B. Kwon

发表

L. Hwang, B. Kwon, Martin D. F. Wong, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

W. Jo, Jin‐Sang Kim, B. Kwon, 2016, Nature Communications.

P. Braun, W. King, B. Kwon, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

D. Jeong, S. Kim, Jin‐Sang Kim, 2015, Scientific Reports.

B. Kwon, S. Nahm, Jinsang Kim, 2015, Journal of Electronic Materials.

Sage J. B. Dunham, J. Sweedler, W. King, 2017, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Seong‐Hyeon Hong, S. Kim, Jin‐Sang Kim, 2014, ACS applied materials & interfaces.

Hyun Jae Kim, S. Kim, Chan Park, 2015, Journal of Electronic Materials.

J. Lee, B. Kwon, Honggon Kim, 2018, Journal of the Korean Physical Society.

N. Chawla, B. Kwon, Kenan Song, 2022, Advanced Functional Materials.

Thomas Foulkes, Tianyu Yang, William P. King, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Hyun Jae Kim, S. Kim, B. Kwon, 2016, Nature Communications.

Hyejin Ju, Hangeul Kim, Sangjoon Ahn, 2021, Nature Communications.

Rohit Bhargava, William P King, Beomjin Kwon, 2012, The Review of scientific instruments.

Leslie K. Hwang, Beomjin Kwon, Faizan Ejaz, 2020 .

R. Bhargava, W. King, B. Kwon, 2012, Ultramicroscopy.

A. Jacobi, W. King, B. Kwon, 2019, International Journal of Heat and Mass Transfer.

Hyun Jae Kim, S. Kim, B. Kwon, 2016, Nature Communications.

S. Kim, B. Kwon, S. Baek, 2014, The Review of scientific instruments.

Seong‐Hyeon Hong, C. Bark, B. Kwon, 2015, Scientific Reports.