H. Hsu

发表

Fabrication and characterization of passive devices on flexible substrates

Ching-Chien Yuan, Pei-Ju Lin, Hung-Ming Chang, 2008, 2008 International Conference on Electronic Materials and Packaging.

A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor

Ching-Chung Tseng, H. Hsu, S. Fu, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Advanced finite element model on Copper wire ball bonding

H. Hsu, S. Fu, Hong-Shen Chang, 2010, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

The Application of General Homotopy Method on Planar Four-Bar Path Synthesis

H. Hsu, S. Fu, Pei-Chieh Chin, 2016 .

Thermo-Hygro-Mechanical Design and Reliability Analysis for CMOS Image Sensor

H. Hsu, S. Fu, Hui-Yu Lee, 2008 .

Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

H. Hsu, S. Fu, Hong-Shen Chang, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

AnInvestigation onHeatAffected ZoneforAuWire/Cu Wire andAdvanced Finite Element Wirebonding Model

Y. Lai, H. Hsu, S. Fu, 2008 .

Reliability and thermal structure design for CMOS image sensor

Shen-Li Fu, Hsiang-Chen Hsu, Hui-Yu Lee, 2005, 2005 7th Electronic Packaging Technology Conference.

Thermal-Hygro-Mechanical Design for CMOS Image Sensor

H. Hsu, Hui-Yu Lee, Yu-Cha Hsu, 2007 .

Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching

H. Hsu, Shih-Jeh Wu, Wen-Fei Lin, 2016 .

Fabrication of Microfluidic Rapid Micromixer

H. Hsu, Hsi Chien Liu, Cheng-Jiun Han, 2011 .

Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective

H. Hsu, S. Fu, Wenchao Feng, 2013, Journal of Materials Science: Materials in Electronics.

Nanotribology Properties and Microscopic Interfacial Frictional Behavior Studied by Atomic Force Microscopy

H. Hsu, L. Chu, 2011 .

Observation of Transformation from Quantum Shuttle to Single-Electron Tunnel in Nanopillar Transistor

H. Hsu, Y. Wan, Yi-Feng Chen, 2009 .

Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3

Lih-shan Chen, H. Hsu, S. Fu, 2008 .

An investigation on micro-via drilling on ceramic substrates by a picosecond laser

H. Hsu, Shih-Jeh Wu, 2016, 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.

Numerical simulation of high power LED heat-dissipating system

Shih-Jeh Wu, Shen-Li Fu, Hsiang-Chen Hsu, 2014, Electronic Materials Letters.

Chaotic Responses on Gear Pair System Equipped with Journal Bearings under Turbulent Flow

Cai-Wan Chang-Jian, Hsiang-Chen Hsu, H. Hsu, 2012 .

Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material

H. Hsu, W. Hung, 2006 .

Microfluidic Synthesis of Microfibers for Magnetic-Responsive Controlled Drug Release and Cell Culture

H. Hsu, Keng-Shiang Huang, Chih-Hui Yang, 2012, PloS one.

Characterization of Hygroscopic Swelling and Thermo-Hygro-Mechanical Design on Electronic Package

H. Hsu, H.-C. Hsu, Y.-T. Hsu, 2009 .

Vibrations and mechanically-induced currents in nanopillars transistor

H. Hsu, Y. Wan, He Lin, 2008, 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Simulations of unsteady flows with adsorption equilibrium in dynamic axial compression column

H. Hsu, Jiann-Lin Chen, Chieh Tsai, 2020, Advances in Mechanical Engineering.

Nonlinear Analysis of Porous Squeeze Film Damper-Mounted a Rotor with Non-Linear Suspension and Roughness Effect

Hsiang Chen Hsu, Cai Wan Chang-Jian, Jiann Lin Chen, 2011 .

An Analytical Approach for Analysis of Slider Bearings with Non-Newtonian Lubricants

Li-Ming Chu, Hsiang-Chen Hsu, Jiann-Lin Chen, 2014 .

Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding

Y. Lai, H. Hsu, Chin-Yuan Hu, 2010 .

Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Yi-Shao Lai, Shen-Li Fu, Chang-Lin Yeh, 2008, 2008 10th Electronics Packaging Technology Conference.

A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package

H. Hsu, L. Chu, Shaw-Yuan Wang, 2018 .

Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process

Yi-Shao Lai, Shen-Li Fu, Chang-Lin Yeh, 2007, 2007 International Conference on Electronic Materials and Packaging.

Novel design and fabrication of a geometrical obstacle-embedded micromixer with notched wall

H. Hsu, Wenchao Feng, Shih-Jeh Wu, 2014 .

An Investigation on Mechanical Behavior on Pt-Coated Copper Wire from a Nanoscale Perspective

H. Hsu, C. Kuo, Gu-Haeng Lee, 2012 .

Electromigration analysis and electro-thermo-mechanical design for semiconductor package

H. Hsu, Hong-Shen Chang, Shen-Wen Ju, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Internal patterning of the glass backlight module for LCD panel by laser

H. Hsu, S. Fu, Shih-Jeh Wu, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).