Suzuki, Zhi Wang, 2018, 2018 20th International Conference on Electronic Materials and Packaging (EMAP).

Theoretical Study of the Edge Effect of Dumbbellshape Graphene Nanoribbon with a Dual Electronic Properties by First-principle Calculations

H. Miura, Ying Chen, Ken Suzuki, 2019, 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

Molecular dynamics analysis of adhesion strength of interfaces between thin films

H. Miura, Tomio Iwasaki, H. Miura, 2001 .

Measurement of the strength of a grain boundary in electroplated copper thin-film interconnections by using micro tensile-test

K. Suzuki, H. Miura, T. Nakanishi, 2016, 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

Minimization of residual stress in TSV interconnections by controlling their crystallinity

H. Miura, Ken Suzuki, Takeru Kato, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermal stability of electroplated copper thin-film interconnections

Ken Suzuki, Hideo Miura, Pornvitoo Rittinon, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Measurement of the strength of a grain boundary by using the combination of focused ion beam and electron back-scatter diffraction methods

K. Suzuki, H. Miura, T. Nakanishi, 2015 .

Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections

H. Miura, O. Asai, Ken Suzuki, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films

H. Miura, O. Asai, Ken Suzuki, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for Through-Silicon Vias

H. Miura, O. Asai, Ken Suzuki, 2013 .

Mechanical and electrical reliability of copper interconnections for 3DIC

Ken Suzuki, Hideo Miura, Naoki Saito, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

H. Miura, F. Endo, Ken Suzuki, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Effect of Copper-Tin Intermetallic Compound on Reliability of Fine Bump Joint Structures

H. Miura, Yuki Sato, Ken Suzuki, 2009 .

Effect of the lattice mismatch between copper thin-film interconnection and base material on the crystallinity of the interconnection

H. Miura, O. Asai, Ken Suzuki, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Improvement of the reliability of thin-film interconnections based on the control of the crystallinity of the thin films

H. Miura, O. Asai, Ken Suzuki, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Fatigue strength of electroplated copper thin films under uni-axial stress

K. Suzuki, H. Miura, K. Tamakawa, 2008, 2008 International Conference on Electronic Materials and Packaging.

Effect of Micro Texture of Electroplated Copper Thin Films on Their Mechanical Properties

Hideo Miura, Kinji Tamakawa, H. Miura, 2007 .

Crystallinity degradation caused by alloying elements diffusion during creep of ni-base superalloy

H. Miura, Ken Suzuki, T. Murakoshi, 2015 .

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

H. Miura, Ken Suzuki, M. Gotoh, 2015 .

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

H. Miura, Ken Suzuki, K. Tamakawa, 2015 .

Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test

H. Miura, Ken Suzuki, G. Zheng, 2017, 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections

Ken Suzuki, Hideo Miura, Jiatong Liu, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Quantitative Evaluation of the Crystallinity of Grain Boundaries in Polycrystalline Materials

H. Miura, Ken Suzuki, Naokazu Murata, 2012 .

Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices

H. Miura, Ken Suzuki, Ryota Mizuno, 2017, Impact.

J031053 Stress-Induced Migration of Electroplated Copper Thin Film Interconnections

H. Miura, Ken Suzuki, K. Tamakawa, 2011 .

Micro texture control for highly reliable copper fine bumps for 3D integration

H. Miura, Ken Suzuki, M. Gotoh, 2014, Impact.

OS20-1-4 A Novel Method for Evaluating the crystallinity of Grain Boundaries in Polycrystalline Materials

H. Miura, Ken Suzuki, Naokazu Murata, 2011 .

Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration

H. Miura, O. Asai, Ken Suzuki, 2013, 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

In-line monitoring of the change of residual stress in nano-scale transistors during their thin-film processing and packaging

H. Miura, Hironori Tago, Ken Suzuki, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

H. Miura, K. Nakahira, Hironori Tago, 2012 .

Evaluation of the change of the residual stress in nano-scale transistors during the deposition and fine patterning processes of thin films

H. Miura, Hironori Tago, Ken Suzuki, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Multi-scale measurement of the change of the residual stress in a silicon chip during manufacturing from thin-film processing to packaging

H. Miura, T. Sasaki, Ken Suzuki, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures

H. Miura, Yuki Sato, Ken Suzuki, 2009 .

Acceleration mechanism of the degradation of the lifetime of Ni‐based superalloys under creep‐fatigue loading at elevated temperatures

H. Miura, Ayumi Nakayama, Ken Suzuki, 2023, Fatigue & Fracture of Engineering Materials & Structures.

Initial Intergranular Cracking of Ni-Base Superalloys Due to the Degradation of the Crystallinity of Grain Boundaries Under Creep-Fatigue Loading

H. Miura, Ken Suzuki, Yifan Luo, 2020 .

Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections

Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Variation of the Strength and Fracture Mode of a Grain and a Grain Boundary in Polycrystalline Copper Thin Films

H. Miura, Ken Suzuki, Yifan Luo, 2018, Impact.

Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films

H. Miura, Ken Suzuki, Yifan Luo, 2018, International Conference on Simulation of Semiconductor Processes and Devices.

Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading

H. Miura, Ken Suzuki, Wataru Suzuki, 2018 .

Effect of the crystallinity on the long-term reliability of electroplated copper thin-film interconnections

H. Miura, Ken Suzuki, Takeru Kato, 2014, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Stress-induced migration of electroplated copper thin films used for 3D integration

H. Miura, Ken Suzuki, K. Tamakawa, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

H. Miura, O. Asai, Ken Suzuki, 2013 .

1503 Variation of the Strength of Electroplated Copper Thin Film Due to the Quality of its Gram Boundaries

H. Miura, Ken Suzuki, K. Tamakawa, 2010 .

Evaluation of fracture properties of annealed Fe–Si–B–Cr amorphous alloys using micro-tensile tests and blanking machinability

T. Kuriyagawa, H. Miura, Ken Suzuki, 2022, Materials Science and Engineering: A.

Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C

H. Miura, Ken Suzuki, Wataru Suzuki, 2019, Volume 9: Mechanics of Solids, Structures, and Fluids.

Microscopic Analysis of the Initiation of High-Temperature Damage of Ni-Based Heat-Resistant Alloy

H. Miura, Ken Suzuki, I. Nonaka, 2016 .

Creep-Damage-Induced Deterioration of the Strength of Ni-Base Superalloy due to the Change of its Microstructure

H. Miura, Ken Suzuki, H. Sakamoto, 2017 .

A methodology for locating strong motion arrays

H. Miura, Firdaus E. Udwadia, F. Udwadia, 1980 .

Structural effect of IC plastic package on residual stress in silicon chips

H. Miura, A. Nishimura, Sueo Kawai, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Control of the nucleation and quality of graphene grown by low-pressure chemical vapor deposition with acetylene

H. Miura, Ken Suzuki, Meng Yang, 2016 .

Quantum chemical molecular dynamics analysis of the effect of oxygen vacancies and strain on dielectric characteristic of hfo2-x films

K. Suzuki, H. Miura, Y. Ito, 2006, 2006 International Conference on Simulation of Semiconductor Processes and Devices.

Development of MWCNT-based strain sensor using flexible substrate

H. Miura, Ken Suzuki, K. Yumoto, 2016, 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

Influence of Oxygen Composition and Carbon Impurity on Electronic Reliability of HfO2 Thin Films

H. Miura, Ken Suzuki, 2013 .

Degradation of interface integrity between a high-k dielectric thin film and a gate electrode due to excess oxygen in the film

H. Miura, S. Samukawa, H. Yoshikawa, 2009, 2009 IEEE International Reliability Physics Symposium.

Effect of interface characteristics of W/HfO2±x on electronic reliability: Quantum chemical molecular dynamics study

H. Miura, T. Inoue, K. Suzuki, 2008, International Conference on Simulation of Semiconductor Processes and Devices.

Degradation mechanism of dielectric properties of HfO due to interaction of oxygen composition and strain

K. Suzuki, H. Miura, Y. Ito, 2007, International Symposium on VLSI Technology, Systems, and Applications.

Influence of oxygen vacancies and strain on electronic reliability of SiO2-x films

H. Miura, T. Shoji, Ken Suzuki, 2005 .

Influence of Intrinsic Defects and Strain on Electronic Reliability of Gate Oxide films

H. Miura, Ken Suzuki, Yuta Ito, 2006 .

Microstructure evaluation of cold-sprayed copper coatings by EBSD

H. Miura, Y. Watanabe, Y. Ichikawa, 2013 .

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

K. Ogawa, H. Miura, Y. Watanabe, 2013 .

Characterization of Cold-Sprayed Copper Coatings with New Evaluation Parameter of EBSD Method

H. Miura, Y. Watanabe, Y. Ichikawa, 2013 .

Stability and Thermodynamics Properties of CrFeNiCoMn/Pd High Entropy Alloys from First Principles

H. Miura, Ying Chen, Ken Suzuki, 2021, Journal of Phase Equilibria and Diffusion.

Effects of uniaxial compressive strain on the electronic-transport properties of zigzag carbon nanotubes

H. Miura, Ken Suzuki, M. Ohnishi, 2016, Nano Research.

Change of the Electronic Conductivity of CNTs and Graphene Sheets Caused by a Three-dimensional Strain Field

K. Suzuki, H. Miura, M. Ohnishi, 2012 .

Effect of the Local Strain Distribution on the Electronic Conductivity of Carbon Nanotubes

H. Kawakami, H. Miura, Ken Suzuki, 2013 .

A ball-indentation method to evaluate the critical stress for dislocation generation in a silicon substrate

H. Miura, M. Kitano, H. Ohta, 2001 .

Electronic properties and strain sensitivity of CVD-grown graphene with acetylene

H. Miura, Ken Suzuki, M. Ohnishi, 2016 .

Quantitative evaluations of improved surface integrity in ultrasonic rolling process for selective laser melted in-situ TiB2/Al composite

Ji Wang, Run-Zi Wang, H. Miura, 2022, Journal of Manufacturing Processes.

A Feasibility Study for Floating Offshore Windfarms in Japanese Waters

Izumi Ushiyama, Kazuichi Seki, Hideo Miura, 2004 .

Molecular Dynamics Study of Stress Effects on Raman Frequencies of Crystalline Silicon.

H. Miura, H. Moriya, T. Iwasaki, 1998 .

Highly sensitive strain sensor using carbon nanotube

H. Kawakami, H. Miura, Ken Suzuki, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Mechanical Stress Simulation for Highly Reliable Deep-Submicron Devices

Hideo Miura, Shuji Ikeda, H. Miura, 1999 .

Stability and structural properties of vacancy-ordered and -disordered ZrCx

H. Miura, Ying Chen, Ken Suzuki, 2021, RSC advances.

Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation

Run-Zi Wang, H. Miura, Shangdong Tu, 2023, International Journal of Fatigue.

A quasi in-situ study on the deformation mechanism in a 2.2Cr heat resistant steel

K. Suzuki, W. Yu, H. Miura, 2020, Materials Science and Engineering: A.

Hillock Growth at the Surface of Pt/TiN Electrodes for Ferroelectric Capacitors During Annealing in N 2 /O 2 Ambient

H. Miura, Y. Fujisaki, Y. Kumagai, 1997 .

Establishment of unified creep–fatigue life prediction under various temperatures and investigation of failure physical mechanism for Type 304 stainless steel

Xian‐Cheng Zhang, S. Tu, Run-Zi Wang, 2022, Fatigue & Fracture of Engineering Materials & Structures.

Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures

H. Miura, Yifan Luo, 2018, Volume 9: Mechanics of Solids, Structures, and Fluids.

Stress Analysis of Transistor Structures Considering the Internal Stress of Thin Films

Hideo Miura, Hiroyuki Ohta, Naoto Saito, 1996 .

The high speed collision induced ultrahard recrystallized pure Ni

H. Miura, Lv Jinlong, Wang Zhuqing, 2018, Materials Science and Engineering: A.

Crystallization-Induced Stress in Amorphous Silicon Thin Films.

N. Okamoto, T. Kaga, H. Miura, 1992 .

Stabilization of temperature characteristics of micromirror for low-voltage driving using thin film torsion bar of tensile poly-Si

K. Hane, H. Miura, M. Sasaki, 2008, 2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics.

Optically FlatMicromirror Designs Using Stretched Membrane with Crystallization-Induced Stress

K. Hane, H. Miura, M. Sasaki, 2007, LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings.

Molecular-Dynamics Analysis of Grain-Boundary Grooving in Interconnect Films with Underlayers

H. Miura, T. Iwasaki, 2003 .

Anisotropic strain-field-induced change of the electronic conductivity of graphene sheets and carbon nanotubes

K. Suzuki, H. Miura, M. Ohnishi, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Two-Dimensional Strain Distribution Sensor Using Carbon Nanotubes

H. Miura, Yusuke Suzuki, Ken Suzuki, 2012 .

Strain-Induced Change of Electronic Conductivity of Carbon Nanotubes

H. Miura, Yusuke Suzuki, M. Ohnishi, 2011 .

Development and application of the stress sensing test chip for IC plastic packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1987 .

Remote non-contact strain sensor using carbon nanotube-dispersed resin

H. Miura, Yusuke Suzuki, Ken Suzuki, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.