Young-Ho Kim

发表

Surface Functionalization of Doped CVD Diamond via Covalent Bond. An XPS Study on the Formation of Surface-bound Quaternary Pyridinium Salt

A. Fujishima, B. Ohtani, Young-Ho Kim, 1998 .

The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu–0.5% Si) thin films

Sehoon Yoo, Yong-Chae Chung, Young-Ho Kim, 2001 .

Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature solders

Young-Ho Kim, U. Kang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding

Young-Ho Kim, Sun-Chul Kim, J. Lee, 2016, Journal of Materials Science: Materials in Electronics.

Polyimide on copper: The role of solvent in the formation of copper precipitates

S. P. Kowalczyk, Young-Ho Kim, G. Walker, 1988 .

Adhesion and interface investigation of polyimide on metals

C. Feger, S. P. Kowalczyk, Young-Ho Kim, 1988 .

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Young-Ho Kim, Min-Su Kim, Y. Ko, 2019, Journal of Materials Science: Materials in Electronics.

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Young-Ho Kim, Young-Ho Kim, Mu-Seob Shin, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

A study on the reliability of stencil printed solder bumps

Young-Ho Kim, Hoyong Jang, Sung-Min Seo, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Nonvolatile memory devices based on ZnO/polyimide nanocomposite sandwiched between two C60 layers

Tae Whan Kim, Young-Ho Kim, Fushan Li, 2009 .

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps

Young-Ho Kim, Chanho Shin, S. W. Ma, 2017 .

Synthesis of Cu or Cu 2 O-polyimide nanocomposites using Cu powders and their optical properties

Young-Ho Kim, S. Song, Myoung Jin Jung, 2014 .

Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties

Young-Ho Kim, S. Song, Myoung Jin Jung, 2014, Nanotechnology.

Charging effect of In2O3 nano-particles embedded in polyimide layer for application as non-volatile nano-floating gate memory

Dong Uk Lee, W. Cho, Young-Ho Kim, 2009 .

Optical Properties of Self-Assembled ZnO Nanocrystals Embedded in a p-Phenylene Biphenyltetracarboximide Polyimide Layer

Tae Whan Kim, Young-Ho Kim, D. Son, 2008 .

Nanoparticles fabricated by selective reaction of Fe100-xPtx alloy films during imidization of polyamic acid.

C. Yoon, Young-Ho Kim, C. Kim, 2005, Journal of colloid and interface science.

Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

Se-Hoon Park, Young-Ho Kim, Young-Ho Kim, 2012, Journal of nanoscience and nanotechnology.

Intermetallic growth between Sn-Ag-(Cu) solder and Ni

Young-Ho Kim, Seungtaek Yang, B. Hong, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Improvement of die shift by solder self-alignment for fan-out package process applications

Young-Ho Kim, Jae-Yong Park, Hwan-Pil Park, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal Properties

Jae-Yong Park, Young-Ho Kim, Hwan-Pil Park, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Improved Light Output of Photonic Crystal Light-Emitting Diode Fabricated by Anodized Aluminum Oxide Nano-Patterns

Joonmo Park, Young-Ho Kim, S. Ryu, 2008, IEEE Photonics Technology Letters.

Mechanical effects in peel adhesion test

Young-Ho Kim, Kyung-Suk Kim, Jung-ok Kim, 1989 .

Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma

N. Lee, Young-Ho Kim, H. Kim, 2005 .

Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma

Nae-Eung Lee, Young-Ho Kim, N. Lee, 2005 .

A peel adhesion study of electroless Cu layers on polymer substrates

Young-Ho Kim, Sun-Chul Kim, J. Lee, 2018 .

Electrochemical albumin sensing based on silicon nanowires modified by gold nanoparticles

C. Yoon, Young-Ho Kim, H. Kim, 2011 .

Enhanced ultraviolet emission from ZnO nanocrystals embedded in a hybrid polymer composite layer

Tae Whan Kim, Young-Ho Kim, D. Son, 2008 .

Improvement of the adhesion between polyaniline and commercial carbon paper by acid treatment and its application in supercapacitor electrodes

F. Calle, Young-Ho Kim, J. Yoo, 2016 .

A visible light-sensitive tungsten carbide/tungsten trioxde composite photocatalyst

Young-Ho Kim, K. Hashimoto, H. Irie, 2008 .

The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells

Young-Ho Kim, Byungwoo Park, Seunghoon Nam, 2013 .

Giant magnetoimpedence effects in micro‐patterned Co52Fe32B11Si5 amorphous ribbons

Young-Ho Kim, D. Chun, J. Han, 2007 .

Electrical characterization of nonvolatile memory with SnO2 nano-particle in polyimide dielectric layer

Dong Uk Lee, W. Cho, Jin‐Wook Shin, 2009 .

Optical properties of ZnO nanocrystals embedded in a polyimide layer

Tae Whan Kim, Young-Ho Kim, D. Son, 2007, 2007 Digest of papers Microprocesses and Nanotechnology.

Wetting characteristics of Cu–xZn layers for Sn–3.0Ag–0.5Cu solders

Ji-Hyun Lee, Young-Ho Kim, Ji Hyun Lee, 2013 .

Monolayered Ni–Co alloy nanoparticles template fabricated using a Ni nanoparticle array

Sungho Jin, C. Yoon, Young-Ho Kim, 2006 .

Monolayer CoPt magnetic nanoparticle array using multiple thin film depositions

Sungho Jin, C. Yoon, Young-Ho Kim, 2007 .

An Auger study on the interaction of Cu and Cr films with polyimide

Jin Yu, Young-Ho Kim, T. Chung, 1994 .

Formation and electric property measurement of nanosized patterns of tantalum oxide by current sensing atomic force microscope

Young-Ho Kim, K. Uosaki, Jian-wei Zhao, 2003 .

Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering

Young-Ho Kim, Duk-Seo Park, 2002 .

Fabrication of Nonvolatile Nano Floating Gate Memory with Self-Assembled Metal-Oxide Nano Particles Embedded in Polyimide

Dong Uk Lee, W. Cho, Young-Ho Kim, 2007, 2007 Digest of papers Microprocesses and Nanotechnology.

Synthesis of dual nanoparticles embedded in polyimide and their optical properties

Young-Ho Kim, J. Maeng, D. Choi, 2014, Electronic Materials Letters.

AFM study of surface phenomena based on C60 film growth

Young-Ho Kim, K. Hashimoto, A. Fujishima, 1998 .

A study of the curing behavior of polyamic acid coated on a Cu or Zn layer

Young-Ho Kim, Junro Yoon, Wenguo Dong, 2008 .

Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x = 0–43 wt%)

Young-Ho Kim, Jae-Yong Park, Young-Min Kim, 2016, Journal of Materials Science: Materials in Electronics.

An eco-friendly Cu-Zn wetting layer for highly reliable solder joints

Young-Ho Kim, Sun-Chul Kim, Young Min Kim, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process

Jae-Ho Lee, Young-Ho Kim, Sung-Ki Lee, 2007 .

A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology]

Jae-Ho Lee, Young-Ho Kim, Jae-Ho Lee, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer

Young-Ho Kim, Seunghyun Lee, Young-Ho Kim, 2005 .

A new solder wetting layer for Pb-free solders

Young-Ho Kim, Jin Soo Lee, Young-Min Kim, 2009 .

Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn−4.0Ag−0.5Cu and Cu−Zn Substrate

Young-Ho Kim, Young-Ho Kim, Young-Min Kim, 2010 .

Brittle Fracture Behavior of ENIG/Sn-Ag-Cu Solder Joint with pH of Ni-P Electroless Plating Solution

Young-Ho Kim, S. Yoo, Tae-Ik Lee, 2020 .

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Sehoon Yoo, Young-Ho Kim, Young-Ho Kim, 2017, Journal of Electronic Materials.

Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

Young-Ho Kim, Jae-Yong Park, Young Min Kim, 2015, Journal of Materials Science: Materials in Electronics.

A new Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application

Young Min Kim, Jin-Young Park, Young-Ho Kim, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

Young-Ho Kim, Young Min Kim, 2008, 2008 International Conference on Electronic Materials and Packaging.

The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization

Young-Ho Kim, U. Kang, 2004 .

Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

Young-Ho Kim, S. Yoo, Jae-Yong Park, 2019, Journal of Materials Science: Materials in Electronics.

Characteristics of the Interfacial Microstructure of Chip-on-Plastic Joints under Thermal Cycling and Aging Treatment

Young-Ho Kim, Zhi Gang Chen, 2007 .

Sputtered Ni–Zn under bump metallurgy (UBM) for Sn–Ag–Cu solders

Young-Ho Kim, Tae Jin Kim, Young-Min Kim, 2012 .

Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments

Young-Ho Kim, Se-Hoon Park, Key-one Ahn, 2017, Microelectron. Reliab..

A new COG technique using low temperature solder bumps for LCD driver IC packaging applications

Young-Ho Kim, U. Kang, 2004 .

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, 2010 .

Interfacial reactions between Sn–3.0Ag–0.5Cu solder and Cu–xZn (x = 0–35 wt%) or Cu–xZn–yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substrates

Min Young Choi, Young-Ho Kim, Young-Ho Kim, 2013 .

Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substrates

Young-Ho Kim, Won-Jong Lee, Tae Jin Kim, 2012 .

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Young-Ho Kim, Sungtae Kim, Sungtae Kim, 2010 .

Microstructure characterization of Sn-Ag solder joints between stud bumps and metal pads

Young-Ho Kim, Mu-Seob Shin, 2003 .

Current-assisted direct Cu/Cu joining

M. Suh, Nam-Seog Kim, Young-Ho Kim, 2015 .

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Young-Ho Kim, Key-one Ahn, Hwan-Pil Park, 2019, Journal of Materials Science: Materials in Electronics.

Low Temperature bonding Technology for Electronic Packaging

Young-Ho Kim, Sun-Chul Kim, 2012 .

Enhanced hardness in two-layer a-BON/nc-SiC coating prepared by plasma-assisted MOCVD and thermal MOCVD

Young-Ho Kim, D. Lim, H. Jee, 2005 .

Synthesis of γ-Fe2O3 nanoparticles embedded in polyimide

C. Yoon, Young-Ho Kim, Y. Chung, 2004 .

Phase transition behaviors of polyimide blends

Young-Ho Kim, Y. Bae, C. Ryu, 2000 .

Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF) ☆

Young-Ho Kim, Sun-Chul Kim, M. Hong, 2012 .

Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates

Young-Ho Kim, Sun-Chul Kim, D. Choi, 2016 .

Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film Substrates

Young-Ho Kim, Ji-Yeon Park, Key-one Ahn, 2013 .

Synthesis of carbon-encapsulated gold nanoparticles in polyimide matrix

C. Yoon, Young-Ho Kim, C. K. Kim, 2008 .

Formation and electrical bistability properties of ZnO nanoparticles embedded in polyimide nanocomposites sandwiched between two C60 layers

Tae Whan Kim, Young-Ho Kim, Fushan Li, 2008 .

Electrical characteristics of resistive switching memory with metal oxide nanoparticles on a graphene layer

Dong Uk Lee, W. Cho, Young-Ho Kim, 2013 .

The Study on Chip Surface Treatment for Embedded PCB

S. Jung, Young-Ho Kim, Se-Hoon Park, 2012 .

Direct deposition of size-tunable Au nanoparticles on silicon oxide nanowires.

C. Yoon, Young-Ho Kim, H. Kim, 2009, Journal of colloid and interface science.

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

Young-Ho Kim, Min-Su Kim, Y. Ko, 2020, Journal of Materials Science: Materials in Electronics.

Analysis of Improved Efficiency of InGaN Light‐Emitting Diode With Bottom Photonic Crystal Fabricated by Anodized Aluminum Oxidxe

Joonmo Park, Young-Ho Kim, S. Ryu, 2009 .

Drop-shock reliability improvement of embedded chip resistor packages through via structure modification

Young-Ho Kim, Se-Hoon Park, Jong Chul Park, 2016, Microelectron. Reliab..

Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding

Young-Ho Kim, S. Yoo, J. Lee, 2019, Microelectronic Engineering.

Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Young-Ho Kim, Young-Ho Kim, Sun-Chul Kim, 2013 .

Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint

Jae-Hoon Choi, Tae-Sung Oh, Young-Ho Kim, 2005 .

Surface-plasmon resonance of Ag nanoparticles in polyimide

C. Yoon, Young-Ho Kim, S. Lim, 2005 .

Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure

Dong Uk Lee, Eun Kyu Kim, Young-Ho Kim, 2011 .

Nano‐floating gate capacitor with SnO2 quantum dots distributed in polyimide dielectrics

Dong Uk Lee, Young-Ho Kim, K. Seo, 2009 .

Formation of Cu-based nanoparticles during imidization of PAA into PI in the various environments

Young-Ho Kim, Wenguo Dong, Jae-Youn Choi, 2008 .

Formation of Cu or CU2O nanoparticles embedded in a polyimide film for nanofloating gate memory

Young-Ho Kim, D. Choi, 2010, IEEE International Nanoelectronics Conference.

Formation and electrical properties of Ni1−xFex nanocrystals embedded in a polyimide layers for applications as nonvolatile flash memories

Tae Whan Kim, C. Yoon, Young-Ho Kim, 2005 .

Preparation of Tantalum Anodic Oxide Film in Citric Acid Solution - Evidence and Effects of Citrate Anion Incorporation

Young-Ho Kim, K. Uosaki, 2013 .

Facile synthesis of porous-carbon/LiFePO4 nanocomposites

Young-Ho Kim, Byungwoo Park, Yuhong Oh, 2012, Journal of Nanoparticle Research.

A new Cu-Zn solder wetting layer for improved impact reliability

Young-Ho Kim, Young Min Kim, C. Oh, 2009, 2009 59th Electronic Components and Technology Conference.

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering

Sung Woo Ma, Young-Ho Kim, Nam-Seog Kim, 2013, Journal of Materials Science: Materials in Electronics.

Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn alloy UBM

Young-Ho Kim, C. Oh, Hee-Ra Roh, 2007 .

Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate

Young-Ho Kim, Hee-Ra Roh, 2007, 2007 International Conference on Electronic Materials and Packaging.

Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

Young-Ho Kim, Young-Ho Kim, Tae Hyun Kim, 2004 .

Synthesis of iron oxide nanoparticles in a polyimide matrix.

Young-Ho Kim, C. S. Yoon, S. Lim, 2004, Journal of colloid and interface science.

Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process

Young-Ho Kim, Young-Ho Kim, Jeong-Gi Jin, 2004 .

Fabrication of copper nanoparticles in 6FDA-ODA polyimide film

Min Young Choi, Young-Ho Kim, D. Choi, 2011, 2011 IEEE Nanotechnology Materials and Devices Conference.

Mechanical and electrical stability of PEDOT:PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions

Jaegab Lee, Young-Ho Kim, Jiyoung Kim, 2015 .

Microstructural change and interfacial reactions of Pt/Ti thin films on SiNx/Si during annealing in various ambients

Young-Ho Kim, Dong-Chan Kim, Tae-Gon Lee, 1999 .

Electromagnetic Interference Shielding from the Back-Side Metallization of the Chip in Fan-Out Wafer Level Package

Young-Ho Kim, Key-one Ahn, B. Joung, 2021 .

Development of highly reliable flip-chip bonding technology using non-conductive adhesives (NCAs) for 20 μm pitch application

Ji-Hyun Lee, Young-Ho Kim, Sun-Chul Kim, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Development of low temperature Chip-on-Flex (COF) bonding process of 100°C

Young-Ho Kim, Sun-Chul Kim, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

Conductive Polypyrrole/Polyester Composite Fabrics for Heating Element

Young-Ho Kim, Jong-Hyeok Lee, EungJoon Lee, 2010 .

Characteristics of AZO electrode with high transmittance in near infrared range.

Joo-Hyung Kim, Young-Ho Kim, D. Jung, 2014, Journal of nanoscience and nanotechnology.