C. Kallmayer

发表

Herbert Reichl, Christine Kallmayer, Rolf Aschenbrenner, 2005, Ninth IEEE International Symposium on Wearable Computers (ISWC'05).
Erik P. Simon, K. Lang, C. Kallmayer, 2011, 18th European Microelectronics & Packaging Conference.
H. Reichl, C. Kallmayer, E. Zakel, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.
H. Reichl, C. Kallmayer, R. Aschenbrenner, 2002, 4th Electronics Packaging Technology Conference, 2002..
H. Reichl, C. Kallmayer, R. Aschenbrenner, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
T. Linz, C. Kallmayer, R. Aschenbrenner, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.
H. Reichl, C. Kallmayer, E. Zakel, 1996, Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium.
M. Schneider-Ramelow, C. Kallmayer, M. Jakubowska, 2022, Advanced Engineering Materials.
H. Reichl, R. Aschenbrenner, S. Anhock, 1998, Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
Andreas Ostmann, Christine Kallmayer, Thomas Löher, 2019, 2019 IEEE CPMT Symposium Japan (ICSJ).
H. Reichl, R. Aschenbrenner, A. Ostmann, 2009, 2009 11th Electronics Packaging Technology Conference.
Christine Kallmayer, Thomas Löher, Andreas Ostmann, 2009, 2009 International Symposium on Wearable Computers.
Herbert Reichl, Christine Kallmayer, Rolf Aschenbrenner, 2006, International Workshop on Wearable and Implantable Body Sensor Networks (BSN'06).
Florian Schaller, Christine Kallmayer, Thomas Löher, 2018, 2018 13th International Congress Molded Interconnect Devices (MID).
Herbert Reichl, Christine Kallmayer, Barbara Pahl, 2004, Microelectron. Reliab..