Thuy Dao

Scaling self-aligned contacts for 0.25-μm and below

Joe Cecil, Asanga H. Perera, Jim R. Pfiester, 1997, Advanced Lithography.

Characterization of onset tunneling voltage (Vonset) walkout in high-voltage deep trench isolation on SOI

Thuy Dao, Mu-Ling Ger, Jiangkai Zuo, 2015, 2015 International Conference on IC Design & Technology (ICICDT).

Transistor Leakage Components & Effect of Leakage on VCO performance

Thuy Dao, P. Dahl, L. Connell, 2007, 2007 IEEE International Conference on Integrated Circuit Design and Technology.

Comparative Spectra Analysis (CoSA): Spectra as Three-Dimensional Molecular Descriptors for the Prediction of Biological Activities

Thuy Dao, Edwin Kellenbach, Roberta Bursi, 1999, J. Chem. Inf. Comput. Sci..

STI fill effect on poly-poly comb IL

Thuy Dao, Todd Roggenbauer, Jim Colclasure, 2014, 2014 IEEE International Conference on IC Design & Technology.

In-line testing of antenna-type test structures for separation of sources of process-induced damage

Tomasz Brozek, Thuy Dao, Douglas R. Roberts, 1997, Advanced Lithography.

Evaluation of non-destructive etch depth measurement for through silicon vias

David Grant, Thuy Dao, David Marx, 2012, 2012 IEEE International Conference on IC Design & Technology.

Improved deep trench isolation breakdown voltage for SmartMOS

Gordon Boyd, Thuy Dao, Todd Roggenbauer, 2013, Proceedings of 2013 International Conference on IC Design & Technology (ICICDT).

Metal gate effects on a 32 nm metal gate resistor

Thuy Dao, L. Connell, IkSung Lim, 2008, 2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial.

Thermo-mechanical stress characterization of tungsten-fill through-silicon-via

Thuy Dao, Dina H. Triyoso, M. Petras, 2010, Proceedings of 2010 International Symposium on VLSI Design, Automation and Test.

Through Silicon Via stress characterization

Thuy Dao, Dina H. Triyoso, Michael Canonico, 2009, 2009 IEEE International Conference on IC Design and Technology.