Chiu Cheng-Hsin

Elastic contact versus indentation modeling of multi-layered materials

Huajian Gao, Gao Huajian, Chiu Cheng-Hsin, 1992 .

An investigation into curing behavior and kinetics of underfills for flip chip packages

Chiu Cheng-Hsin, Z. Fan, Ming Li, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Slightly curved or kinked cracks in anisotropic elastic solids

Gao Huajian, Gao Huajian, Chiu Cheng-Hsin, 1992 .

Stress singularities along a cycloid rough surface

Huajian Gao, Gao Huajian, Chiu Cheng-Hsin, 1993 .