J. Wood

Ka-band surface-mount directional coupler fabricated using micro-rectangular coaxial transmission lines

Sanjay Raman, Kenneth Vanhille, Zoya Popovic, 2008, 2008 IEEE MTT-S International Microwave Symposium Digest.

Liquid metal vertical interconnects for RF flip-chip assembly

Sanjay Raman, N. Scott Barker, N. S. Barker, 2009, 2009 IEEE MTT-S International Microwave Symposium Digest.

Vertical RF Transition With Mechanical Fit for 3-D Heterogeneous Integration

N. S. Barker, S. Raman, J. Wood, 2012, IEEE Transactions on Microwave Theory and Techniques.

Three-Dimensional Heterogeneous Integration for RF/Microwave Applications

J. Wood, 2008 .

Heterogeneous flip-chip assembly of a GaAs C-band power amplifier MMIC using liquid metal vertical interconnects

S. Raman, Parrish Ralston, J. Wood, 2010, 2010 IEEE MTT-S International Microwave Symposium.