I. Ahmad

发表

Modeling of 14 nm gate length n-Type MOSFET

P. Ker, Z. A. Noor Faizah, I. Ahmad, 2015, 2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM).

Threshold voltage and leakage current variability on process parameter in a 22nm PMOS Device

P. Menon, A. Zain, I. Ahmad, 2018 .

Statistical Modelling of 14nm N-types MOSFET

P. Menon, P. Ker, I. Ahmad, 2016 .

Process Parameter Optimisation for Minimum Leakage Current in a 22nm p-type MOSFET using Taguchi Method

P. Menon, A. Zain, I. Ahmad, 2016 .

Fabrication and characterization of a 0.14 μm CMOS device using ATHENA and ATLAS simulators

Burhanuddin Yeop Majlis, Ibrahim Ahmad, Yeap Kim Ho, 2006 .

Analyze and optimize the silicide thickness in 45nm CMOS technology using Taguchi method

Azami Zaharim, Fauziyah Salehuddin, Ibrahim Ahmad, 2010, 2010 IEEE International Conference on Semiconductor Electronics (ICSE2010).

Cobalt silicide and titanium silicide effects on nano devices

H. A. Elgomati, I. Ahmad, F. Salehuddin, 2011, 2011 IEEE Regional Symposium on Micro and Nano Electronics.

Influence of HALO and Source/Drain Implantation on Threshold Voltage in 45nm PMOS Device

Azami Zaharim, Fauziyah Salehuddin, Ibrahim Ahmad, 2011 .

Design and optimization of 22nm NMOS transistor

Sahbudin Shaari, Fauziyah Salehuddin, Burhanuddin Yeop Majlis, 2012 .

Scaling down of the 32 nm to 22 nm gate length NMOS transistor

H. A. Elgomati, P. S. Menon, B. Y. Majlis, 2012, 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).

Statistical process modelling for 32nm high-K/metal gate PMOS device

P. S. Menon, I. Ahmad, F. Salehuddin, 2014, 2014 IEEE International Conference on Semiconductor Electronics (ICSE2014).

Comparison of 2 k-Factorial and Taguchi Method for Optimization Approach in 32 nm NMOS Device

H. A. Elgomati, K. E. Kaharudin, A. Zaharim, 2013 .

Optimization of Process Parameters for Si Lateral PIN Photodiode

I. Ahmad, S. F. Abdullah, S. K. Tasirin, 2013 .

Modeling and simulation of InAs photodiode on electric field profile and dark current characteristics

I. Ahmad, J. Pasupuleti, P. S. Akma Roslan, 2016, 2016 IEEE International Conference on Semiconductor Electronics (ICSE).

Optimisation of Process Parameters for Lower Leakage Current in 22 nm n-type MOSFET Device using Taguchi Method

P. Menon, I. Ahmad, A. Maheran, 2014 .

Jurnal Teknologi Optimisation of Process Parameters for Lower Leakage Current in 22 nm n-type MOSFET Device using Taguchi Method

I. Ahmad, A. Maheran, S. Shaari, 2014 .

Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method

P. Menon, Z. A. Noor Faizah, I. Ahmad, 2015, 2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM).

Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan(Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader)

A. Zaharim, I. Ahmad, A. Jalar, 2011 .

Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

Foong Chee Seng, I. Ahmad, Victor Lim, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

M. Talib, I. Ahmad, I. Abdullah, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

WARPAGE AND WIRE SWEEP ANALYSIS OF QFN MOLDED ARRAY STRIP USING MODELING AND EXPERIMENTAL METHODS

N. N. Bachok, I. Ahmad, I. Abdullah, 2008 .

High performance silicon lateral PIN photodiode

P. Menon, I. Ahmad, S. F. Abdullah, 2013 .

Jsc and Voc Optimization of Perovskite Solar Cell with Interface Defect Layer Using Taguchi Method

I. Ahmad, A. H. Hasani, A. Zuhdi, 2018, 2018 IEEE International Conference on Semiconductor Electronics (ICSE).

Electrical characterization of different high-k dielectrics with tungsten silicide in vertical double gate nmos structure

K. E. Kaharudin, A. Zain, I. Ahmad, 2016 .

Apte Optimization of HALO Structure Effects in 45 nm p-type MOSFETs Device Using Taguchi Method

H. A. Elgomati, B. Majlis, A. Zaharim, 2011 .

Characterization of fabrication process noises for 32nm NMOS devices

H. A. Elgomati, B. Majlis, I. Ahmad, 2010, 2010 IEEE International Conference on Semiconductor Electronics (ICSE2010).

Growth kinetic and composition of the interfacial layer for RF sputtering Al2O3 layer on germanium

S. K. Sahari, B. Majlis, A. A. Hamzah, 2017 .

Performance Characterization of Schottky Tunneling Graphene Field Effect Transistor at 60 nm Gate Length

P. Menon, P. Ker, I. Ahmad, 2017 .

Study of Fiber Surface Treatment on Reinforcement/Matrix Interaction in Twaron Fiber/ENR Composites

I. Ahmad, Bangi Selangor, A. Jalar, 2005 .

Modelling of 14 NM Gate Length La 2 O 3-based n-Type Mosfet

P. Ker, I. Ahmad, S. Mah, 2016 .

Taguchi Optimization of a SiGe/Si Quantum Dot SOI-Based Lateral PIN Photodiode

P. Menon, I. Ahmad, S. F. Abdullah, 2014 .

Modelling and simulation single layer Anti-Reflective Coating of ZnO and ZnS for silicon solar cells using silvaco software

Huda Abdullah, Ibrahim Ahmad, H. Abdullah, 2009 .

Effect of wafer thinning methods towards fracture strength and topography of silicon die

Azman Jalar, Ibrahim Ahmad, Hoh Huey Jiun, 2006, Microelectron. Reliab..

Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

I. Ahmad, M. Harif, 2010, 2010 International Conference on Electronic Devices, Systems and Applications.

FCPBGA with SOP Pad Finishing A Study of Lead-Free Solder Ball Attach Improvement

I. Ahmad, E. P. Leng, W. T. Ling, 2008, 2008 10th Electronics Packaging Technology Conference.

Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing

I. Ahmad, E. P. Leng, W. T. Ling, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

Pb-free BGA Solder Joint Reliability Improvement with Sn3.5Ag Solder Alloy on Ni/Au Finish

I. Ahmad, Min Ding, A. Jalar, 2007, 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.

A Comparative Study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA Spheres on Ni/Au Finish

P. Su, I. Ahmad, P. Eu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A Study on Lead Free SnAgCu Solder System

Hoh Huey Jiun, I. Ahmad, Min Ding, 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

I. Ahmad, Min Ding, A. Haseeb, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

A Study of SnAgNiCo vs Sn3.8AgO. 7Cu C5 Lead Free Solder Alloy on Mechanical Strength of BGA Solder Joint

I. Ahmad, Min Ding, A. Haseeb, 2008, 2008 10th Electronics Packaging Technology Conference.

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

Azrul Azlan Hamzah, Burhanuddin Yeop Majlis, Ibrahim Ahmad, 2008, Sensors.

Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging

A. Zaharim, I. Ahmad, Z. Endut, 2006, 2006 8th Electronics Packaging Technology Conference.

REDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD

Muhammad Nizam Kamarudin, I. Abdullah, M. Z. M. Talib, 2008 .

Warpage and Wire Sweep Analysis of QFN Molded Strip using Experimental and Modeling Methods

I. Abdullah, I. Ahmad, I. Ahmad, 2007, 2007 9th Electronics Packaging Technology Conference.

Statistical Modelling of Semi-analytical 10nm Bilayer Graphene FET for higher ION/IOFF ratio using Taguchi Method

I. Ahmad, Z. A. Faizah, F. Salehuddin, 2018 .

Application of Taguchi Method in Optimization of Shallow PN Junction Formation

N. A. Rahman, N. Idris, A. Zain, 2013 .

Numerical Study of Fluid Flow and Heat Transfer in Microchannel Heat Sinks using Anisotropic Porous Media Approximation

I. Ahmad, S. Abdullah, F. Y. Lim, 2010 .

Simulation of the macroscopic heat transfer and flow behaviours in microchannel heat sinks using porous media approximation

B. Majlis, K. Sopian, I. Ahmad, 2009 .

A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

Foong Chee Seng, Ibrahim Ahmad, Victor Lim, 2009, Microelectron. Reliab..

NICKEL PLATED COPPER HEAT SPREADER SURFACE CHARACTERISTICS

I. Ahmad, Victor Lim, R. Rasid, 2008 .

Probing the Interplay between Mo Back Contact Layer Deposition Condition and MoSe2 Layer Formation at the CIGSe/Mo Hetero-Interface

I. Ahmad, P. Chelvanathan, S. F. Abdullah, 2023, Materials.

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

N. Amin, A. Jalar, I. Ahmad, 2008, 2008 IEEE International Conference on Semiconductor Electronics.

Effect of Chemical Bath Deposition Variables on the Properties of Zinc Sulfide Thin Films: A Review

C. F. Chau, I. Ahmad, A. Zuhdi, 2023, Molecules.

Characterization of Granular Type Capillary to Wire Bond Yield for UltraFine Pitch Large Quad Flat Package of Semiconductor Packaging

H. Abdullah, I. Ahmad, A. Jalar, 2010 .

Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

A. Jalar, I. Ahmad, G. Omar, 2006, IEEE Transactions on Electronics Packaging Manufacturing.

MECHANICAL PROPERTIES OF Sn 3 . 5 Ag AND Sn 3 . 8 Ag 0 . 7 Cu SOLDER BALLS FOR BGA PACKAGE

I. Ahmad, A. Jalar, E. P. Leng, 2008 .

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

B. Bais, I. Ahmad, G. Omar, 2011, 2011 IEEE Regional Symposium on Micro and Nano Electronics.

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

I. Ahmad, G. Omar, A. Isnin, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition

A. Jalar, I. Ahmad, G. Omar, 2004, 2004 IEEE International Conference on Semiconductor Electronics.

Simulation of fabrication process VDMOSFET transistor using Silvaco software

Zulkifli Mohd Nopiah, Huda Abdullah, Ibrahim Ahmad, 2009 .

A Feasible Alternative to FDSOI and FinFET: Optimization of W/La2O3/Si Planar PMOS with 14 nm Gate-Length

P. Ker, I. Ahmad, Noor Faizah Zainul Abidin, 2021, Materials.

Responsivity optimization of a MQW SOI-based lateral PIN photodiode using Taguchi's L27 orthogonal array

P. Menon, I. Ahmad, P. Apte, 2013, RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics.

High performance of a SOI-based lateral PIN photodiode using SiGe/Si multilayer quantum well

P. Menon, I. Ahmad, S. F. Abdullah, 2012, 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).

Vth and ILEAK Optimization using taguchi method at 32nm bilayer graphene PMOS

P. Menon, P. Ker, I. Ahmad, 2017 .

Process Characterization of 32nm Semi Analytical Bilayer Graphene-based MOSFET

Ibrahim Ahmad, Pin Jern Ker, P. S. Menon, 2016 .

The Effect of Electrical Properties by Texturing Surface on GaAs Solar Cell Efficiency

Ibrahim Ahmad, Huda Abdullah, A. Lennie, 2009 .

Optimization of input process parameters variation on threshold voltage in 45 nm NMOS device

Uda Hashim, Ibrahim Ahmad, Azami Zaharim, 2011 .

Optimization of HALO structure effects in 45nm p-type MOSFETs device using taguchi method

Burhanuddin Yeop Majlis, Ibrahim Ahmad, Azami Zaharim, 2011 .

Characterization and optimizations of silicide thickness in 45nm pMOS device

I. Ahmad, F. Salehuddin, A. Zaharim, 2010, 2010 International Conference on Electronic Devices, Systems and Applications.

Application of Taguchi Method in Optimization of Gate Oxide and Silicide Thickness for 45 nm NMOS Device

Azami Zaharim, Fauziyah Salehuddin, Ibrahim Ahmad, 2022 .

of Gate Oxide and Silicide Thickness for 45nm NMOS Device

Azami Zaharim, Fauziyah Salehuddin, Ibrahim Ahmad, 2022 .