H. Walter
发表
Erik P. Simon,
Torsten Linz,
Hans Walter,
2010,
3rd Electronics System Integration Technology Conference ESTC.
C. O’Mahony,
H. Walter,
Maryna Lishchynska,
2007,
IEEE Transactions on Advanced Packaging.
H. Walter,
A. Schubert,
B. Michel,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
B. Michel,
R. Dudek,
H. Walter,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
H. Reichl,
B. Michel,
R. Dudek,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
B. Michel,
R. Dudek,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
K. Lang,
H. Walter,
H. Oppermann,
2014
.
P. Hadley,
H. Walter,
Fabian Huber,
2020
.
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
P. Hadley,
H. Walter,
O. Wittler,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
B. Michel,
B. Wunderle,
H. Walter,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
K. Lang,
H. Walter,
O. Wittler,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
T. Linz,
C. Kallmayer,
R. Aschenbrenner,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
B. Wunderle,
H. Walter,
D. May,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
A. Schütze,
H. Walter,
K. Bewilogua,
1999
.
J. Bauer,
B. Wunderle,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
B. Wunderle,
R. Pufall,
B. Seiler,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
L. J. Ernst,
H. Pape,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel,
R. Dudek,
J. Auersperg,
2007,
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
M. Schneider-Ramelow,
H. Walter,
S. Huber,
2018,
Electronics System-integration Technology Conference.
B. Michel,
R. Dudek,
O. Wittler,
2006,
2006 8th Electronics Packaging Technology Conference.
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
H. Walter,
B. Michel,
D. Vogel,
2006
.
Olaf Wittler,
Dietmar Vogel,
Juergen Keller,
2005,
International Conference on Experimental Mechanics.
B. Wunderle,
B. Michel,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel,
R. Dudek,
H. Walter,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
H. Walter,
M. Müller,
W. Finger,
1992,
Journal of esthetic dentistry.
B. Michel,
J. Auersperg,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
M. Schneider-Ramelow,
H. Walter,
M. Zwanzig,
2019,
Materials.
K. Lang,
H. Walter,
O. Wittler,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Grams,
O. Wittler,
M. J. Wolf,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
M. Schneider-Ramelow,
H. Walter,
O. Wittler,
2019,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
M. Schneider-Ramelow,
H. Walter,
M. Schmidt,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Franz Faupel,
Herbert Reichl,
Bernd Michel,
2009,
2009 59th Electronic Components and Technology Conference.
J. Bauer,
B. Wunderle,
B. Michel,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Donato Di Vito,
H. Walter,
J. Vanhala,
2023,
Flexible and Printed Electronics.
Torsten Linz,
Malte von Krshiwoblozki,
Hans Walter,
2012
.
M. Schneider-Ramelow,
H. Walter,
O. Wittler,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Schneider-Ramelow,
H. Walter,
O. Wittler,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Klaus-Dieter Lang,
Olaf Wittler,
Matthias Hutter,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
R. Doring,
B. Seiler,
R. Dudek,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Schneider-Ramelow,
H. Walter,
O. Wittler,
2022,
Microelectronics Reliability.
K. Lang,
A. Middendorf,
H. Walter,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
B. Wunderle,
B. Michel,
O. Wittler,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
M. Schneider-Ramelow,
I. Ndip,
K. Lang,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
K. Lang,
H. Walter,
O. Wittler,
2013,
International Workshop on Thermal Investigations of ICs and Systems.
M. Kaynak,
M. Wietstruck,
R. Aschenbrenner,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
M. Schneider-Ramelow,
H. Walter,
O. Wittler,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Lang,
R. Aschenbrenner,
H. Walter,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
J. Bauer,
B. Wunderle,
B. Michel,
2008,
2008 2nd Electronics System-Integration Technology Conference.